Abstract: A display case door includes a panel assembly with a first transparent pane and a second transparent pane. The first transparent pane includes flanges extending from each of a first edge and a second edge of a shaped portion. The second transparent pane is adhered to both flanges of the first pane to define a space between facing surfaces of the second transparent pane and the shaped portion of the first transparent pane and extending between openings at opposite ends of the panel assembly. Caps are coupled to the panel assembly and cover the openings at each of the first end and second end. The door further includes a hinge coupled to one of the flanges, a door handle secured to a surface of one of the flanges, and an edge guard coupled along an edge of at least one of the flanges.

Abstract: The present invention provides an apparatus for cutting a material, comprising: a frame body installed on a conveying path of a material; a cutting means, mounted on the frame body, for cutting an end portion of the material being conveyed; a laser preheating means for preheating the material by irradiating a laser beam onto the material before being conveyed to the cutting means; and a blocking and reflection means for blocking the laser beams reflected to the cutting means and re-reflecting the laser beam to the material.

Abstract: A display case door includes a panel assembly with a first transparent pane and a second transparent pane. The first transparent pane includes flanges extending from each of a first edge and a second edge of a shaped portion. The second transparent pane is adhered to both flanges of the first pane to define a space between facing surfaces of the second transparent pane and the shaped portion of the first transparent pane and extending between openings at opposite ends of the panel assembly. Caps are coupled to the panel assembly and cover the openings at each of the first end and second end. The door further includes a hinge coupled to one of the flanges, a door handle secured to a surface of one of the flanges, and an edge guard coupled along an edge of at least one of the flanges.

Abstract: A side trimming apparatus including a cutting unit which is installed on at least one side of a steel plate being transferred and trims a side of the steel plate by mechanical cutting and a laser processing unit which is installed in front of the cutting unit and emits a laser beam to a portion of the steel plate to be cut to form a groove at the portion to be cut or preheat the portion to be cut, and a side trimming method using the same are provided.

Abstract: The present invention relates to a dimension measuring device and a dimension measuring method, the dimension measuring device comprising: a moving unit for moving two sheets of material; a plurality of range finders installed at a preset interval along the direction of traveling of the material, so as to measure the distance from the side surfaces of the material; and an imaging device installed to take images between the first and second range finders, which are installed at the first and second locations with reference to the entry side of the material, respectively.

Abstract: A device according to an embodiment of the present invention for detecting an internal flaw in a steel plate by using a height-adjustable ultrasonic sensor may comprise: a spray nozzle installed a certain distance apart from the bottom of a steel plate, for spraying a medium toward the steel plate and forming a medium column; an ultrasonic sensor installed inside the spray nozzle, for transmitting and receiving ultrasonic waves for detecting flaws in the steel plate through the medium column; a flaw detecting unit for detecting the presence of internal flaws in the steel plate on the basis of the transmitted and received ultrasonic waves; and a driving unit installed inside the spray nozzle, for adjusting the distance between the ultrasonic sensor and the steel plate according to the thickness of the steel plate.

Abstract: An apparatus and a method for ultrasonic detection are provided. The apparatus includes an injection nozzle which is installed below a steel plate being transported and forms a medium column by jet a medium toward the steel plate, an ultrasonic probe which is installed in the injection nozzle and transmits and receives ultrasonic waves for detecting flaws in the steel plate through the medium column, and a medium circulation unit which reclaims the medium which falls from the medium column and circulates the reclaimed medium to the injection nozzle.

Abstract: A side trimming apparatus including a cutting unit which is installed on at least one side of a steel plate being transferred and trims a side of the steel plate by mechanical cutting and a laser processing unit which is installed in front of the cutting unit and emits a laser beam to a portion of the steel plate to be cut to form a groove at the portion to be cut or preheat the portion to be cut, and a side trimming method using the same are provided.

Abstract: An apparatus and a method for ultrasonic detection are provided. The apparatus includes an injection nozzle which is installed below a steel plate being transported and forms a medium column by jet a medium toward the steel plate, an ultrasonic probe which is installed in the injection nozzle and transmits and receives ultrasonic waves for detecting flaws in the steel plate through the medium column, and a medium circulation unit which reclaims the medium which falls from the medium column and circulates the reclaimed medium to the injection nozzle.

Abstract: There is provided a method and apparatus for plating high strength steel such as advanced high strength steel (AHSS) after irradiating the high strength steel with at least one of laser light and plasma to remove Si/Mn/Al oxides from the surface of the high strength steel, modify the surface of the high strength steel, or make the surface of the high strength steel suitable for a post process such as a zinc plating process. For this, a plating method includes heating high strength steel; treating a surface of the high strength steel with plasma to remove at least one of a Mn oxide, an Al oxide, and an Si oxide formed on the surface of the high strength steel during the heating of the high strength steel; and plating the surface-treated high strength steel.

Abstract: System and method for handoff between different types of networks. A communication session of a user equipment may be handed off from a first network to a second network based on a network condition of the first network. A network information may be transmitted from the first network and the network condition of the first network may be determined based on received network information. The network information may include information of an adaptive multi-rate (AMR) mode assigned for providing a corresponding service, and the information of the AMR mode may be assigned based on the network condition of the first network and may be associated with a bit-rate for speech coding. A handoff from the first network to the second network may be initiated when the network condition of the first network is determined to be poor.

Abstract: There is provided a method and apparatus for plating high strength steel such as advanced high strength steel (AHSS) after irradiating the high strength steel with at least one of laser light and plasma to remove Si/Mn/Al oxides from the surface of the high strength steel, modify the surface of the high strength steel, or make the surface of the high strength steel suitable for a post process such as a zinc plating process. For this, a plating method includes heating high strength steel; treating a surface of the high strength steel with plasma to remove at least one of a Mn oxide, an Al oxide, and an Si oxide formed on the surface of the high strength steel during the heating of the high strength steel; and plating the surface-treated high strength steel.

Abstract: System and method for handoff between different types of networks. A communication session of a user equipment may be handed off from a first network to a second network based on a network condition of the first network. A network information may be transmitted from the first network and the network condition of the first network may be determined based on received network information. The network information may include information of an adaptive multi-rate (AMR) mode assigned for providing a corresponding service, and the information of the AMR mode may be assigned based on the network condition of the first network and may be associated with a bit-rate for speech coding. A handoff from the first network to the second network may be initiated when the network condition of the first network is determined to be poor.

Abstract: An optical wireless communications network connects a plurality of communication cells, which are defined by dividing a local communication area, for enabling optical wireless communication in each of the communication cells. An optical signal transmitter is installed in each communication cell for irradiating the cell with a data-modulated optical signal to perform data transmission to a terminal located therein. The optical signal transmitter comprises an optical signal source for outputting the data-modulated optical signal, and an optical signal diffuser with a concave inside surface facing the output end of the optical signal source for diffusing and reflecting the data-modulated optical signal to irradiate the cell.

Abstract: A chuck adapted to support a substrate includes an array of glass bars spaced apart and each having a number of holes in its supporting surface. The holes in the supporting surfaces are connected to a common conduit that is supplied with air to provide an air cushion to support the substrate during loading and positioning operations. Scrubbers in contact with one or more edges of the substrate are used to locate the substrate precisely relative to a mechanical reference. After the substrate is positioned at the desired location, the common conduit is separately supplied with vacuum to provide a suction force to hold the substrate to the chuck. The array of glass bars are designed to operate in conjunction with a multi-light backlight system that provides uniform illumination for areas of the substrate that are supported above a glass bar as well as for areas of the substrate that are positioned between the glass bars.

Abstract: A method of forming a notched gate structure comprising a semiconductor substrate having a first oxide layer formed thereon. A first conductive layer is formed on the semiconductor substrate. A portion of the first conductive layer and a portion of the first oxide layer are removed to form first gate structures. First spacers are formed on the sidewalls of the gate structure. A second oxide layer is formed on the semiconductor substrate. A second conductive layer is formed on the surface of the second oxide layer. The first gate structures and the second conductive layer formed thereon are then removed to form a second gate structure. Second spacers are formed on the sidewalls of the second gate structure to complete the notched gate structure process. The method of the present invention reduces the capacitance between the gate and the source/drain extension, and simplifies the process, thereby increasing the controllability of the process.

Abstract: A method of fabricating self-aligned contact structures comprising providing a semiconductor substrate having at least two conductive structures thereon. The conductive structures are positioned beside the desired self-aligned contact structures having a plurality of masking structures thereon. Each masking structure has a top surface and a vertical surface. A dielectric layer is formed over the semiconductor substrate. A portion of the dielectric layer is removed by etching to expose the top surface and the vertical surface of each masking structure. A plurality of spacers is formed on the exposed vertical surface. While subsequently forming the self-aligned contact structures between two conductive structures, the peripheral of the nitride spacers has the low parasitic capacitance.

Abstract: A semiconductor wafer cleaning apparatus comprises an outer tank, a cleaning tank provided within the outer tank, a wafer carrier provided within the cleaning tank, a plurality of jet nozzles directed toward the wafer carrier, a main pipe connected to the jet nozzles, a circulating pump connected to the main pipe and the outer tank for circulating a cleansing solution from the outer tank, through the main pipe, the jet nozzles, and the cleaning tank, and a filter for filtering the circulated cleansing solution.

Abstract: A semiconductor wafer cleaning apparatus comprises an outer tank, a cleaning tank provided within the outer tank, a wafer carrier provided within the cleaning tank, a plurality of jet nozzles directed toward the wafer carrier, a main pipe connected to the jet nozzles, a circulating pump connected to the main pipe and the outer tank for circulating a cleansing solution from the outer tank, through the main pipe, the jet nozzles, and the cleaning tank, and a filter for filtering the circulated cleansing solution.

Abstract: A semiconductor wafer cleaning apparatus comprises an outer tank, a cleaning tank provided within the outer tank, a wafer carrier provided within the cleaning tank, a plurality of jet nozzles directed toward the wafer carrier, a main pipe connected to the jet nozzles, a circulating pump connected to the main pipe and the outer tank for circulating a cleansing solution from the outer tank, through the main pipe, the jet nozzles, and the cleaning tank, and a filter for filtering the circulated cleansing solution.