Patents by Inventor Julie M. Nadeau

Julie M. Nadeau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6709888
    Abstract: A method of removing a portion of a molding compound encapsulant from around an integrated circuit die having copper-technology (CT) does not damage or significantly remove the copper. Fuming nitric acid and fuming sulfuric acid are mixed at a ratio of between 3:1 to 6:1 and heated to a relatively low temperature such as sixty degrees Celsius or less. In one form, a ratio of 4:1 and a temperature of fifty degrees Celsius are time efficient for removing a molding compound used as the encapsulant. The heated mixed acids are applied to the encapsulated integrated circuit in an etch chamber and the encapsulant is removed without significant reduction of the copper.
    Type: Grant
    Filed: July 26, 2002
    Date of Patent: March 23, 2004
    Assignee: Motorola, Inc.
    Inventor: Julie M. Nadeau
  • Publication number: 20040018651
    Abstract: A method of removing a portion of a molding compound encapsulant from around an integrated circuit die having copper-technology (CT) does not damage or significantly remove the copper. Fuming nitric acid and fuming sulfuric acid are mixed at a ratio of between 3:1 to 6:1 and heated to a relatively low temperature such as sixty degrees Celsius or less. In one form, a ratio of 4:1 and a temperature of fifty degrees Celsius are time efficient for removing a molding compound used as the encapsulant. The heated mixed acids are applied to the encapsulated integrated circuit in an etch chamber and the encapsulant is removed without significant reduction of the copper.
    Type: Application
    Filed: July 26, 2002
    Publication date: January 29, 2004
    Inventor: Julie M. Nadeau