Patents by Inventor Jun-Lung Hsi

Jun-Lung Hsi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thickening method of an electroforming shim
    Publication number: 20070039826
    Abstract: A thickening method of an electroforming shim is provided to increase the thickness of a metal shim. In this embodiment, an active solder with a rare earth element is used to increase the moisture on the substrate surface for the solder during the combining process. Afterwards the oxides of the rare earth element are expelled by mechanical stirring to produce a clean contact surface. The melted fillers moisturize on the substrate surface to achieve the combination.
    Type: Application
    Filed: August 18, 2005
    Publication date: February 22, 2007
    Inventors: Chia-Hua Chang, Cherng-Yuh Su, Jen-Chin Wu, Jun-Lung Hsi