Abstract: A thin film resistor having a characteristic that an increase phenomenon of a resistance controlled at a high temperature is generated. The resistor is obtained by controlling its composition and manufacturing method so as to suppress an increase in the resistance of a Cr-Si resistor thin film due to deposition of chromium silicide at a high temperature. A sputtering target, which is used as a raw material for forming the thin film, is made from chromium silicide and silicon so that some chromium silicide is already formed immediately after deposition, and chromium oxide and silicon oxide are contained in the thin film so as to suppress the speed whereat chromium and silicon, which do not form silicide, form silicide by heating after deposition and to allow the above silicide formation to advance slowly.

Abstract: A laminated wiring conductor layer of a thermal printing head consists of common wiring connected to one end of a patterned heating resistor layer, and individual wirings connected to the other end of the patterned heating resistor layer. The individual wirings are separated from the common wiring by a predetermined interval. The laminated wiring conductor layer includes a plurality of conductor layers in which a first conductor layer exhibits excellent bonding to the heating resistor layer and cannot be readily soldered and hence prevents flow of a solder while a second conductor layer laminated on the first layer is easily soldered and less corrosive than aluminum.