Patents by Inventor Jun-Gyu Ryu
Jun-Gyu Ryu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20070232209Abstract: An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber.Type: ApplicationFiled: May 25, 2007Publication date: October 4, 2007Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jae-Phil Boo, Jun-Gyu Ryu, Sang-Seon Lee, Sun-Wung Lee
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Patent number: 7223158Abstract: An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber.Type: GrantFiled: January 5, 2006Date of Patent: May 29, 2007Assignee: Samsung Electronics Co., Ltd.Inventors: Jae-Phil Boo, Jun-Gyu Ryu, Sang-Seon Lee, Sun-Wung Lee
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Patent number: 7081045Abstract: An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber.Type: GrantFiled: February 7, 2005Date of Patent: July 25, 2006Assignee: Samsung Electronics Co., Ltd.Inventors: Jae-Phil Boo, Jun-Gyu Ryu, Sang-Seon Lee, Sun-Wung Lee
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Publication number: 20060116056Abstract: An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber.Type: ApplicationFiled: January 5, 2006Publication date: June 1, 2006Inventors: Jae-Phil Boo, Jun-Gyu Ryu, Sang-Seon Lee, Sun-Wung Lee
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Patent number: 6945861Abstract: A chemical mechanical polishing (CMP) apparatus includes a polishing head that is composed of a carrier and a membrane, and is positioned on a polishing pad of a supporting part. The polishing head has a supporter installed at an internal center of the carrier, a chucking ring positioned between the carrier and the supporter, and means for moving the chucking ring up and down in a vertical direction. The supporter forms a sealed space together with the membrane, and the chucking ring chucks the wafer in vacuum.Type: GrantFiled: March 8, 2005Date of Patent: September 20, 2005Assignee: Samsung Electronics Co., Ltd.Inventors: Jae-Phil Boo, Jong-Soo Kim, Jun-Gyu Ryu, Sang-Seon Lee, Sun-Wung Lee
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Patent number: 6921323Abstract: An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber.Type: GrantFiled: September 25, 2003Date of Patent: July 26, 2005Assignee: Samsung Electronics, Co., Ltd.Inventors: Jae-Phil Boo, Jun-Gyu Ryu, Sang-Seon Lee, Sun-Wung Lee
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Publication number: 20050153635Abstract: A chemical mechanical polishing (CMP) apparatus includes a polishing head that is composed of a carrier and a membrane, and is positioned on a polishing pad of a supporting part. The polishing head has a supporter installed at an internal center of the carrier, a chucking ring positioned between the carrier and the supporter, and means for moving the chucking ring up and down in a vertical direction. The supporter forms a sealed space together with the membrane, and the chucking ring chucks the wafer in vacuum.Type: ApplicationFiled: March 8, 2005Publication date: July 14, 2005Inventors: Jae-Phil Boo, Jong-Soo Kim, Jun-Gyu Ryu, Sang-Seon Lee, Sun-Wung Lee
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Publication number: 20050136806Abstract: An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber.Type: ApplicationFiled: February 7, 2005Publication date: June 23, 2005Inventors: Jae-Phil Boo, Jun-Gyu Ryu, Sang-Seon Lee, Sun-Wung Lee
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Patent number: 6881135Abstract: A chemical mechanical polishing (CMP) apparatus includes a polishing head that is composed of a carrier and a membrane, and is positioned on a polishing pad of a supporting part. The polishing head has a supporter installed at an internal center of the carrier, a chucking ring positioned between the carrier and the supporter, and means for moving the chucking ring up and down in a vertical direction. The supporter forms a sealed space together with the membrane, and the chucking ring chucks the wafer in vacuum.Type: GrantFiled: June 30, 2004Date of Patent: April 19, 2005Assignee: Samsung Electronics Co., Ltd.Inventors: Jae-Phil Boo, Jong-Soo Kim, Jun-Gyu Ryu, Sang-Seon Lee, Sun-Wung Lee
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Patent number: 6840846Abstract: An apparatus for polishing a wafer includes a polishing station having a platen on which a polishing pad is installed, a polishing head having a membrane that contacts a surface of the wafer, the membrane securing the wafer and pressuring the wafer against the polishing pad, wherein the polishing station includes a transfer stage for loading the wafer on or unloading the wafer from the polishing head, and wherein the transfer stage includes a pedestal on which the wafer is placed and a fluid supply part for supplying a fluid into a boundary region between the wafer and the membrane to reduce a surface tension between the wafer and the membrane. Preferably, the apparatus further includes a stopper for preventing the wafer placed on the pedestal from being lifted up along with the membrane when the wafer is unloaded from the polishing head onto the pedestal.Type: GrantFiled: June 9, 2003Date of Patent: January 11, 2005Assignee: Samsung Electronics Co., Ltd.Inventors: Jae-Phil Boo, Jun-Gyu Ryu, Hyun-Sung Lee
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Publication number: 20040242129Abstract: A chemical mechanical polishing (CMP) apparatus includes a polishing head that is composed of a carrier and a membrane, and is positioned on a polishing pad of a supporting part. The polishing head has a supporter installed at an internal center of the carrier, a chucking ring positioned between the carrier and the supporter, and means for moving the chucking ring up and down in a vertical direction. The supporter forms a sealed space together with the membrane, and the chucking ring chucks the wafer in vacuum.Type: ApplicationFiled: June 30, 2004Publication date: December 2, 2004Applicant: Samsung Electronics Co., Ltd.Inventors: Jae-Phil Boo, Jong-Soo Kim, Jun-Gyu Ryu, Sang-Seon Lee, Sun-Wung Lee
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Patent number: 6769973Abstract: A chemical mechanical polishing (CMP) apparatus includes a polishing head that is composed of a carrier and a membrane, and is positioned on a polishing pad of a supporting part. The polishing head has a supporter installed at an internal center of the carrier, a chucking ring positioned between the carrier and the supporter, and means for moving the chucking ring up and down in a vertical direction. The supporter forms a sealed space together with the membrane, and the chucking ring chucks the wafer in vacuum.Type: GrantFiled: March 27, 2002Date of Patent: August 3, 2004Assignee: Samsung Electronics Co., Ltd.Inventors: Jae-Phil Boo, Jong-Soo Kim, Jun-Gyu Ryu, Sang-Seon Lee, Sun-Wung Lee
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Publication number: 20040072517Abstract: An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber.Type: ApplicationFiled: September 25, 2003Publication date: April 15, 2004Applicant: Samsung Electronics Co., Ltd.Inventors: Jae-Phil Boo, Jun-Gyu Ryu, Sang-Seon Lee, Sun-Wung Lee
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Publication number: 20030236056Abstract: An apparatus for polishing a wafer includes a polishing station having a platen on which a polishing pad is installed, a polishing head having a membrane that contacts a surface of the wafer, the membrane securing the wafer and pressuring the wafer against the polishing pad, wherein the polishing station includes a transfer stage for loading the wafer on or unloading the wafer from the polishing head, and wherein the transfer stage includes a pedestal on which the wafer is placed and a fluid supply part for supplying a fluid into a boundary region between the wafer and the membrane to reduce a surface tension between the wafer and the membrane. Preferably, the apparatus further includes a stopper for preventing the wafer placed on the pedestal from being lifted up along with the membrane when the wafer is unloaded from the polishing head onto the pedestal.Type: ApplicationFiled: June 9, 2003Publication date: December 25, 2003Inventors: Jae-Phil Boo, Jun-Gyu Ryu, Hyun-Sung Lee
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Patent number: 6652362Abstract: An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber.Type: GrantFiled: June 7, 2001Date of Patent: November 25, 2003Assignee: Samsung Electronics Co., Ltd.Inventors: Jae-Phil Boo, Jun-Gyu Ryu, Sang-Seon Lee, Sun-Wung Lee
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Publication number: 20030008604Abstract: A chemical mechanical polishing (CMP) apparatus includes a polishing head that is composed of a carrier and a membrane, and is positioned on a polishing pad of a supporting part. The polishing head has a supporter installed at an internal center of the carrier, a chucking ring positioned between the carrier and the supporter, and means for moving the chucking ring up and down in a vertical direction. The supporter forms a sealed space together with the membrane, and the chucking ring chucks the wafer in vacuum.Type: ApplicationFiled: March 27, 2002Publication date: January 9, 2003Applicant: Samsung Electronics Co., Ltd.Inventors: Jae-Phil Boo, Jong-Soo Kim, Jun-Gyu Ryu, Sang-Seon Lee, Sun-Wung Lee
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Publication number: 20020098780Abstract: An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber.Type: ApplicationFiled: June 7, 2001Publication date: July 25, 2002Applicant: Samsung Electronics Co., Ltd.Inventors: Jae-Phil Boo, Jun-Gyu Ryu, Sang-Seon Lee, Sun-Wung Lee