Patents by Inventor Jun Kayamori

Jun Kayamori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device including semiconductor chips with different thickness
    Patent number: 8372693
    Abstract: In a stacked-type semiconductor device, a first semiconductor device and at least one second semiconductor device are stacked. The first semiconductor device includes a wiring board and a first semiconductor chip mounted on the wiring board. The second semiconductor device includes a wiring board and a second semiconductor chip mounted on the wiring board. The thickness of the second semiconductor chip of each second semiconductor device is thicker than the thickness of the first semiconductor chip.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: February 12, 2013
    Assignee: Elpida Memory, Inc.
    Inventors: Mitsuaki Katagiri, Hisashi Tanie, Jun Kayamori, Dai Sasaki, Hiroshi Moriya
  • SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CHIPS WITH DIFFERENT THICKNESS
    Publication number: 20120302007
    Abstract: In a stacked-type semiconductor device, a first semiconductor device and at least one second semiconductor device are stacked. The first semiconductor device includes a wiring board and a first semiconductor chip mounted on the wiring board. The second semiconductor device includes a wiring board and a second semiconductor chip mounted on the wiring board. The thickness of the second semiconductor chip of each second semiconductor device is thicker than the thickness of the first semiconductor chip.
    Type: Application
    Filed: June 29, 2012
    Publication date: November 29, 2012
    Applicant: ELPIDA MEMORY, INC.
    Inventors: Mitsuaki KATAGIRI, Hisashi TANIE, Jun KAYAMORI, Dai SASAKI, Hiroshi MORIYA
  • Semiconductor device including semiconductor chips with different thickness
    Patent number: 8237251
    Abstract: In a stacked-type semiconductor device, a first semiconductor device and at least one second semiconductor device are stacked. The first semiconductor device includes a wiring board and a first semiconductor chip mounted on the wiring board. The second semiconductor device includes a wiring board and a second semiconductor chip mounted on the wiring board. The thickness of the second semiconductor chip of each second semiconductor device is thicker than the thickness of the first semiconductor chip.
    Type: Grant
    Filed: January 22, 2009
    Date of Patent: August 7, 2012
    Assignee: Elpida Memory, Inc.
    Inventors: Mitsuaki Katagiri, Hisashi Tanie, Jun Kayamori, Dai Sasaki, Hiroshi Moriya
  • SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CHIPS WITH DIFFERENT THICKNESS
    Publication number: 20090184409
    Abstract: In a stacked-type semiconductor device, a first semiconductor device and at least one second semiconductor device are stacked. The first semiconductor device includes a wiring board and a first semiconductor chip mounted on the wiring board. The second semiconductor device includes a wiring board and a second semiconductor chip mounted on the wiring board. The thickness of the second semiconductor chip of each second semiconductor device is thicker than the thickness of the first semiconductor chip.
    Type: Application
    Filed: January 22, 2009
    Publication date: July 23, 2009
    Applicant: Elpida Memory, Inc.
    Inventors: Mitsuaki KATAGIRI, Hisashi Tanie, Jun Kayamori, Dai Sasaki, Hiroshi Moriya