Patents by Inventor Jukka Kyynarainen

Jukka Kyynarainen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11767218
    Abstract: According to an example aspect of the present invention, there is provided a MEMS pressure sensor, comprising: a sensor portion comprising a deformable membrane and a first volume, and a valve portion comprising a first output to a first side of the pressure sensor and a second output to a second side of the pressure sensor. The valve portion is operable to close the second output and open the first output to equalize pressure in the first volume with pressure at the first side of the pressure sensor for calibrating the sensor; and close the first output and open the second output to equalize pressure in the first volume with pressure at the second side of the pressure sensor for pressure measurement.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: September 26, 2023
    Assignee: Teknologian tutkimuskeskus VTT Oy
    Inventors: Tapio Pernu, Jukka Kyynäräinen, Jaakko Saarilahti
  • Publication number: 20220133200
    Abstract: In some embodiments, a system includes a first assembly, a second assembly, and a connecting member. The first assembly includes a first electrode and a first adhesive portion. The first assembly is configured to be coupled to a surface of a patient via the first adhesive portion. The second assembly includes a second electrode and a second adhesive portion. The second assembly is configured to be coupled to the surface of the patient via the second adhesive portion. The connecting member has a first end coupled to the first assembly and a second end coupled to the second assembly. The connecting member is configured to transition between a first configuration and a second configuration and may be configured to be coupled to the surface of the patient via a third adhesive portion in both the first configuration and the second configuration.
    Type: Application
    Filed: January 24, 2020
    Publication date: May 5, 2022
    Applicant: Otsuka Pharmaceutical Co., Ltd.
    Inventors: Tomi MATTILA, Kimmo JOKELAINEN, Samuli YRJÄNÄ, Colm MC CAFFREY, Mohammadhossein BEHFAR, Jukka KYYNÄRÄINEN, Arto RANTALA
  • Publication number: 20220048761
    Abstract: According to an example aspect of the present invention, there is provided a MEMS pressure sensor, comprising: a sensor portion comprising a deformable membrane and a first volume, and a valve portion comprising a first output to a first side of the pressure sensor and a second output to a second side of the pressure sensor. The valve portion is operable to close the second output and open the first output to equalize pressure in the first volume with pressure at the first side of the pressure sensor for calibrating the sensor; and close the first output and open the second output to equalize pressure in the first volume with pressure at the second side of the pressure sensor for pressure measurement.
    Type: Application
    Filed: September 12, 2019
    Publication date: February 17, 2022
    Inventors: Tapio Pernu, Jukka Kyynäräinen, Jaakko Saarilahti
  • Patent number: 8922098
    Abstract: A device (100) harvests energy from vibration and/or strain and utilizes both capacitive (102a, 102b) and piezoelectric elements (105). The principle of operation is out-of-plane capacitive harvester, where the bias voltage for the capacitive element is generated with a piezoelectric element (105). The device utilizes a thin dielectric film (104) between the capacitor plates (102a, 102b) maximizing the harvested energy and enabling the harvester operation in semi-contact mode so that short circuits are prevented. For example when utilized in a wheel or the like, the capacitor is closed and opened at every strike or every turn of a wheel being thus independent of the harvester's mechanical resonance frequency.
    Type: Grant
    Filed: October 8, 2010
    Date of Patent: December 30, 2014
    Assignees: VTI Technologies Oy, Toyota Motor Corporation
    Inventors: Anna-Maija Karkkainen, Jukka Kyynarainen, Leif Roschier, Heikki Kuisma
  • Publication number: 20120206017
    Abstract: A device (100) harvests energy from vibration and/or strain and utilises both capacitive (102a, 102b) and piezo-electric elements (105). The principle of operation is out-of-plane capacitive harvester, where the bias voltage for the capacitive element is generated with a piezoelectric element (105). The device utilizes a thin dielectric film (104) between the capacitor plates (102a, 102b) maximizing the harvested energy and enabling the harvester operation in semi-contact mode so that short circuits are prevented. For example when utilised in a wheel or the like, the capacitor is closed and opened at every strike or every turn of a wheel being thus independent of the harvester's mechanical resonance frequency.
    Type: Application
    Filed: October 8, 2010
    Publication date: August 16, 2012
    Applicants: TOYOTA MOTOR CORPORATION, VTI TECHNOLOGIES OY
    Inventors: Anna-Maija Karkkainen, Jukka Kyynarainen, Leif Roschier, Heikki Kuisma
  • Patent number: 7808254
    Abstract: A micromechanical sensor for measuring millimetric wave or microwave power, which sensor comprises a wave line for conducting the millimetric or microwave power and a part arranged to move and a fixed electrode, in such a way that the capacitance (C) between the part that is arranged to move and the fixed electrode couples to the wave power advancing in the wave line. According to the invention, the capacitance (C) between the part that is arranged to move and the fixed electrode is divided into at least two portions (C/n), which are located at a distance from each other, in such a way that the wave power advancing in the wave line couples to the portions (C/n) of the capacitance (C) consecutively and experiences the inductive load between the portions (C/n) of the capacitance (C). Thus the frequency band of the sensor can be substantially broadened and the reflective coefficient can be kept reasonably small.
    Type: Grant
    Filed: May 8, 2009
    Date of Patent: October 5, 2010
    Inventors: Heikki Seppa, Jukka Kyynarainen
  • Publication number: 20090219036
    Abstract: A micromechanical sensor for measuring millimetric wave or microwave power, which sensor comprises a wave line for conducting the millimetric or microwave power and a part arranged to move and a fixed electrode, in such a way that the capacitance (C) between the part that is arranged to move and the fixed electrode couples to the wave power advancing in the wave line. According to the invention, the capacitance (C) between the part that is arranged to move and the fixed electrode is divided into at least two portions (C/n), which are located at a distance from each other, in such a way that the wave power advancing in the wave line couples to the portions (C/n) of the capacitance (C) consecutively and experiences the inductive load between the portions (C/n) of the capacitance (C). Thus the frequency band of the sensor can be substantially broadened and the reflective coefficient can be kept reasonably small.
    Type: Application
    Filed: May 8, 2009
    Publication date: September 3, 2009
    Inventors: Heikki Seppa, Jukka Kyynarainen
  • Patent number: 7548074
    Abstract: A micromechanical sensor for measuring millimetric wave or microwave power, which sensor includes a wave line for conducting the millimetric or microwave power and a moving part and a fixed electrode, in such a way that the capacitance (C) between the moving part and the fixed electrode couples to the wave power advancing in the wave line. According to the invention, the capacitance (C) between the moving part and the fixed electrode is divided into at least two portions (C/n), which are located at a distance from each other, in such a way that the wave power advancing in the wave line couples to the portions (C/n) of the capacitance (C) consecutively and experiences the inductive load between the portions (C/n) of the capacitance (C). Thus the frequency band of the sensor can be substantially broadened and the reflective coefficient can be kept reasonably small.
    Type: Grant
    Filed: June 16, 2005
    Date of Patent: June 16, 2009
    Inventors: Heikki Seppä, Jukka Kyynäräinen
  • Publication number: 20080068031
    Abstract: A micromechanical sensor for measuring millimetric wave or microwave power, which sensor comprises a wave line for conducting the millimetric or microwave power and a part arranged to move and a fixed electrode, in such a way that the capacitance (C) between the part that is arranged to move and the fixed electrode couples to the wave power advancing in the wave line. According to the invention, the capacitance (C) between the part that is arranged to move and the fixed electrode is divided into at least two portions (C/n), which are located at a distance from each other, in such a way that the wave power advancing in the wave line couples to the portions (C/n) of the capacitance (C) consecutively and experiences the inductive load between the portions (C/n) of the capacitance (C). Thus the frequency band of the sensor can be substantially broadened and the reflective coefficient can be kept reasonably small.
    Type: Application
    Filed: June 16, 2005
    Publication date: March 20, 2008
    Applicant: Valtion Teknillinen Tutkimuskeskus
    Inventors: Heikki Seppa, Jukka Kyynarainen