Patents by Inventor JULIAN CARLO CONCEPC BARBADILLO

JULIAN CARLO CONCEPC BARBADILLO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dicing a wafer
    Patent number: 10615075
    Abstract: A method for dicing a wafer includes scribing perforations in a wafer. The wafer has a monocrystalline structure and the perforations have a polycrystalline structure. The method also includes adhering the wafer to a top surface of a dicing tape and applying a downward force on a periphery of the dicing tape. The downward force causes a bottom surface of the dicing tape to deform around a contour of a dome-shaped chuck, breaking the perforations in the wafer.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: April 7, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Jerry Gomez Cayabyab, Jeniffer Otero Aspuria, Julian Carlo Concepc Barbadillo, Alvin Lopez Andaya
  • DICING A WAFER
    Publication number: 20190385911
    Abstract: A method for dicing a wafer includes scribing perforations in a wafer. The wafer has a monocrystalline structure and the perforations have a polycrystalline structure. The method also includes adhering the wafer to a top surface of a dicing tape and applying a downward force on a periphery of the dicing tape. The downward force causes a bottom surface of the dicing tape to deform around a contour of a dome-shaped chuck, breaking the perforations in the wafer.
    Type: Application
    Filed: June 13, 2018
    Publication date: December 19, 2019
    Inventors: JERRY GOMEZ CAYABYAB, JENIFFER OTERO ASPURIA, JULIAN CARLO CONCEPC BARBADILLO, ALVIN LOPEZ ANDAYA