Patents by Inventor Jun Chiba
Jun Chiba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230042358Abstract: The present invention provides a heterocyclic compound having an orexin type 2 receptor agonist activity. A compound represented by the formula (I): wherein each symbol is as described in the description, or a salt thereof has an orexin type 2 receptor agonist activity, and is useful as an agent for the prophylaxis or treatment of narcolepsy.Type: ApplicationFiled: December 11, 2019Publication date: February 9, 2023Applicant: Takeda Pharmaceutical Company LimitedInventors: Yuhei MIYANOHANA, Yuichi KAJITA, Tatsuki KOIKE, Yasutaka HOASHI, Yasushi HATTORI, Norihito TOKUNAGA, Tsuneo ODA, Tohru MIYAZAKI, Dilhumar UYGHUR, Yoshiteru ITO, Kohei TAKEUCHI, Keisuke IMAMURA, Takahiro SUGIMOTO, Koichiro FUKUDA, Yasuhisa KOHARA, Rei OKAMOTO, Taiichi OHRA, Naoki MIYAMOTO, Jun CHIBA, Yoshito TERAO, Masanori KAWASAKI
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Patent number: 11456271Abstract: A noble metal-coated silver bonding wire suppresses corrosion at the bonding interface under severe conditions of high temperature and high humidity, and the noble metal-coated silver bonding wire can be ball-bonded in the air. The noble metal-coated silver wire for ball bonding is a noble metal-coated silver wire including a noble metal coating layer on a core material made of pure silver or a silver alloy, wherein the wire contains at least one sulfur group element, the noble metal coating layer includes a palladium intermediate layer and a gold skin layer, the palladium content relative to the entire wire is 0.01 mass % or more and 5.0 mass % or less, the gold content relative to the entire wire is 1.0 mass % or more and 6.0 mass % or less, and the sulfur group element content relative to the entire wire is 0.1 mass ppm or more and 100 mass ppm or less.Type: GrantFiled: April 19, 2018Date of Patent: September 27, 2022Assignee: TANAKA DENSHI KOGYO K.K.Inventors: Jun Chiba, Yuki Antoku, Shota Kawano
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Patent number: 11251153Abstract: A noble metal-coated silver bonding wire for ball bonding wire includes a noble metal coating layer on a core material made of pure silver or a silver alloy, wherein the wire contains at least one sulfur group element, the noble metal coating layer includes at least one palladium layer, the total palladium content relative to the entire wire is not less than 0.01 mass % and not more than 5.0 mass %, and the total sulfur group element content relative to the entire wire is not less than 0.1 mass ppm and not more than 100 mass ppm.Type: GrantFiled: April 19, 2018Date of Patent: February 15, 2022Assignee: TANAKA DENSHI KOGYO K.K.Inventors: Jun Chiba, Yuki Antoku, Shota Kawano
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Publication number: 20210050321Abstract: A noble metal-coated silver bonding wire suppresses corrosion at the bonding interface under severe conditions of high temperature and high humidity, and the noble metal-coated silver bonding wire can be ball-bonded in the air. The noble metal-coated silver wire for ball bonding is a noble metal-coated silver wire including a noble metal coating layer on a core material made of pure silver or a silver alloy, wherein the wire contains at least one sulfur group element, the noble metal coating layer includes a palladium intermediate layer and a gold skin layer, the palladium content relative to the entire wire is 0.01 mass % or more and 5.0 mass % or less, the gold content relative to the entire wire is 1.0 mass % or more and 6.0 mass % or less, and the sulfur group element content relative to the entire wire is 0.1 mass ppm or more and 100 mass ppm or less.Type: ApplicationFiled: April 19, 2018Publication date: February 18, 2021Inventors: Jun CHIBA, Yuki ANTOKU, Shota KAWANO
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Publication number: 20200395330Abstract: A noble metal-coated silver bonding wire suppresses corrosion at the bonding interface even under severe conditions of high temperature and high humidity in automobiles and does not cause energization failure in a semiconductor device in which electrodes of a semiconductor chip and electrodes of lead frames or the like are connected by the bonding wire. The noble metal-coated silver wire for ball bonding wire includes a noble metal coating layer on a core material made of pure silver or a silver alloy, wherein the wire contains at least one sulfur group element, the noble metal coating layer includes at least one palladium layer, the total palladium content relative to the entire wire is 0.01 mass % or more and 5.0 mass % or less, and the total sulfur group element content relative to the entire wire is 0.1 mass ppm or more and 100 mass ppm or less.Type: ApplicationFiled: April 19, 2018Publication date: December 17, 2020Inventors: Jun CHIBA, Yuki ANTOKU, Shota KAWANO
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Patent number: 9972595Abstract: A bonding wire for a high-speed signal line for connecting a pad electrode of a semiconductor device and a lead electrode on a circuit board contains palladium (Pd), platinum (Pt), silver (Ag), and a trace additive element.Type: GrantFiled: December 27, 2013Date of Patent: May 15, 2018Assignee: TANAKA DENSHI KOGYO K.K.Inventors: Yuki Antoku, Kazuhiko Yasuhara, Jun Chiba, Wei Chen, Junichi Okazaki, Nanako Maeda
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Patent number: 9362249Abstract: The silver-gold alloy bonding wire of the present invention includes an alloy composed of not lower than 10% and not higher than 30% of gold (Au) and not lower than 30 ppm and not higher than 90 ppm of calcium (Ca) with the remainder of silver (Ag) at purity relative to a metallic element except for elements Au and Ca of 99.99% or higher, in mass percentage; a layer enriched with oxygen (O) and calcium (Ca) formed as a surface layer on the surface of the alloy; and a gold-enriched layer formed immediately below the surface layer.Type: GrantFiled: February 11, 2015Date of Patent: June 7, 2016Assignee: TANAKA DENSHI KOGYO K.K.Inventors: Kazuhiko Yasuhara, Nanako Maeda, Junichi Okazaki, Jun Chiba, Wei Chen, Yuki Antoku
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Publication number: 20160093586Abstract: The silver-gold alloy bonding wire of the present invention includes an alloy composed of not lower than 10% and not higher than 30% of gold (Au) and not lower than 30 ppm and not higher than 90 ppm of calcium (Ca) with the remainder of silver (Ag) at purity relative to a metallic element except for elements Au and Ca of 99.99% or higher, in mass percentage; a layer enriched with oxygen (O) and calcium (Ca) formed as a surface layer on the surface of the alloy; and a gold-enriched layer formed immediately below the surface layer.Type: ApplicationFiled: February 11, 2015Publication date: March 31, 2016Inventors: Kazuhiko YASUHARA, Nanako MAEDA, Junichi OKAZAKI, Jun CHIBA, Wei CHEN, Yuki ANTOKU
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Patent number: 9120835Abstract: To provide a novel compound that has S1P lyase inhibitory ability and induces a reduction in the number of lymphocytes, or a pharmaceutically acceptable salt thereof, and a pharmaceutical composition containing the compound or pharmaceutically acceptable salt thereof as an active ingredient. A compound represented by the general formula (I): or a pharmaceutically acceptable salt thereof.Type: GrantFiled: June 27, 2012Date of Patent: September 1, 2015Assignee: Daiichi Sankyo Company LimitedInventors: Nobuo Machinaga, Jun Chiba, Ryuji Hashimoto, Mamoru Otoyo, Ryotaku Inoue
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Patent number: 9103001Abstract: An Ag—Au—Pd ternary alloy bonding wire for semiconductor devices made from 4-10 mass % of gold having a purity of 99.999% or higher, 2-5 mass % of palladium having a purity of 99.99% or higher, and remaining mass % of silver (Ag) having a purity of 99.999% or higher; and this wire contains 15-70 mass ppm of oxidizing non-noble metallic elements, and is thermally annealed before being continuously drawn through dies, and is thermally tempered after being continuously drawn through the dies, and this wire is useful for ball bonding in a nitrogen atmosphere; Ag2Al and a Pd rich layer produced in the interface between the Ag—Au—Pd ternary alloy wire and an aluminum pad suppress the corrosion development between the Ag2Al intermetallic compound layer and the wire.Type: GrantFiled: November 1, 2011Date of Patent: August 11, 2015Assignee: TANAKA DENSHI KOGYO K.K.Inventors: Jun Chiba, Satoshi Teshima, Tasuku Kobayashi, Yuki Antoku
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Publication number: 20140302317Abstract: An object is to provide a bonding wire for a high-speed signal line, formed by an Ag—Pd—Pt three-element alloy or an Ag—Pd—Pt ternary alloy, that is able to transmit a stable super-high frequency signal in a several GHz band, and that does not have a strong silver sulfide (Ag2S) film even when an unstable silver sulfide layer is formed on the surface of the bonding wire. Provided is the bonding wire for the high-speed signal line formed by a three-element alloy containing 0.8 to 2.5 mass % of palladium (Pd), 0.1 to 0.7 mass % of platinum (Pt), and a balance being silver (Ag) with purity of 99.99 mass % or more, or a ternary alloy obtained by adding a trace element to the three-element alloy, in which cross section of the bonding wire is formed by a skin film and a core, and in which a surface segregation layer containing highly-concentrated silver (Ag) is present in the skin film of the silver alloy.Type: ApplicationFiled: December 27, 2013Publication date: October 9, 2014Applicant: TANAKA DENSHI KOGYO K.K.Inventors: Yuki ANTOKU, Kazuhiko YASUHARA, Jun CHIBA, Wei CHEN, Junichi OKAZAKI, Nanako MAEDA
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Publication number: 20140135292Abstract: To provide a novel compound that has S1P lyase inhibitory ability and induces a reduction in the number of lymphocytes, or a pharmaceutically acceptable salt thereof, and a pharmaceutical composition containing the compound or pharmaceutically acceptable salt thereof as an active ingredient. A compound represented by the general formula (I): or a pharmaceutically acceptable salt thereof.Type: ApplicationFiled: June 27, 2012Publication date: May 15, 2014Applicant: DAIICHI SANKYO COMPANY, LIMITEDInventors: Nobuo Machinaga, Jun Chiba, Ryuji Hashimoto, Mamoru Otoyo, Ryotaku Inoue
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Patent number: 8653126Abstract: To provide a novel compound or an isotope thereof or a pharmaceutically acceptable salt thereof having S1P lyase inhibitory capacity and inducing the decrease in number of lymphocytes, and a pharmaceutical composition containing these as active ingredients. A compound represented by the general formula (I): or the general formula (II): or an isotope thereof or a pharmaceutically acceptable salt thereof.Type: GrantFiled: February 17, 2011Date of Patent: February 18, 2014Assignee: Daiichi Sankyo Company, LimitedInventors: Nobuo Machinaga, Jun Chiba, Fumihito Muro, Hiroshi Yuita, Jun Watanabe
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Publication number: 20130065882Abstract: This invention relates to a VLA-4 inhibitory drug, having good oral absorbability and exhibiting sufficient anti-inflammatory effects when administered orally, wherein an active ingredient is represented by formula (I), or a salt thereof: Q represents an optionally-substituted monocyclic or bicyclic nitrogen-containing heterocyclic group having a nitrogen atom as the bonding site; Y represents an oxygen atom or CH2; W represents an optionally-substituted bicyclic aromatic hydrocarbon ring group or an optionally-substituted bicyclic aromatic heterocyclic group; A1 represents a nitrogen atom or C—R3d wherein R3d represents a hydrogen atom, a halogen atom, a C1-8 alkoxy group or a C1-8 alkyl group; R1 represents H or a C1-8 alkyl group; R2 represents H, a halogen, a C1-8 alkoxyType: ApplicationFiled: October 3, 2012Publication date: March 14, 2013Inventors: Nobuo Machinaga, Shin Iimura, Yoshiyuki Yoneda, Jun Chiba, Fumihito Muro, Hideko Hoh, Atsushi Nakayama
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Publication number: 20120316170Abstract: To provide a novel compound or an isotope thereof or a pharmaceutically acceptable salt thereof having S1P lyase inhibitory capacity and inducing the decrease in number of lymphocytes, and a pharmaceutical composition containing these as active ingredients. A compound represented by the general formula (I): or the general formula (II): or an isotope thereof or a pharmaceutically acceptable salt thereof.Type: ApplicationFiled: February 17, 2011Publication date: December 13, 2012Applicant: Daiichi Sankyo Company LimitedInventors: Nobuo Machinaga, Jun Chiba, Fumihito Muro, Hiroshi Yuita, Jun Watanabe
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Publication number: 20120263624Abstract: An Ag—Au—Pd ternary alloy bonding wire for semiconductor devices made from 4-10 mass % of gold having a purity of 99.999 mass % or higher, 2-5 mass % of palladium having a purity of 99.99 mass % or higher, and remaining mass % of silver (Ag) having a purity of 99.999 mass % or higher; and this wire contains 15-70 mass ppm of oxidizing non-noble metallic elements, and is thermally annealed before being continuously drawn through dies, and is thermally tempered after being continuously drawn through the dies, and this wire is useful for ball bonding in a nitrogen atmosphere; Ag2Al and a Pd rich layer produced in the interface between the Ag—Au—Pd ternary alloy wire and an aluminum pad suppress the corrosion development between the Ag2Al intermetallic compound layer and the wire.Type: ApplicationFiled: November 1, 2011Publication date: October 18, 2012Applicant: TANAKA DENSHI KOGYO K.K.Inventors: Jun Chiba, Satoshi Teshima, Tasuku Kobayashi, Yuki Antoku
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Publication number: 20120157437Abstract: This invention relates to a VLA-4 inhibitory drug, having good oral absorbability and exhibiting sufficient anti-inflammatory effects when administered orally, wherein an active ingredient is represented by formula (I), or a salt thereof: Q represents an optionally-substituted monocyclic or bicyclic nitrogen-containing heterocyclic group having a nitrogen atom as the bonding site; Y represents an oxygen atom or CH2; W represents an optionally-substituted bicyclic aromatic hydrocarbon ring group or an optionally-substituted bicyclic aromatic heterocyclic group; A1 represents a nitrogen atom or C—R3d wherein R3d represents a hydrogen atom, a halogen atom, a C1-8 alkoxy group or a C1-8 alkyl group; R1 represents H or a C1-8 alkyl group; R2 represents H, a halogen, a C1-8 alkoxy group, or an optionally-substituted benzyloxy group; and R3a, R3b and R3c independently represent H, a halogen atom, a C1-8 alkoxy group or a C1-8 alkyl group.Type: ApplicationFiled: February 1, 2012Publication date: June 21, 2012Applicant: DAIICHI SANKYO COMPANY, LIMITEDInventors: Nobuo MACHINAGA, Shin Ilmura, Yoshiyuki Yoneda, Jun Chiba, Fumihito Muro, Hideko Hoh, Atsushi Nakayama
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Patent number: 8129366Abstract: There is provided a VLA-4 inhibitory drug having good oral absorbability and exhibiting sufficient anti-inflammatory effects when administered orally.Type: GrantFiled: December 13, 2006Date of Patent: March 6, 2012Assignee: Daiichi Sankyo Company, LimitedInventors: Nobuo Machinaga, Shin Iimura, Yoshiyuki Yoneda, Jun Chiba, Fumihito Muro, Hideko Hoh, Atsushi Nakayama
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Publication number: 20110058979Abstract: [Issues to be Solved] Second bonding failures caused by attached oxide of additive elements on high purity Au bonding wire are to be resolved. [Solution Means] Au alloy bonding wires comprising: 5-100 wt ppm Mg, 5-20 wt ppm In, 5-20 wt ppm Al, 5-20 wt ppm Yb, and residual Au of 99.995 wt % purity or higher, and adding 5-20 wt ppm Ca, and for these alloys adding at least one element among 5-20 wt ppm La, 5-20 wt ppm Lu, 5-100 wt ppm Sn, 5-100 wt ppm Sr to the alloy, and/or, moreover, adding 0.01-1.2 wt % Pd to these alloys. Bonding wire, which contains these trace additive elements do not cause a disturbance by accumulated contamination, because of contamination, which formed at ball formation by micro discharge and at the first bonding on the tip of the capillary, transferring to the wire at second bonding.Type: ApplicationFiled: September 11, 2008Publication date: March 10, 2011Applicant: TANAKA DENSHI KOGYO K. K.Inventors: Hiroshi Murai, Jun Chiba, Fujio Amada
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Publication number: 20100171222Abstract: [Issues to be Solved] Providing enhanced bonding reliability of Au alloy bonding wire with low electrical resistivity to Al electrode of semiconductor device, and its application of semiconductor device is bonded with Al electrode pad by the same wire. [Solution Means] Au alloy bonding wire comprising: 0.02-0.3 mass % Ag, total amount of 10-200 mass ppm at least one element of Ge and/or Si, and/or total amount of 10-200 mass ppm at least one element of Al and/or Cu, with residual of Au. Moreover, Al and/or Al alloy pad bonded with the above Au alloy bonding wire.Type: ApplicationFiled: March 26, 2008Publication date: July 8, 2010Applicant: TANAKA DENSHI KOGYO K.K.Inventors: Hiroshi Murai, Jun Chiba, Fujio Amada