Patents by Inventor Jukka Kyynarainen
Jukka Kyynarainen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11767218Abstract: According to an example aspect of the present invention, there is provided a MEMS pressure sensor, comprising: a sensor portion comprising a deformable membrane and a first volume, and a valve portion comprising a first output to a first side of the pressure sensor and a second output to a second side of the pressure sensor. The valve portion is operable to close the second output and open the first output to equalize pressure in the first volume with pressure at the first side of the pressure sensor for calibrating the sensor; and close the first output and open the second output to equalize pressure in the first volume with pressure at the second side of the pressure sensor for pressure measurement.Type: GrantFiled: September 12, 2019Date of Patent: September 26, 2023Assignee: Teknologian tutkimuskeskus VTT OyInventors: Tapio Pernu, Jukka Kyynäräinen, Jaakko Saarilahti
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Publication number: 20220133200Abstract: In some embodiments, a system includes a first assembly, a second assembly, and a connecting member. The first assembly includes a first electrode and a first adhesive portion. The first assembly is configured to be coupled to a surface of a patient via the first adhesive portion. The second assembly includes a second electrode and a second adhesive portion. The second assembly is configured to be coupled to the surface of the patient via the second adhesive portion. The connecting member has a first end coupled to the first assembly and a second end coupled to the second assembly. The connecting member is configured to transition between a first configuration and a second configuration and may be configured to be coupled to the surface of the patient via a third adhesive portion in both the first configuration and the second configuration.Type: ApplicationFiled: January 24, 2020Publication date: May 5, 2022Applicant: Otsuka Pharmaceutical Co., Ltd.Inventors: Tomi MATTILA, Kimmo JOKELAINEN, Samuli YRJÄNÄ, Colm MC CAFFREY, Mohammadhossein BEHFAR, Jukka KYYNÄRÄINEN, Arto RANTALA
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Publication number: 20220048761Abstract: According to an example aspect of the present invention, there is provided a MEMS pressure sensor, comprising: a sensor portion comprising a deformable membrane and a first volume, and a valve portion comprising a first output to a first side of the pressure sensor and a second output to a second side of the pressure sensor. The valve portion is operable to close the second output and open the first output to equalize pressure in the first volume with pressure at the first side of the pressure sensor for calibrating the sensor; and close the first output and open the second output to equalize pressure in the first volume with pressure at the second side of the pressure sensor for pressure measurement.Type: ApplicationFiled: September 12, 2019Publication date: February 17, 2022Inventors: Tapio Pernu, Jukka Kyynäräinen, Jaakko Saarilahti
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Patent number: 8922098Abstract: A device (100) harvests energy from vibration and/or strain and utilizes both capacitive (102a, 102b) and piezoelectric elements (105). The principle of operation is out-of-plane capacitive harvester, where the bias voltage for the capacitive element is generated with a piezoelectric element (105). The device utilizes a thin dielectric film (104) between the capacitor plates (102a, 102b) maximizing the harvested energy and enabling the harvester operation in semi-contact mode so that short circuits are prevented. For example when utilized in a wheel or the like, the capacitor is closed and opened at every strike or every turn of a wheel being thus independent of the harvester's mechanical resonance frequency.Type: GrantFiled: October 8, 2010Date of Patent: December 30, 2014Assignees: VTI Technologies Oy, Toyota Motor CorporationInventors: Anna-Maija Karkkainen, Jukka Kyynarainen, Leif Roschier, Heikki Kuisma
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Publication number: 20120206017Abstract: A device (100) harvests energy from vibration and/or strain and utilises both capacitive (102a, 102b) and piezo-electric elements (105). The principle of operation is out-of-plane capacitive harvester, where the bias voltage for the capacitive element is generated with a piezoelectric element (105). The device utilizes a thin dielectric film (104) between the capacitor plates (102a, 102b) maximizing the harvested energy and enabling the harvester operation in semi-contact mode so that short circuits are prevented. For example when utilised in a wheel or the like, the capacitor is closed and opened at every strike or every turn of a wheel being thus independent of the harvester's mechanical resonance frequency.Type: ApplicationFiled: October 8, 2010Publication date: August 16, 2012Applicants: TOYOTA MOTOR CORPORATION, VTI TECHNOLOGIES OYInventors: Anna-Maija Karkkainen, Jukka Kyynarainen, Leif Roschier, Heikki Kuisma
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Patent number: 7808254Abstract: A micromechanical sensor for measuring millimetric wave or microwave power, which sensor comprises a wave line for conducting the millimetric or microwave power and a part arranged to move and a fixed electrode, in such a way that the capacitance (C) between the part that is arranged to move and the fixed electrode couples to the wave power advancing in the wave line. According to the invention, the capacitance (C) between the part that is arranged to move and the fixed electrode is divided into at least two portions (C/n), which are located at a distance from each other, in such a way that the wave power advancing in the wave line couples to the portions (C/n) of the capacitance (C) consecutively and experiences the inductive load between the portions (C/n) of the capacitance (C). Thus the frequency band of the sensor can be substantially broadened and the reflective coefficient can be kept reasonably small.Type: GrantFiled: May 8, 2009Date of Patent: October 5, 2010Inventors: Heikki Seppa, Jukka Kyynarainen
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Publication number: 20090219036Abstract: A micromechanical sensor for measuring millimetric wave or microwave power, which sensor comprises a wave line for conducting the millimetric or microwave power and a part arranged to move and a fixed electrode, in such a way that the capacitance (C) between the part that is arranged to move and the fixed electrode couples to the wave power advancing in the wave line. According to the invention, the capacitance (C) between the part that is arranged to move and the fixed electrode is divided into at least two portions (C/n), which are located at a distance from each other, in such a way that the wave power advancing in the wave line couples to the portions (C/n) of the capacitance (C) consecutively and experiences the inductive load between the portions (C/n) of the capacitance (C). Thus the frequency band of the sensor can be substantially broadened and the reflective coefficient can be kept reasonably small.Type: ApplicationFiled: May 8, 2009Publication date: September 3, 2009Inventors: Heikki Seppa, Jukka Kyynarainen
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Patent number: 7548074Abstract: A micromechanical sensor for measuring millimetric wave or microwave power, which sensor includes a wave line for conducting the millimetric or microwave power and a moving part and a fixed electrode, in such a way that the capacitance (C) between the moving part and the fixed electrode couples to the wave power advancing in the wave line. According to the invention, the capacitance (C) between the moving part and the fixed electrode is divided into at least two portions (C/n), which are located at a distance from each other, in such a way that the wave power advancing in the wave line couples to the portions (C/n) of the capacitance (C) consecutively and experiences the inductive load between the portions (C/n) of the capacitance (C). Thus the frequency band of the sensor can be substantially broadened and the reflective coefficient can be kept reasonably small.Type: GrantFiled: June 16, 2005Date of Patent: June 16, 2009Inventors: Heikki Seppä, Jukka Kyynäräinen
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Publication number: 20080068031Abstract: A micromechanical sensor for measuring millimetric wave or microwave power, which sensor comprises a wave line for conducting the millimetric or microwave power and a part arranged to move and a fixed electrode, in such a way that the capacitance (C) between the part that is arranged to move and the fixed electrode couples to the wave power advancing in the wave line. According to the invention, the capacitance (C) between the part that is arranged to move and the fixed electrode is divided into at least two portions (C/n), which are located at a distance from each other, in such a way that the wave power advancing in the wave line couples to the portions (C/n) of the capacitance (C) consecutively and experiences the inductive load between the portions (C/n) of the capacitance (C). Thus the frequency band of the sensor can be substantially broadened and the reflective coefficient can be kept reasonably small.Type: ApplicationFiled: June 16, 2005Publication date: March 20, 2008Applicant: Valtion Teknillinen TutkimuskeskusInventors: Heikki Seppa, Jukka Kyynarainen