Abstract: A wafer level testing method for RFID tags is disclosed. The method comprises: providing a semiconductor wafer having a plurality of RFID tag chips, wherein each of the RFID tag chips includes at least one detachable inductance and an embedded capacitance to form a resonant circuit; exposing the RFID tag chips to microwave energy, wherein the RFID tag chips send a plurality of wireless signals after a wireless power conversion; receiving the wireless signals and calculating a power level thereof; and comparing the power level to a predetermined power level to obtain the wafer yield.

Abstract: An embodiment including a radio frequency identification system/RFID transponder or tag, and the interface must be able to receive measuring signals from the analog measuring device(s) or sensor module(s). The radio frequency identification device and the interface are integrated as a single die. This single die is configured to not only transmit typical RFID signals, but also the indicative value from the analog measuring device(s) to the interrogator or reader, and then, becomes human readable value.

Abstract: Nowadays, RFID (radio frequency identification) products such as tags and readers become more and more popular. Therefore, the frequency band which they are operated in would get very crowded. Data fighting or collision among RFID products becomes an important issue. The invention is proposed to avoid data collision by using software program and hardware control in the RFID system.

Abstract: A non-volatile memory control circuit provides a simple source line/word line generator instead of a complicated decoder. The invention also includes a new design to reduce power consumption for many wireless applications with stable or unstable power source. The selectable multi-characteric global cell is one of advantages of the present invention.