Patents by Inventor Jui-Kun Lee

Jui-Kun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of polishing a lanthanide substrate
    Patent number: 6953532
    Abstract: The invention provides a method of polishing a substrate comprising a lanthanide-containing metal oxide material. The method comprises the steps of (i) providing a polishing system comprising (a) an abrasive, a polishing pad, or a combination thereof, (b) an acid, and (c) a liquid carrier, (ii) providing a substrate comprising a metal oxide layer, wherein the metal oxide layer comprises at least one lanthanide series element, and (iii) abrading at least a portion of the metal oxide layer with the polishing system to polish the substrate. The lanthanide-containing metal oxide material can be a lanthanide oxide, a doped lanthanide oxide, a lanthanide-doped metal oxide, a lanthanide perovskite, or any other suitable lanthanide-containing mixed metal oxide material, in particular those used as solid electrode and solid electrolyte materials in gas sensor and fuel cell devices.
    Type: Grant
    Filed: March 6, 2003
    Date of Patent: October 11, 2005
    Assignee: Cabot Microelectronics Corporation
    Inventors: Jui-Kun Lee, Ronald E. Myers
  • Global planarization method
    Patent number: 6884729
    Abstract: Methods for manufacturing substrates with difficult to polish features using reverse mask etching and chemical mechanical planarization techniques.
    Type: Grant
    Filed: July 11, 2002
    Date of Patent: April 26, 2005
    Assignee: Cabot Microelectronics Corporation
    Inventors: Jui-Kun Lee, Chris C. Yu, David G. Mikolas
  • Method of polishing a lanthanide substrate
    Publication number: 20040175949
    Abstract: The invention provides a method of polishing a substrate comprising a lanthanide-containing metal oxide material. The method comprises the steps of (i) providing a polishing system comprising (a) an abrasive, a polishing pad, or a combination thereof, (b) an acid, and (c) a liquid carrier, (ii) providing a substrate comprising a metal oxide layer, wherein the metal oxide layer comprises at least one lanthanide series element, and (iii) abrading at least a portion of the metal oxide layer with the polishing system to polish the substrate. The lanthanide-containing metal oxide material can be a lanthanide oxide, a doped lanthanide oxide, a lanthanide-doped metal oxide, a lanthanide perovskite, or any other suitable lanthanide-containing mixed metal oxide material, in particular those used as solid electrode and solid electrolyte materials in gas sensor and fuel cell devices.
    Type: Application
    Filed: March 6, 2003
    Publication date: September 9, 2004
    Applicant: Cabot Microelectronics Corporation
    Inventors: Jui-Kun Lee, Ronald E. Myers
  • Global planarization method
    Publication number: 20030151020
    Abstract: Methods for manufacturing substrates with difficult to polish features using reverse mask etching and chemical mechanical planarization techniques.
    Type: Application
    Filed: July 11, 2002
    Publication date: August 14, 2003
    Applicant: Cabot Microelectronics Corporation
    Inventors: Jui-Kun Lee, Chris C. Yu, David G. Mikolas