Abstract: An improvement in a mold, for example one used for forming glass or plastic articles, is disclosed. Such a mold has a heat dissipating surface and a forming surface in heat transfer communication with the heat dissipating surface. The improvement involves a conduit and a plurality of heat conducting elements, each of which is in heat transfer communication with the conduit and with a portion of the heat dissipating surface. Each of the heat conducting elements is of such size, shape and material, and is so situated with respect to heat transfer from the heat dissipating surface that, when the mold is in service and a heat tranfer fluid is circulated through the conduit, heat transfer from the heat dissipating surface, through the heat conducting elements and to the conduit maintains each segment of the forming surface at a predetermined temperature.