Patents by Inventor Jun Dai

Jun Dai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11902644
    Abstract: A camera module includes a holder, a lens in the holder, magnets disposed on an outer wall of the holder, and a circuit board assembly. The circuit board assembly includes an outer wiring substrate, and first and second inner wiring substrates spaced out on a surface of the outer wiring substrate. The first inner wiring substrate surrounds the holder and includes a first dielectric layer and a first inner wiring layer thereon. The first inner wiring layer includes coils of wound wire in the first inner wiring layer, and each of the coils corresponds to one of the magnets. The second inner wiring substrate includes a second inner wiring layer, a thickness of each of the coils is greater than a thickness of the second inner wiring layer. A method for manufacturing the camera module is also disclosed.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: February 13, 2024
    Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.
    Inventors: Jun Dai, Mei Yang, Ming-Jaan Ho
  • Publication number: 20240035652
    Abstract: A point light-source includes a housing and a light-emitting circuit packaged in the housing. The housing includes an upper housing and a lower housing, and the light-emitting circuit includes a constant-current control chip and a plurality of single-color light strings. Each single-color light string is composed of a plurality of light-emitting elements connected in series. The constant-current control chip is configured to, in response to an external serial signal, generate pulse signals transmitted to each single-color light string so as to change a luminous brightness of each single-color light string correspondingly through each of the pulse signals.
    Type: Application
    Filed: July 19, 2023
    Publication date: February 1, 2024
    Inventors: Jun DAI, Chunbo ZHANG, Wenlong WU
  • Patent number: 11871526
    Abstract: A circuit board includes a substrate, a first circuit layer, a second circuit layer, and a third circuit layer. The substrate includes a base layer, a first metal layer formed on the base layer, and a seed layer formed on the first metal layer. The first circuit layer is located on the substrate and includes the first metal layer and a signal layer formed on a surface of the first metal layer. The second circuit layer is coupled to the first circuit layer and includes the first metal layer, the seed layer, and a connection pillar formed on a surface of the first metal layer and the seed layer. The third circuit layer is coupled to the second circuit layer and includes the seed layer and a coil formed on a surface of the seed layer.
    Type: Grant
    Filed: February 16, 2022
    Date of Patent: January 9, 2024
    Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.
    Inventor: Jun Dai
  • Publication number: 20230408075
    Abstract: A lighting lamp includes a first lamp-assembly structure, at least one second lamp-assembly structure, and a control structure. The first lamp-assembly structure includes a first lamp body and a first lamp column used to scatter light generated by the first lamp body. A first end of the first lamp column is fixedly connected with a first end of the first lamp body. The second lamp-assembly structure includes a second lamp body, a first end of the second lamp body being connected to a second end of the first lamp column, and a second lamp column fixedly connected to a second end of the second lamp body and used to scatter the light generated by the second lamp body. The control structure is arranged in the first lamp body and/or the second lamp body, and is electrically connected with the first lamp body and the second lamp body.
    Type: Application
    Filed: June 16, 2023
    Publication date: December 21, 2023
    Inventors: Jun DAI, Wenlong WU
  • Publication number: 20230377779
    Abstract: A buried thermistor includes a lower substrate, an upper substrate, and a number of thermistor stacks. Each thermistor stack includes two resistor subjects. Each resistor subject includes a base layer, a medium layer, a metal layer, a resistor layer, a nanometal layer, and a conductive layer. Applicable material of the resistor layer becomes more diverse by disposing the number of thermistor stacks, and the buried thermistor shows variable thermal sensitivity.
    Type: Application
    Filed: June 28, 2022
    Publication date: November 23, 2023
    Inventors: Jian WANG, Jun DAI, Xiao-Juan ZHANG
  • Publication number: 20230325986
    Abstract: This application discloses an image processing method and a related apparatus, to support display of an HDR image, display more dynamic ranges and image details, provide richer colors, and improve user experience. The image processing method includes: obtaining a first RGB image, where the first RGB image is an RGB image sensed by a photographing apparatus; converting the first RGB image into a second RGB image, where the second RGB image is an image meeting a BT2020 color gamut range; determining a first luminance value corresponding to the second RGB image, where the first luminance value indicates maximum luminance of each frame of image in the second RGB image; determining a target image based on the first luminance value and the second RGB image; and sending the target image to a display apparatus, so that the display apparatus displays the target image.
    Type: Application
    Filed: June 14, 2023
    Publication date: October 12, 2023
    Inventors: Jinsong WEN, Jun DAI, Qiyan ZHAI, Yanbing JIA
  • Patent number: 11714732
    Abstract: Sets of asynchronous replication operations may be tracked to ensure consistency. A tracking service may receive notifications of pending asynchronous replication tasks, and responsive to receiving a manifest indicating a request to be notified upon completion of a set of pending replication asynchronous tasks, matches individual ones of the tasks within the set to tasks indicated as pending. The tracking service may then select a routing table based on a most recent sequence number associated with the set of tasks, determine one of more tracking nodes assigned to track the set of tasks, and send the manifest to each of the tracking nodes. As individual ones of the tasks complete, notifications of completion may be sent to the tracking nodes and an aggregator node aggregates the completion notifications for the set. Once all completion notifications are received, a response to the request indicating completion may be sent.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: August 1, 2023
    Assignee: Amazon Technologies, Inc.
    Inventors: Jacob Wires, Julien Mascart, Valeri Atamaniouk, Jun Dai, Sidharth Bajaj, Wesley Shawn Davis
  • Publication number: 20230173860
    Abstract: The disclosure relates to the technical field of vehicles, and particularly provides a multi-link independent suspension for a vehicle that includes a subframe and a steering knuckle. In order to solve the problem of reduced adjustment efficiency caused by mutual restraining of linkages of an existing multi-link independent suspension when a camber angle is adjusted, the multi-link independent suspension includes a spring control arm that is configured to adjust a camber angle of a wheel center. The multi-link independent suspension also includes a front upper control arm and a rear upper control arm.
    Type: Application
    Filed: November 29, 2022
    Publication date: June 8, 2023
    Inventors: Zhe XU, Haibo WANG, Dongdong WANG, Biao CHEN, Jun DAI, Xu HAN
  • Publication number: 20230125163
    Abstract: According to embodiments of the present disclosure, a method, apparatus, device and storage medium for managing traffic data of a client application is provided. The method described herein comprises: detecting a transmission of user data of a target user from the client application to a server; analyzing the traffic data of the transmission at different layers of the transmission based on types of the traffic data; and in accordance with a determination that the analysis indicates that the traffic data satisfies a data exchange constraint corresponding to the target user, transmitting the traffic data to a server in compliance with the data exchange constraint. In this way, by analyzing the traffic data at different layers of the transmission and restricting traffic data that does not satisfy the data exchange constraint, it is possible to effectively prevent user data from being transmitted to unauthorized servers via various types of traffic data.
    Type: Application
    Filed: February 24, 2022
    Publication date: April 27, 2023
    Inventors: Xing Yao, Zhongwei Huang, Lei Wang, Chaoyang Shang, Junyu Du, Jun Dai
  • Patent number: 11637781
    Abstract: According to embodiments of the present disclosure, a method, apparatus, device and storage medium for managing traffic data of a client application is provided. The method described herein comprises: detecting a transmission of user data of a target user from the client application to a server; analyzing the traffic data of the transmission at different layers of the transmission based on types of the traffic data; and in accordance with a determination that the analysis indicates that the traffic data satisfies a data exchange constraint corresponding to the target user, transmitting the traffic data to a server in compliance with the data exchange constraint. In this way, by analyzing the traffic data at different layers of the transmission and restricting traffic data that does not satisfy the data exchange constraint, it is possible to effectively prevent user data from being transmitted to unauthorized servers via various types of traffic data.
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: April 25, 2023
    Assignee: BEIJING BYTEDANCE NETWORK TECHNOLOGY CO., LTD.
    Inventors: Xing Yao, Zhongwei Huang, Lei Wang, Chaoyang Shang, Junyu Du, Jun Dai
  • Patent number: 11622939
    Abstract: An HS-25 tablet, an HS-25 solid dispersion composition, a preparation method therefor and usage thereof. The HS-25 tablet is made by using HS-25 and excipients for wet granulation, drying, granulating and tablet pressing.
    Type: Grant
    Filed: November 23, 2018
    Date of Patent: April 11, 2023
    Assignee: ZHEJIANG HISUN PHARMACEUTICAL CO., LTD.
    Inventors: Li Ding, Jun Dai, Chunrong Feng, Changliang Dai
  • Patent number: 11570306
    Abstract: The present disclosure provides a call processing method, apparatus, electronic device and storage medium and relates to the field of cloud computing. The method may comprise: obtaining a calling subscriber's status information in real time while an intelligent dialogue robot is used to make a call with the calling subscriber; when it is determined that a call form of the intelligent dialogue robot needs to be adjusted, correspondingly adjusting the call form of the intelligent dialogue robot according to current status information of the calling subscriber. The solution of the present disclosure may be employed to improve the call performance of the intelligent dialogue robot.
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: January 31, 2023
    Assignee: BEIJING BAIDU NETCOM SCIENCE AND TECHNOLOGY CO., LTD.
    Inventors: Jun Dai, Jinli Dong, Guiping Wang, Guorui Huang
  • Patent number: 11563897
    Abstract: An image processing method includes obtaining status information of a terminal device, obtaining photographing scene information of the terminal device, determining an image processing mode based on the status information and the photographing scene information, obtaining a to-be-displayed image, and processing the to-be-displayed image based on the image processing mode.
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: January 24, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jun Dai, Biying Hu, Yining Huang
  • Patent number: 11551673
    Abstract: Embodiments of the present disclosure provide an interactive method of a robot, an interactive device of a robot and a device. The method includes: obtaining voice information input by an interactive object, and performing semantic recognition on the voice information to obtain a conversation intention; obtaining feedback information corresponding to the conversation intention based on a conversation scenario knowledge base pre-configured by a simulated user; and converting the feedback information into a voice of the simulated user, and playing the voice to the interactive object.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: January 10, 2023
    Assignee: BEIJING BAIDU NETCOM SCIENCE AND TECHNOLOGY CO., LTD.
    Inventors: Jun Dai, Ying Liu
  • Patent number: 11469533
    Abstract: An electrical terminal includes a base, a first elastic arm and a second elastic arm formed side by side by extending upwardly from an upper end of the base, and a protruding portion. The first elastic arm has a mating portion, and the second elastic arm has a contact portion. The protruding portion protrudes and extends from a first side of the first elastic arm, and the first side of the first elastic arm is adjacent to the second elastic arm. A lower surface of the protruding portion has a contact surface overlapping with the contact portion in a vertical direction, such that the contact portion upwardly abuts the contact surface. When the chip module presses downwardly on the electrical terminal, the contact portion can move on the contact surface, such that the chip module does not need to press downwardly on the contact portion with a relatively large pressure.
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: October 11, 2022
    Assignee: LOTES CO., LTD
    Inventors: Chien Chih Ho, Zuo Feng Jin, Yong Jun Dai, Chih Kun Chen
  • Patent number: 11383263
    Abstract: The present disclosure provides a coating device including a first storage tank for storing a material to be coated, a needle cannula to which the first storage tank is connected by means of a corresponding first line, a gas output device for outputting a first pressurized gas from a gas source, including a first gas output line extending into the first storage tank, wherein the gas output device is capable of outputting the first pressurized gas to the first storage tank through the first gas output line such that the material to be coated stored in the first storage tank is discharged under a gas pressure and enters the needle cannula through the first line.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: July 12, 2022
    Assignees: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Feiji Zhou, Haitao Long, Haitao Bai, Lu Cheng, Lingling Ge, Xiaoya Lu, Lu Xu, Xiaodong Yang, Kai Zhu, Chenchen Xiao, Wenxi Zhu, Jun Dai, Wei Zhou
  • Publication number: 20220191361
    Abstract: A camera module includes a holder, a lens in the holder, magnets disposed on an outer wall of the holder, and a circuit board assembly. The circuit board assembly includes an outer wiring substrate, and first and second inner wiring substrates spaced out on a surface of the outer wiring substrate. The first inner wiring substrate surrounds the holder and includes a first dielectric layer and a first inner wiring layer thereon. The first inner wiring layer includes coils of wound wire in the first inner wiring layer, and each of the coils corresponds to one of the magnets. The second inner wiring substrate includes a second inner wiring layer, a thickness of each of the coils is greater than a thickness of the second inner wiring layer. A method for manufacturing the camera module is also disclosed.
    Type: Application
    Filed: February 28, 2022
    Publication date: June 16, 2022
    Inventors: Jun Dai, Mei Yang, Ming-Jaan Ho
  • Publication number: 20220174822
    Abstract: A circuit board includes a substrate, a first circuit layer, a second circuit layer, and a third circuit layer. The substrate includes a base layer, a first metal layer formed on the base layer, and a seed layer formed on the first metal layer. The first circuit layer is located on the substrate and includes the first metal layer and a signal layer formed on a surface of the first metal layer. The second circuit layer is coupled to the first circuit layer and includes the first metal layer, the seed layer, and a connection pillar formed on a surface of the first metal layer and the seed layer. The third circuit layer is coupled to the second circuit layer and includes the seed layer and a coil formed on a surface of the seed layer.
    Type: Application
    Filed: February 16, 2022
    Publication date: June 2, 2022
    Inventor: JUN DAI
  • Patent number: 11323562
    Abstract: The disclosure provides a communication method. The method includes: receiving a call request forwarded by an operator server, the call request being sent by a calling terminal to the operator server; generating a transferring instruction in response to the call request being a crank call; and sending the transferring instruction to the operator server, such that the operator server establishes a call connection between the calling terminal and a smart device based on the transferring instruction.
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: May 3, 2022
    Assignee: BEIJING BAIDU NETCOM SCIENCE AND TECHNOLOGY CO., LTD.
    Inventors: Jun Dai, Guorui Huang
  • Patent number: 11294285
    Abstract: A method for manufacturing the circuit board comprises following steps of forming a silver layer on each of two opposite surfaces of an insulating substrate, and forming a copper layer on each silver layer, thereby obtaining a middle structure; defining at least one through-hole on the middle structure, and each through-hole extending through each copper layer; forming a copper wiring layer on the copper layers to cover each through-hole and a portion region of the copper layers, the copper wiring layer comprising a copper conductive structure passing through each through-hole, the copper conductive structure connecting the copper layers; removing the copper layers not covered by the copper wiring layer; and etching the silver layers to form a silver wiring layer corresponding to the copper wiring layer, wherein a first etching liquid, which does not etch the copper wiring layer, is used for etching the silver layers.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: April 5, 2022
    Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.
    Inventors: Xian-Qin Hu, Mei Yang, Jun Dai