Patents by Inventor Jun Koike
Jun Koike has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140128542Abstract: Disclosed is an inorganic composition for transferring a fine unevenness by which a fine unevenness made of an inorganic material capable of controlling a refractive index can be fabricated through a suitable transfer process. The composition according to the present invention contains a silicone compound and at least two types of metal alkoxides, wherein the metal alkoxides include a metal alkoxide having a metal species M1 (where M1 denotes at least one metal element selected from a group consisting of Ti, Zr, Zn, Sn, B, In, and Al) and a metal alkoxide having a metal species Si. In addition, a ratio between a molarity CM1 of the metal alkoxide having the metal species M1 and a molarity CSi of the metal alkoxide having the metal species Si in the inorganic composition for transferring a fine unevenness satisfies a condition of 0.2?CM1/CSi?24.Type: ApplicationFiled: June 18, 2012Publication date: May 8, 2014Applicant: ASAHI KASEI KABUSHIKI KAISHAInventor: Jun Koike
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Publication number: 20130319522Abstract: To provide a fine-structure layered product, and a preparation method of a fine-structure layered product using the fine-structure layered product for enabling a fine concavo-convex structure excellent in environmental resistance, weather resistance and long-term stability to be formed with a large area and high productivity, and provide a manufacturing method of a fine-structure product for enabling a large area to be made with high productivity, a fine-structure layered product of the invention is provided with a substrate, a resin layer that is formed on one main surface of the substrate and that has a fine concavo-convex structure on its surface, and an inorganic layer that is provided on the fine concavo-convex structure of the resin layer and that contains a sol-gel material having a fine concavo-convex structure in a shape associated with the fine concavo-convex structure of the resin layer, where a fluorine element concentration (Es) in a region on the inorganic layer side of the resin layer is higherType: ApplicationFiled: December 8, 2011Publication date: December 5, 2013Applicant: ASAHI KASEI KABUSHIKI KAISHAInventors: Jun Koike, Ryuichi Ito, Fujito Yamaguchi
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Patent number: 8512608Abstract: An injection molding device comprises a mold-clamping device that operates in both of a mold-closing state in which a mold is closed under predetermined pressure and a micro mold-open state in which the mold is held in a state in which the mold is open from the mold-closing state by a predetermined amount, an injection device that molds a molded product by injecting a molding material into the mold set to the mold-closing state or the micro mold-open state and a controller that changes a stop position of the mold in the micro mold-open state in accordance with a change of a mold-closing position when the mold-closing position of the mold in the mold-closing state is changed.Type: GrantFiled: May 16, 2011Date of Patent: August 20, 2013Assignee: Toshiba Kikai Kabushiki KaishaInventors: Jun Koike, Harumichi Tokuyama, Harunobu Inami, Yasumasa Sugiyama, Mitsuru Koga
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Patent number: 8486315Abstract: An injection molding device comprises a mold-clamping device that operates in both of a mold-closing state in which a mold is closed under predetermined pressure and a micro mold-open state in which the mold is held in a state in which the mold is open from the mold-closing state by a predetermined amount, an injection device that molds a molded product by injecting a molding material into the mold set to the mold-closing state or the micro mold-open state and a controller that changes a stop position of the mold in the micro mold-open state in accordance with a change of a mold-closing position when the mold-closing position of the mold in the mold-closing state is changed.Type: GrantFiled: May 16, 2011Date of Patent: July 16, 2013Assignee: Toshiba Kikai Kabushiki KaishaInventors: Jun Koike, Harumichi Tokuyama, Harunobu Inami, Yasumasa Sugiyama, Mitsuru Koga
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Publication number: 20130101815Abstract: Disclosed is a layered product for metamaterial transfer for transferring a metamaterial layer onto a substrate, including: a resin mold having a fine convex-concave structure on a surface; and an inorganic layer as a metamaterial layer including at least one dielectric layer and at least one metal layer deposited on a surface of the resin mold, wherein resin of the resin mold contains fluorine, and a ratio between an average elemental fluorine concentration Eb of the resin and an elemental fluorine concentration Es of the surface of the resin mold satisfies the following equation: 200?Es/Eb?5.0.Type: ApplicationFiled: September 11, 2012Publication date: April 25, 2013Applicant: ASAHI KASEI KABUSHIKI KAISHAInventors: Keigo TAKEGUCHI, Masanori TSURUTA, Jun KOIKE
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Publication number: 20130049255Abstract: To provide a resin mold which is excellent in adhesion to a substrate, excellent in release properties from a transfer material resin, further excellent in durability of the resin mold itself, and which endures repetition transfer to the transfer material resin, a resin mold of the invention is a resin mold having a fine concavo-convex structure on the surface, and is characterized in that the fluorine element concentration (Es) in a resin mold surface portion is the average fluorine element concentration (Eb) in the resin forming the resin mold or more.Type: ApplicationFiled: March 9, 2011Publication date: February 28, 2013Applicant: ASAHI KASEI KABUSHIKI KAISHAInventors: Shinji Matsumoto, Jun Koike
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Publication number: 20110285046Abstract: An injection molding device comprises a mold-clamping device that operates in both of a mold-closing state in which a mold is closed under predetermined pressure and a micro mold-open state in which the mold is held in a state in which the mold is open from the mold-closing state by a predetermined amount, an injection device that molds a molded product by injecting a molding material into the mold set to the mold-closing state or the micro mold-open state and a controller that changes a stop position of the mold in the micro mold-open state in accordance with a change of a mold-closing position when the mold-closing position of the mold in the mold-closing state is changed.Type: ApplicationFiled: May 16, 2011Publication date: November 24, 2011Applicant: TOSHIBA KIKAI KABUSHIKI KAISHAInventors: Jun KOIKE, Harumichi Tokuyama, Harunobu Inami, Yasumasa Sugiyama, Mitsuru Koga
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Patent number: 7867415Abstract: Used in a method of this invention is a die clamping unit, which comprises a tie bar movably attached to a stationary platen, a halfnut positioning servomotor which advances and retreats to the tie bar, a halfnut which is provided on a movable platen and fixes the movable platen and the tie bar together by engaging the tie bar, an engaging mechanism which engages the halfnut with the tie bar, a hydraulic die clamping cylinder which presses the stationary platen and the movable platen, and a control device which controls the halfnut positioning servomotor and the hydraulic cylinder. The control device drives the halfnut positioning servomotor to remove a clearance between the halfnut and an engaging groove of the tie bar before a die clamping process carried out by the hydraulic cylinder.Type: GrantFiled: June 17, 2009Date of Patent: January 11, 2011Assignee: Toshiba Kikai Kabushiki KaishaInventors: Jun Koike, Takaki Miyauchi, Makoto Nishizawa, Nobuyuki Muroi, Haruyuki Matsubayashi
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Patent number: 7820084Abstract: A method of molding a minute shape, in which at least one of a pair of dies is provided with an uneven section of a minute shape on a molding surface thereof, clamping of the pair of dies is stopped immediately before the dies are completely clamped, a resin is injected into a cavity, and thereafter the dies are completely clamped to thereby transcribe the shape of the uneven section onto the resin includes preparing a plurality of transcription dies each provided with the uneven section on a molding surface thereof, heating one of the transcription dies which is not used to mold a product by a heating unit, and exchanging the transcription dies with each other, at a point in time at which molding is completed, to thereby mold the product continuously.Type: GrantFiled: November 5, 2008Date of Patent: October 26, 2010Assignee: Toshiba Kikai Kabushiki KaishaInventors: Atsushi Takemoto, Jun Koike
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Publication number: 20090261496Abstract: Used in a method of this invention is a die clamping unit, which comprises a tie bar movably attached to a stationary platen, a halfnut positioning servomotor which advances and retreats to the tie bar, a halfnut which is provided on a movable platen and fixes the movable platen and the tie bar together by engaging the tie bar, an engaging mechanism which engages the halfnut with the tie bar, a hydraulic die clamping cylinder which presses the stationary platen and the movable platen, and a control device which controls the halfnut positioning servomotor and the hydraulic cylinder. The control device drives the halfnut positioning servomotor to remove a clearance between the halfnut and an engaging groove of the tie bar before a die clamping process carried out by the hydraulic cylinder.Type: ApplicationFiled: June 17, 2009Publication date: October 22, 2009Applicant: TOSHIBA KIKAI KABUSHIKI KAISHAInventors: Jun Koike, Takaki Miyauchi, Makoto Nishizawa, Nobuyuki Muroi, Haruyuki Matsubayashi
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Patent number: 7575426Abstract: A stationary platen unit and a movable platen unit each include a platen body, a load transmission portion, a die fixing plate, and a backup member. The backup member is located between the platen body and the die fixing plate. The backup member is movable between a first position in which it is in contact with both the die fixing plate and the platen body and a second position in which it is separate from the die fixing plate and/or the platen body. When a large die set is attached to the die fixing plate, the backup member is situated in the first position. When a small die set is attached to the die fixing plate, the backup member is moved to the second position.Type: GrantFiled: December 26, 2007Date of Patent: August 18, 2009Assignee: Toshiba Kikai Kabushiki KaishaInventors: Noriyuki Sasaki, Jun Koike, Takaki Miyauchi
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Patent number: 7566214Abstract: Used in a method of this invention is a die clamping unit, which comprises a tie bar movably attached to a stationary platen, a halfnut positioning servomotor which advances and retreats the tie bar, a halfnut which is provided on a movable platen and fixes the movable platen and the tie bar together by engaging the tie bar, an engaging mechanism which engages the halfnut with the tie bar, a hydraulic die clamping cylinder which presses the stationary platen and the movable platen, and a control device which controls the halfnut positioning servomotor and the hydraulic cylinder. The control device drives the halfnut positioning servomotor to remove a clearance between the halfnut and an engaging groove of the tie bar before a die clamping process carried out by the hydraulic cylinder.Type: GrantFiled: January 28, 2005Date of Patent: July 28, 2009Assignee: Toshiba Kikai Kabushiki KaishaInventors: Jun Koike, Takaki Miyauchi, Makoto Nishizawa, Nobuyuki Muroi, Haruyuki Matsubayashi
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Publication number: 20090115107Abstract: A method of molding a minute shape, in which at least one of a pair of dies is provided with an uneven section of a minute shape on a molding surface thereof, clamping of the pair of dies is stopped immediately before the dies are completely clamped, a resin is injected into a cavity, and thereafter the dies are completely clamped to thereby transcribe the shape of the uneven section onto the resin includes preparing a plurality of transcription dies each provided with the uneven section on a molding surface thereof, heating one of the transcription dies which is not used to mold a product by a heating unit, and exchanging the transcription dies with each other, at a point in time at which molding is completed, to thereby mold the product continuously.Type: ApplicationFiled: November 5, 2008Publication date: May 7, 2009Applicant: TOSHIBA KIKAI KABUSHIKI KAISHAInventors: Atsushi Takemoto, Jun Koike
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Patent number: 7416403Abstract: A die clamping unit includes a stationary platen, a tie bar which is attached to the stationary platen, a movable platen which is movable forwards and backwards along the tie bar with respect to the stationary platen, a first servomotor which moves the movable platen away from the stationary platen in a core-back operation, a second servomotor which moves the movable platen forwards and backwards to perform die-opening and -closing, and a control device which drives the first servomotor to move the movable platen away from the stationary platen and which drives the second servomotor to apply a force to the movable platen in the direction toward the stationary platen in the core-back operation.Type: GrantFiled: April 11, 2006Date of Patent: August 26, 2008Assignee: Toshiba Kikai Kabushiki KaishaInventors: Jun Koike, Takaki Miyauchi, Makoto Nishizawa, Nobuyuki Muroi
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Publication number: 20080160131Abstract: A stationary platen unit and a movable platen unit each include a platen body, a load transmission portion, a die fixing plate, and a backup member. The backup member is located between the platen body and the die fixing plate. The backup member is movable between a first position in which it is in contact with both the die fixing plate and the platen body and a second position in which it is separate from the die fixing plate and/or the platen body. When a large die set is attached to the die fixing plate, the backup member is situated in the first position. When a small die set is attached to the die fixing plate, the backup member is moved to the second position.Type: ApplicationFiled: December 26, 2007Publication date: July 3, 2008Inventors: Noriyuki SASAKI, Jun Koike, Takaki Miyauchi
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Patent number: 7373777Abstract: A die drive unit has a cylinder mechanism which hydraulically drives a piston member and an additional drive mechanism which drives the piston member by means of a drive source other than a hydraulic one. A first oil chamber is formed on one side of the piston member. A second oil chamber and a third oil chamber are formed on the other side of the piston member. The first oil chamber and the second oil chamber are connected to each other by an oil passage. The piston pressure receiving area of the first oil chamber is equal to the sum of those of the second and third oil chambers.Type: GrantFiled: October 28, 2005Date of Patent: May 20, 2008Assignee: Toshiba Kikai Kabushiki KaishaInventors: Jun Koike, Takaki Miyauchi, Haruhiko Kikuchi
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Publication number: 20080110507Abstract: A check ring is mounted around a shaft of a screw tip that is mounted on a front part of a screw, whereby a resin is prevented from flowing back from ahead of a conical portion toward the screw. Projections are provided on a front end surface of the check ring. In measurement, a rear end surface of the conical portion of the screw tip and respective end surfaces of the projections are brought into contact with one another, whereby gaps are created between the screw tip and respective root surfaces of teeth of the check ring. By doing this, resin passages can be secured around contact surfaces between the rear end surface of the screw tip and the respective end surfaces of the projections of the check ring.Type: ApplicationFiled: November 13, 2007Publication date: May 15, 2008Applicant: TOSHIBA KIKAI KABUSHIKI KAISHAInventors: Akira Yoshinaga, Shigehiro Saito, Haruyuki Matsubayashi, Keisuke Mori, Jun Koike
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Patent number: 7168946Abstract: A support device for a movable die comprises a linear guide, a base, a movable platen, a driving mechanism which linearly moves the base, and a securing mechanism which secures the movable platen to the base. The base is guided by the linear guide and is linearly movable. A movable die is mounted to the movable platen, and the movable platen is mounted on the base. When the movable platen undergoes a deformation with a pressure of die clamping, the securing mechanism absorbs a displacement of the movable platen in a base movement direction or a vertical direction due to the deformation.Type: GrantFiled: January 28, 2005Date of Patent: January 30, 2007Assignee: Toshiba Kikai Kabushiki KaishaInventors: Jun Koike, Takaki Miyauchi, Noriyuki Sasaki
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Publication number: 20060246172Abstract: A die clamping unit includes a stationary platen, a tie bar which is attached to the stationary platen, a movable platen which is movable forwards and backwards along the tie bar with respect to the stationary platen, a first servomotor which moves the movable platen away from the stationary platen in a core-back operation, a second servomotor which moves the movable platen forwards and backwards to perform die-opening and -closing, and a control device which drives the first servomotor to move the movable platen away from the stationary platen and which drives the second servomotor to apply a force to the movable platen in the direction toward the stationary platen in the core-back operation.Type: ApplicationFiled: April 11, 2006Publication date: November 2, 2006Inventors: Jun Koike, Takaki Miyauchi, Makoto Nishizawa, Nobuyuki Muroi
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Publication number: 20060228438Abstract: A supporting device according to the embodiment comprises a linear guide and a mounting base configured to move linearly, guided by the linear guide, a movable portion mounted on the mounting base, a servomotor having a ball screw which causes the mounting base to move the movable portion linearly, and a plurality of wedges located between the movable portion and the mounting base in front of and/or at the back of the movable portion and configured to adjust inclinations of the movable portion in an up-down direction and in a left-right direction within a horizontal plane.Type: ApplicationFiled: March 30, 2006Publication date: October 12, 2006Applicant: TOSHIBA KIKAI KABUSHIKI KAISHAInventors: Jun Koike, Takaki Miyauchi, Noriyuki Sasaki