Patents by Inventor Jun AH
Jun AH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240161851Abstract: A test system includes a test device configured to output a command address and a test dock for performing a test mode and to receive a comparison signal, and a memory device configured to enter the test mode, based on the command address, to set an initial value by the command address, to perform a calculation operation on the initial value according to a logic level combination of the command address to generate a row address and a command address during a pre-charge operation, and to compress and compare internal data output based on the row address and the column address to output the internal data as the comparison signal to the test device.Type: ApplicationFiled: March 1, 2023Publication date: May 16, 2024Applicant: SK hynix Inc.Inventors: Sang Ah HYUN, Yong Ho SEO, Woo Sik JUNG, Jun Phyo LEE, Bong Hwa JEONG
-
Patent number: 11970493Abstract: The present disclosure provides autotaxin (ATX) inhibitor compounds and compositions including said compounds. The present disclosure also provides methods of using said compounds and compositions for inhibiting ATX. Also provided are methods of preparing said compounds and compositions, and synthetic precursors of said compounds.Type: GrantFiled: October 4, 2021Date of Patent: April 30, 2024Assignee: ILDONG PHARMACEUTICAL CO., LTD.Inventors: Sung-Ku Choi, Yoon-Suk Lee, Sung-Wook Kwon, Kyung-Sun Kim, Jeong-Geun Kim, Jeong-Ah Kim, An-Na Moon, Sun-Young Park, Jun-Su Ban, Dong-Keun Song, Kyu-Sic Jang, Ju-Young Jung, Soo-Jin Lee
-
Patent number: 11973219Abstract: A method for pre-lithiation of a negative electrode is disclosed, including the steps of: producing a lithium metal laminate which includes i) lithium metal foil; and ii) a buffer layer including carbonaceous material particles, inorganic compound particles, polymer compound particles or their combination, and coated on one surface of the lithium metal foil; producing a negative electrode including a negative electrode current collector, and a negative electrode active material layer formed on at least one surface of the negative electrode current collector; and laminating the lithium metal laminate with the negative electrode in such a manner that the buffer layer of the lithium metal laminate is in contact with the negative electrode active material layer. A lithium metal laminate used for the method is also provided. The pre-lithiation of a negative electrode that includes a buffer layer reduces the problem of rapid volumetric swelling occurring.Type: GrantFiled: December 20, 2018Date of Patent: April 30, 2024Assignee: LG ENERGY SOLUTION, LTD.Inventors: Oh-Byong Chae, Jun-Hyuk Song, Yoon-Ah Kang, Je-Young Kim, Sang-Wook Woo
-
Patent number: 11929487Abstract: A method of preparing a negative electrode for a lithium secondary battery, which includes forming a negative electrode mixture layer including a negative electrode active material on a negative electrode current collector, disposing lithium metal powder on at least a part of the negative electrode mixture layer, pressing the negative electrode mixture layer on which the lithium metal powder is disposed, wetting the pressed negative electrode mixture layer with a first electrolyte solution, and drying the wet negative electrode mixture layer. A battery including the negative electrode of the present invention has enhanced rapid charge/discharge characteristics and enhanced lifespan characteristics.Type: GrantFiled: January 25, 2019Date of Patent: March 12, 2024Assignee: LG ENERGY SOLUTION, LTD.Inventors: Oh Byong Chae, Sang Wook Woo, Je Young Kim, Yoon Ah Kang, Jun Hyuk Song
-
Patent number: 11918978Abstract: Provided is a method of preparing a superabsorbent polymer. More specifically, provided is a method of preparing a superabsorbent polymer capable of exhibiting improved initial absorbency and a rapid absorption rate by polymerizing monomers having acidic groups, of which part is neutralized with a basic material including potassium hydroxide, in the presence of an encapsulated foaming agent.Type: GrantFiled: December 10, 2019Date of Patent: March 5, 2024Assignee: LG Chem, Ltd.Inventors: Seul Ah Lee, Gicheul Kim, Dae Woo Nam, Ki Hyun Kim, Jun Kyu Kim, Young Jae Hur
-
Patent number: 11605484Abstract: A multilayer seed pattern inductor includes a magnetic body and an internal coil part. The magnetic body contains a magnetic material. The internal coil part is embedded in the magnetic body and includes connected coil conductors disposed on two opposing surfaces of an insulating substrate. Each of the coil conductors includes a seed pattern formed of at least two layers, a surface coating layer covering the seed pattern, and an upper plating layer formed on an upper surface of the surface coating layer.Type: GrantFiled: February 27, 2020Date of Patent: March 14, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Woon Chul Choi, Myung Jun Park, Hye Min Bang, Jun Ah, Myung Sam Kang, Jung Hyuk Jung
-
Publication number: 20200194158Abstract: A multilayer seed pattern inductor includes a magnetic body and an internal coil part. The magnetic body contains a magnetic material. The internal coil part is embedded in the magnetic body and includes connected coil conductors disposed on two opposing surfaces of an insulating substrate. Each of the coil conductors includes a seed pattern formed of at least two layers, a surface coating layer covering the seed pattern, and an upper plating layer formed on an upper surface of the surface coating layer.Type: ApplicationFiled: February 27, 2020Publication date: June 18, 2020Inventors: Woon Chul CHOI, Myung Jun PARK, Hye Min BANG, Jun AH, Myung Sam KANG, Jung Hyuk JUNG
-
Patent number: 10614943Abstract: A multilayer seed pattern inductor includes a magnetic body and an internal coil part. The magnetic body contains a magnetic material. The internal coil part is embedded in the magnetic body and includes connected coil conductors disposed on two opposing surfaces of an insulating substrate. Each of the coil conductors includes a seed pattern formed of at least two layers, a surface coating layer covering the seed pattern, and an upper plating layer formed on an upper surface of the surface coating layer.Type: GrantFiled: February 23, 2016Date of Patent: April 7, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Woon Chul Choi, Myung Jun Park, Hye Min Bang, Jun Ah, Myung Sam Kang, Jung Hyuk Jung
-
Patent number: 10319515Abstract: A chip electronic component includes a magnetic main body including an insulating substrate and a coil conductor pattern disposed on at least one surface of the insulating substrate, and external electrodes formed on opposite ends of the magnetic main body so as to be connected to an end of the coil conductor pattern. The coil conductor pattern includes a pattern plating layer and a first plating layer disposed on the pattern plating layer, and a thickness of the first plating layer of innermost and outermost coil conductor patterns of the coil conductor pattern is greater than a thickness of the first plating layer of an inner coil conductor pattern disposed between the innermost and outermost coil conductor patterns.Type: GrantFiled: February 18, 2016Date of Patent: June 11, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung hyuk Jung, Woon Chul Choi, Jun Ah, Myung Jun Park, Hye Min Bang
-
Publication number: 20160343500Abstract: A chip electronic component includes a magnetic main body including an insulating substrate and a coil conductor pattern disposed on at least one surface of the insulating substrate, and external electrodes formed on opposite ends of the magnetic main body so as to be connected to an end of the coil conductor pattern. The coil conductor pattern includes a pattern plating layer and a first plating layer disposed on the pattern plating layer, and a thickness of the first plating layer of innermost and outermost coil conductor patterns of the coil conductor pattern is greater than a thickness of the first plating layer of an inner coil conductor pattern disposed between the innermost and outermost coil conductor patterns.Type: ApplicationFiled: February 18, 2016Publication date: November 24, 2016Inventors: Jung Hyuk JUNG, Woon Chul CHOI, Jun AH, Myung Jun PARK, Hye Min BANG
-
Publication number: 20160336105Abstract: A multilayer seed pattern inductor includes a magnetic body and an internal coil part. The magnetic body contains a magnetic material. The internal coil part is embedded in the magnetic body and includes connected coil conductors disposed on two opposing surfaces of an insulating substrate. Each of the coil conductors includes a seed pattern formed of at least two layers, a surface coating layer covering the seed pattern, and an upper plating layer formed on an upper surface of the surface coating layer.Type: ApplicationFiled: February 23, 2016Publication date: November 17, 2016Inventors: Woon Chul CHOI, Myung Jun PARK, Hye Min BANG, Jun AH, Myung Sam KANG, Jung Hyuk JUNG
-
Publication number: 20160307693Abstract: An electronic component includes a coil including lead terminals plated with a metal; a body part filling a space around the coil; and external electrodes connected to the lead terminals of the coil. At least portions of the lead terminals of the coil are exposed externally of the body part.Type: ApplicationFiled: January 19, 2016Publication date: October 20, 2016Inventors: Tai Yon Cho, Doo Young Kim, Sang Ho Shin, Jun Ah, Woo Kyung Sung
-
Publication number: 20130258546Abstract: There are provided a multilayer ceramic electronic component and a fabrication method thereof. The multilayer ceramic component includes a ceramic main body in which internal electrodes and dielectric layers are alternately laminated; external electrodes formed on outer surfaces of the ceramic main body; intermediate layers formed on the external electrodes and including one or more selected from the group consisting of nickel, copper, and a nickel-copper alloy; and plating layers formed on the intermediate layers, whereby infiltration of a plating solution can be prevented.Type: ApplicationFiled: March 14, 2013Publication date: October 3, 2013Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chan Kong KIM, Jin Yung RYU, Jun AH, Yong Joon KO, Woo Kyung SUNG, Jong Rock LEE