Patents by Inventor Juli A. Abdala

Juli A. Abdala has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and arrangement for reduced thermal stress between substrates
    Patent number: 8390126
    Abstract: A module (20) can include a first substrate (12) comprised of a first material, at least a second substrate (22) comprised of at least a second material, selectively applied solder (14) of a first composition residing between the first substrate and at least the second substrate, and selectively applied solder (16) of at least a second composition residing between the first substrate and at least the second substrate. Preferably, no crack will exist in the module as a result of a reflow process of the solder due to the CTE mismatch between the first and second substrates. The different selectively applied solder compositions can have different melting points and can be solder balls, solder paste, solder preform or any other known form of solder.
    Type: Grant
    Filed: October 3, 2003
    Date of Patent: March 5, 2013
    Assignee: Motorola Mobility LLC
    Inventors: Vahid Goudarzi, Juli A. Abdala, Gulten Goudarzi