Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: A method and a device for preventing seeping liquid from entering equipment along a connecting line such as an electrical line or a pipe line are disclosed. The method is performed by using a liquid-insulating device surrounding a section of the connecting line to stop the liquid from crossing thereover to reach the equipment. The liquid-insulating device is made of a liquid-proof material, and preferably includes a guiding member to guide the liquid stopped thereby to flow away from the connecting line.

Abstract: The present invention relates to a wafer holding device comprising a rotatable base and a plurality of weighted-jaws pivotally coupled on the base. Each of the weighted-jaws is provided with a step portion, used to support and clamp the wafer, and a pendulum weight. The pendulum weight can be integrally formed or detachably hanged on the jaw, depending on the size of the wafer clamped. As the base is rotated at a predetermined velocity, the pendulum weights sway out of the axis of the base due to the centrifugal force generated by the rotation, thereby clamping the wafer in the step portions. The preferred embodiment of the present invention can further provide a stopper formed on the base and a spring connected between the base and each of the jaws so as to keep limit the movement of the jaws within predetermined range.

Abstract: An apparatus for supplying a liquid in a semiconductor manufacturing process includes a container storing the liquid therein, and having a gas inlet for introducing a gas and a liquid outlet for discharging the liquid pressurized by the gas, and a first filter connected to the liquid outlet of the container for removing an impurity of the liquid. The container is slopingly positioned so that the liquid outlet of the container is inclined downwardly to allow the liquid to be totally discharged therefrom. The first filter includes a plurality of plates extending outwardly form an inner surface of the first filter for allowing the liquid to be agitated therein, an outlet arranged at the bottom of the first filter for discharging a precipitated impurity, and a plurality of exhaust valves respectively arranged adjacent to the plates for allowing a gaseous impurity to be released therefrom.