Abstract: This disclosure relates generally to transmission resource or transmission parameters update of various types in wireless communications. Performed by a wireless terminal in a wireless network, the method including receiving a message from a wireless communication node of the wireless network, the message indicating an update to a wireless resource or a transmission parameter associated with the wireless resource, the wireless resource being previously allocated to the wireless terminal for data reception or data transmission; parsing the message based on a type of the update to the wireless resource or the transmission parameter associated with the wireless resource to obtain the update; and transmitting or receiving data, or skipping transmitting or receiving data using the wireless resource based on the update.

Abstract: Fastener storage is presented. The fastener storage comprises a disc with a plurality of apertures through a first face of the disc and arranged in a plurality of rings concentric with the disc, and a plurality of machine-readable identifiers on the first face of the disc.

Abstract: An interface obtains basic page information from another interface. The basic page information includes N bits, the N bits include an FEC function indicator bit sequence including an FEC ability indicator bit and an FEC requested indicator bit. The interface determines, based on values of a plurality of bits in the N bits, an operation mode supported by the another interface. The FEC function indicator bit sequence includes a first FEC function indicator bit corresponding to m FEC abilities; or the FEC function indicator bit sequence includes a first FEC ability indicator bit corresponding to n FEC abilities, where both m and n are greater than or equal to 1. Because one FEC function indicator bit indicates more FEC abilities, N bits in a basic page can carry more information, so that a process of increasing auto-negotiation pages is slowed down, thereby avoiding impact on auto-negotiation efficiency.

Abstract: The present disclosure provides a bimetallic coordination metal-organic framework material, a preparing method thereof, and an application thereof. In the bimetallic coordination metal-organic framework material, carboxyl groups and soft groups of ligands are coordinated with coordination metal ions to assemble a structure having space and functions divided into covalent charge carrier layers and charge storage ion layers. Further, through the conjugation effect, the bimetallic coordination metal-organic framework material has unique electromagnetic properties, good electrical conductivity, and magnetic coupling performance. Thus, the bimetallic coordination metal-organic framework material is used as superconducting materials, conductive materials, semiconductor materials, or electromagnetic materials.

Abstract: The invention relates to a wide spectrum multi-band detection structure with selective absorption enhancement and its preparation method. The structure comprises a plurality of sub-pixel units capable of detecting incident light in different bands. Each sub-pixel unit is composed of a square well-shaped microstructure array and a metal lower electrode (2), a photosensitive layer (3) and an upper electrode (4) on the surface thereof. The size and array spacing of square well-shaped microstructures in different sub-pixel units are determined according to the detection bands of the sub-pixel units where they are located. The upper openings of the square well-shaped microstructures are hollow to form a resonant cavity, and the adjacent square well-shaped microstructures in the same sub-pixel unit form a resonant cavity, thus solving the problem that the detector structure in the prior art cannot simultaneously realize visible light-near infrared multi-band absorption enhancement detection.

Abstract: Semiconductor packages including an integrated heat spreader and methods of fabrication are described. In an embodiment, a semiconductor package includes a first package level, a second package level including one or more second-level chiplets, and a heat spreader bonded to the second package level with a metallic layer, which may include one or more intermetallic compounds formed by transient liquid phase bonding.

Abstract: Semiconductor packages including local interconnects and methods of fabrication are described. In an embodiment, a local interconnect is fabricated with one or more cavities filled with a low-k material or air gap where a die-to-die routing path electrically connecting the first die and the second die includes the metal wire spanning across the one or more cavities. In other embodiments fanout can be utilized to create a wider bump pitch for the local interconnect, or for the local interconnect to connect core regions of the dies. Multiple local interconnects can also be utilized to scale down electrostatic discharge.

Abstract: Semiconductor packages formed utilizing wafer reconstitution and optionally including an integrated heat spreader and methods of fabrication are described. In an embodiment, a semiconductor package includes a first package level, a second package level including one or more second-level chiplets, and a heat spreader bonded to the second package level with a metallic layer, which may include one or more intermetallic compounds formed by transient liquid phase bonding.

Abstract: Provided are a high temperature-resistant composite nanofiltration membrane and a preparation method thereof. The high temperature-resistant composite nanofiltration membrane includes a base membrane and a polyamide membrane arranged on the base membrane; wherein the polyamide membrane is prepared from raw materials comprising: an amine, an inorganic salt, a silane additive, a polyacyl chloride, and an oil phase solvent; and the silane additive is at least one selected from the group consisting of 3-aminopropyltriethoxysilane, divinyltriaminopropyltrimethoxysilane, N-cyclohexyl-?-aminopropyltrimethoxysilane, and trimethoxy[3-(phenylamino)propyl]silane.

Abstract: Semiconductor packages formed utilizing wafer reconstitution and optionally including an integrated heat spreader and methods of fabrication are described. In an embodiment, a semiconductor package includes a first package level, a second package level including one or more second-level chiplets. A heat spreader may be bonded to the second package level with a metallic layer, which may include one or more intermetallic compounds formed by transient liquid phase bonding. The chiplets within the first and/or second package levels may optionally be connected with one or more optical interconnect paths.

Abstract: Embodiments of a channel hole plug structure of 3D memory devices and fabricating methods thereof are disclosed. The memory device includes an alternating layer stack disposed on a substrate, an insulating layer disposed on the alternating dielectric stack, a channel hole extending vertically through the alternating dielectric stack and the insulating layer, a channel structure including a channel layer in the channel hole, and a channel hole plug in the insulating layer and above the channel structure. The channel hole plug is electrically connected with the channel layer. A projection of the channel hole plug in a lateral plane covers a projection of the channel hole in the lateral plane.

Abstract: A wearable physiological measurement apparatus comprises a base, a bridge member, and a first and second support members movably coupled to the base and the bridge member to surround size-variable an opening for accommodating a care giver's finger therein. A measurement device is coupled to the base and with a probe projecting toward the opening for contacting the finger for vital sign measurement and monitoring. Resilient members are coupled between the base, the bridge member and the first and second support members to bias the base, the bridge member and the first and second support members moving toward each other to grip the finger to maintain proper contact of the probe to the finger.

Abstract: The present disclosure belongs to the technical field of porous membrane material preparation, and specifically relates to a reverse osmosis composite membrane with an ultrathin desalting layer and a preparation method thereof; the intermediate layer is introduced after modifying the polysulfone base membrane, the modified polysulfone base membrane support layer may strengthen the bonding to the desalting layer through a covalent bond, and the thickness of the desalting layer is reduced to be ?10 nm, so that the desalination rate of the membrane is not greatly affected while increasing the membrane flux. Compared with the membrane having a conventional thickness of the desalting layer, the water flux of the reverse osmosis composite membrane with an ultrathin desalting layer may be increased by about 0.5 times, while the desalination rate has a small change.

Abstract: Methods, systems, and devices for wireless communications are described. A user equipment (UE) may establish one or more wireless connections for different subscriptions with a base station. The UE may receive an indication of a temporary mobile subscription identifier (TMSI) from the base station during a registration procedure. The UE may calculate a paging occasion (PO) based on the TMSI and may determine the PO fails to satisfy a threshold timing value. The UE may transmit one or more registration request to trigger additional registration procedures in which base station may transmit a new TMSI. The UE may calculate an updated PO based on the new TMSI. The UE may periodically receive one or more paging messages from the base station in a set of POs based on calculating the updated PO.

Abstract: In wireless communication, an improved change of a schedule request (“SR”) resource configuration is provided. The SR resource configuration may be transmitted from a basestation to user equipment (“UE”) and may include a parameter for the configuring of one or more SRs. A validity of the SR resource configuration is determined based on predefined information or high layer signaling.

Abstract: An interaction method and apparatus, an electronic device, and a computer readable storage medium are provided according to the embodiments of the present disclosure. The interaction method includes: displaying an object recognition component on a first page; jumping from the first page to a second page in response to detecting a trigger signal to the object recognition component; displaying a scan area on the second page to recognize an object in the scan area; displaying, in response to recognizing the object in the scan area, a result display component corresponding to a quantity of the recognized object on the second page; and jumping from the second page to a third page in response to detecting a trigger signal to the result display component, where a content of the third page is related to an object corresponding to the result display component.

Abstract: An assembly system is provided for automotive lamps and an operation method thereof. The assembly system includes two kinds of functional robots and many functional stations, and it uses the functional robots to transfer workpieces between the various functional stations to realize automatic gluing, fastening and whole lamp performance testing, etc., thereby reducing the amount of manual intervention and improving process integration. Further, the assembly system may provide an assembly system with a two-sided assembly line operating simultaneously, which greatly improves the working efficiency of thereof.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a multi-subscriber identity module (SIM) user equipment (UE) may communicate, using a first SIM, on a plurality of component carriers. The multi-SIM UE may select a first subset of component carriers from the plurality of component carriers based at least in part on a component carrier prioritization. The multi-SIM UE may identify an amount of memory available to a second SIM. The multi-SIM UE may tune away, based at least in part on the amount of memory available to the second SIM, from a second subset of component carriers The first subset of component carriers may be different from the second subset of component carriers. Numerous other aspects are described.

Abstract: Methods, systems, and devices for wireless communication are described. A user equipment (UE) may be configured with two subscriber identity modules (SIMs). The UE may select a synchronization beam associated with a random access occasion of a first SIM based on the random access occasion not overlapping in time with a reception opportunity (e.g., a paging occasion) of the second SIM. In some examples, the UE may select the synchronization beam based on an identified signal quality of the synchronization beam (e.g., in comparison to other available synchronization beams that are non-overlapping with the reception opportunity). The UE may perform a random access procedure (e.g., using the first SIM) during the random access occasion associated with the selected synchronization beam and, in some cases, may also monitor (e.g., using the second SIM) resources associated with the paging opportunity.