Patents by Inventor Julius Ming-Lin Tsai

Julius Ming-Lin Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11847851
    Abstract: Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: December 19, 2023
    Assignee: INVENSENSE, INC.
    Inventors: Julius Ming-Lin Tsai, Mike Daneman, Sanjiv Kapoor
  • Patent number: 11651611
    Abstract: A mobile device including a processor, a memory unit, a display device disposed on a first surface of the mobile device, and a fingerprint sensor disposed on a second surface of the mobile device, wherein the second surface is a curved surface having a curvature such that the fingerprint sensor is curved to match the curvature of the curved surface.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: May 16, 2023
    Assignee: InvenSense, Inc.
    Inventor: Julius Ming-Lin Tsai
  • Patent number: 11440052
    Abstract: An electronic device includes a plurality of CMOS control elements arranged in a two-dimensional array and a plurality of MEMS devices. Each CMOS control element of the plurality of CMOS control elements includes at least one of a low voltage semiconductor device, a high voltage PMOS semiconductor device, and a high voltage NMOS semiconductor device. Each MEMS device of the plurality of MEMS devices is associated with a CMOS control element of the plurality of CMOS control elements. The plurality of CMOS control elements are arranged in the two-dimensional array such that low voltage semiconductor devices are only adjacent to other low voltage semiconductor devices, high voltage PMOS semiconductor devices are only adjacent to other high voltage PMOS semiconductor devices, and high voltage NMOS semiconductor devices are only adjacent to other high voltage NMOS semiconductor devices.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: September 13, 2022
    Assignee: InvenSense, Inc.
    Inventors: James Christian Salvia, Michael H. Perrott, Marian Voros, Eldwin Ng, Julius Ming-Lin Tsai, Nikhil Apte
  • Publication number: 20220172506
    Abstract: Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
    Type: Application
    Filed: February 18, 2022
    Publication date: June 2, 2022
    Inventors: Julius Ming-Lin Tsai, Mike Daneman, Sanjiv Kapoor
  • Patent number: 11263424
    Abstract: Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
    Type: Grant
    Filed: February 28, 2020
    Date of Patent: March 1, 2022
    Assignee: INVENSENSE, INC.
    Inventors: Julius Ming-Lin Tsai, Mike Daneman, Sanjiv Kapoor
  • Patent number: 11107858
    Abstract: An electronic device comprises a CMOS substrate having a first surface and a second surface opposite the first surface. A plurality of ultrasonic transducers is provided having a transmit/receive surface. A contact surface is piezoelectrically associated with the plurality of ultrasonic transducers and is formed on the first surface of the CMOS substrate. The plurality of ultrasonic transducers is disposed on the second surface of the CMOS substrate, with the transmit/receive side attached to the second surface thereof such that the CMOS substrate is between the plurality of ultrasonic transducers and the platen. An image sensing system is also provided, together with a method for ultrasonic sensing in the electronic device.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: August 31, 2021
    Assignee: InvenSense, Inc.
    Inventors: Renata Melamud Berger, Julius Ming-Lin Tsai, Stephen Lloyd
  • Publication number: 20200400800
    Abstract: A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane is configured to allow movement at ultrasonic frequencies. The membrane includes a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. An interior support structure is disposed within the cavity and connected to the substrate and the membrane.
    Type: Application
    Filed: March 20, 2020
    Publication date: December 24, 2020
    Applicant: InvenSense, Inc.
    Inventors: Eldwin NG, Julius Ming-Lin TSAI, Nikhil APTE
  • Publication number: 20200355824
    Abstract: In a method of operating a two-dimensional array of ultrasonic transducers, a plurality of array positions comprising pluralities of ultrasonic transducers of the two-dimensional array of ultrasonic transducers is defined, the plurality of array positions each comprising a portion of ultrasonic transducers of the two dimensional array of ultrasonic transducers. For each array position of the plurality of array positions, a plurality of ultrasonic transducers associated with the respective array position are activated. The activation includes transmitting ultrasonic signals from a first group of ultrasonic transducers of the plurality of ultrasonic transducers, wherein at least some ultrasonic transducers of the first group of ultrasonic transducers are phase delayed with respect to other ultrasonic transducers of the first group of ultrasonic transducers, the first group of ultrasonic transducers for forming a focused ultrasonic beam.
    Type: Application
    Filed: June 1, 2020
    Publication date: November 12, 2020
    Applicant: InvenSense, Inc.
    Inventors: Nikhil APTE, Julius Ming-Lin TSAI, Michael Julian DANEMAN, Renata Melamud BERGER
  • Publication number: 20200250393
    Abstract: Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
    Type: Application
    Filed: February 28, 2020
    Publication date: August 6, 2020
    Inventors: Julius Ming-Lin Tsai, Mike Daneman, Sanjiv Kapoor
  • Patent number: 10726231
    Abstract: Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: July 28, 2020
    Assignee: INVENSENSE, INC.
    Inventors: Julius Ming-Lin Tsai, Mike Daneman, Sanjiv Kapoor
  • Publication number: 20200194495
    Abstract: An electronic device comprises a CMOS substrate having a first surface and a second surface opposite the first surface. A plurality of ultrasonic transducers is provided having a transmit/receive surface. A contact surface is piezoelectrically associated with the plurality of ultrasonic transducers and is formed on the first surface of the CMOS substrate. The plurality of ultrasonic transducers is disposed on the second surface of the CMOS substrate, with the transmit/receive side attached to the second surface thereof such that the CMOS substrate is between the plurality of ultrasonic transducers and the platen. An image sensing system is also provided, together with a method for ultrasonic sensing in the electronic device.
    Type: Application
    Filed: October 28, 2019
    Publication date: June 18, 2020
    Applicant: InvenSense, Inc.
    Inventors: Renata Melamud BERGER, Julius Ming-Lin TSAI, Stephen LLOYD
  • Patent number: 10670716
    Abstract: In a method of operating a two-dimensional array of ultrasonic transducers, a plurality of array positions comprising pluralities of ultrasonic transducers of the two-dimensional array of ultrasonic transducers is defined, the plurality of array positions each comprising a portion of ultrasonic transducers of the two dimensional array of ultrasonic transducers. For each array position of the plurality of array positions, a plurality of ultrasonic transducers associated with the respective array position are activated. The activation includes transmitting ultrasonic signals from a first group of ultrasonic transducers of the plurality of ultrasonic transducers, wherein at least some ultrasonic transducers of the first group of ultrasonic transducers are phase delayed with respect to other ultrasonic transducers of the first group of ultrasonic transducers, the first group of ultrasonic transducers for forming a focused ultrasonic beam.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: June 2, 2020
    Assignee: InvenSense, Inc.
    Inventors: Nikhil Apte, Julius Ming-Lin Tsai, Michael Julian Daneman, Renata Melamud Berger
  • Patent number: 10656255
    Abstract: A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane is configured to allow movement at ultrasonic frequencies. The membrane includes a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. An interior support structure is disposed within the cavity and connected to the substrate and the membrane.
    Type: Grant
    Filed: July 8, 2016
    Date of Patent: May 19, 2020
    Assignee: InvenSense, Inc.
    Inventors: Eldwin Ng, Julius Ming-Lin Tsai, Nikhil Apte
  • Patent number: 10643052
    Abstract: A method for generating a composite image having an increased image pixel density by an array of ultrasonic transducers having a given spatial density is provided. The method comprises capturing a first set of pixels at an ultrasonic sensor using a first beamforming pattern, wherein the first beamforming pattern comprises a first pattern of ultrasonic transducers of the ultrasonic sensor. The method further comprises capturing a second set of pixels at the ultrasonic sensor using a second beamforming pattern, wherein the second beamforming pattern comprises a second pattern of ultrasonic transducers. The first beamforming pattern and the second beamforming pattern are different. Pixels of the second set of pixels correspond to positions between pixels of the first set of pixels. The method additionally comprises combining the first and second sets of pixels to form the composite image. An electronic device and a method of generating an image of a fingerprint are also provided.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: May 5, 2020
    Assignee: InvenSense, Inc.
    Inventors: Bruno W. Garlepp, James Christian Salvia, Michael Daneman, Nikhil Apte, Julius Ming-Lin Tsai
  • Publication number: 20200111834
    Abstract: Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
    Type: Application
    Filed: November 27, 2019
    Publication date: April 9, 2020
    Inventors: Julius Ming-Lin Tsai, Michael Daneman
  • Publication number: 20200050816
    Abstract: An electronic device including an array of ultrasonic transducers for generating and receiving ultrasonic signals, and an acoustic coupling layer overlying the array of ultrasonic transducers, where the ultrasonic signals are propagated through the acoustic coupling layer.
    Type: Application
    Filed: October 2, 2019
    Publication date: February 13, 2020
    Applicant: InvenSense, Inc.
    Inventor: Julius Ming-Lin TSAI
  • Patent number: 10497747
    Abstract: Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: December 3, 2019
    Assignee: INVENSENSE, INC.
    Inventors: Julius Ming-Lin Tsai, Michael Daneman
  • Patent number: 10488274
    Abstract: Acoustic ambient temperature and humidity sensing based on determination of sound velocity is described, in addition to sensors, algorithms, devices, systems, and methods therefor. An exemplary embodiment employs sound velocity in the determination of ambient temperature and humidity. Provided implementations include determinations of sound velocity based on time of flight of a coded acoustic signal and/or based on resonance frequency of a Helmholtz resonator.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: November 26, 2019
    Assignee: INVENSENSE, INC.
    Inventors: Xiang Li, Omid Oliaei, Julius Ming-Lin Tsai, Baris Cagdaser, Martin Lim
  • Patent number: 10463304
    Abstract: There is provided a monolithically integrated multimodal sensor device for intracranial neuromonitoring, the sensor device including: a single substrate; a temperature sensor formed on a first portion of the single substrate for detecting temperature; a pressure sensor formed on a second portion of the single substrate for detecting intracranial pressure; and an oxygen sensor formed on a third portion of the single substrate for detecting oxygen concentration. In particular, sensing portions of the temperature sensor, the oxygen sensor and the pressure sensor, respectively, are formed at different layers of the sensor device. There is also provided an integrated multimodal sensor system incorporating the sensor device and the associated methods of fabrication.
    Type: Grant
    Filed: June 12, 2014
    Date of Patent: November 5, 2019
    Assignees: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH, SINGAPORE HEALTH SERVICES PTE. LTD.
    Inventors: Wai Pan Chan, Margarita Sofia Narducci, Yuan Gao, Julius Ming Lin Tsai, Ruiqi Lim, Ming-Yuan Cheng, Abdur Rub Abdur Rahman, Mi Kyoung Park, Minkyu Je, Jai Prashanth Rao
  • Patent number: 10461124
    Abstract: An electronic device comprises a CMOS substrate having a first surface and a second surface opposite the first surface. A plurality of ultrasonic transducers is provided having a transmit/receive surface. A contact surface is piezoelectrically associated with the plurality of ultrasonic transducers and is formed on the first surface of the CMOS substrate. The plurality of ultrasonic transducers is disposed on the second surface of the CMOS substrate, with the transmit/receive side attached to the second surface thereof such that the CMOS substrate is between the plurality of ultrasonic transducers and the platen. An image sensing system is also provided, together with a method for ultrasonic sensing in the electronic device.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: October 29, 2019
    Assignee: InvenSense, Inc.
    Inventors: Renata Melamud Berger, Julius Ming-Lin Tsai, Stephen Lloyd