Patents by Inventor Jun Mitsudo

Jun Mitsudo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230165476
    Abstract: A non-contact blood vessel analyzer includes an image acquisition device and an image processing device. The image acquisition device acquires an image which is a moving image or successive still images of a blood vessel. The image processing device detects a beat and a thrill from temporal change of an index derived from brightness and/or chromaticity of the image.
    Type: Application
    Filed: October 29, 2021
    Publication date: June 1, 2023
    Inventors: Takunori SHIMAZAKI, Yoshifumi KAWAKUBO, Jun MITSUDO, Yuhei HAYASHI, Shinya HATABE
  • Patent number: 6787378
    Abstract: A method is provided that allows a simple and inexpensive apparatus to measure the uniformity of the height-directional positions of spheres or hemispheres such as bump electrodes of a semiconductor device. The degree of focus is calculated from an image of bump electrodes 11a and 11b acquired at a first focusing position F1 using an imaging system. After that, the bump electrodes 11a and 11b and the imaging system is relatively moved closer or farther, and then the degree of focus is calculated from an image acquired at a second focusing position F2. The degrees of focus at these two focusing positions F1 and F2 are compared with each other. As a result, detected are the contour lines of the horizontal cross sections of the bump electrodes 11a and 11b at the height (F1+F2)/2 of the position of equal degree of focus indicated by PQ. On the basis of the shapes and/or sizes thereof, the height-directional positions of the bump electrodes 11a and 11b are measured.
    Type: Grant
    Filed: October 8, 2003
    Date of Patent: September 7, 2004
    Assignee: NEC Machinery Corporation
    Inventors: Akira Ishii, Jun Mitsudo
  • Publication number: 20040119985
    Abstract: A method is provided that allows a simple and inexpensive apparatus to measure the uniformity of the height-directional positions of spheres or hemispheres such as bump electrodes of a semiconductor device. The degree of focus is calculated from an image of bump electrodes 11a and 11b acquire data first focusing position F1 using an imaging system. After that, the bump electrodes 11a and 11b and the imaging system is relatively moved closer or farther, and then the degree of focus is calculated from an image acquired at a second focusing position F2. The degrees of focus at these two focusing positions F1 and F2 are compared with each other. As a result, detected are the contour lines of the horizontal cross sections of the bump electrodes 11a and 11b at the height (F1+F2)/2 of the position of equal degree of focus indicated by PQ. On the basis of the shapes and/or sizes thereof, the height-directional positions of the bump electrodes 11a and 11b are measured.
    Type: Application
    Filed: October 8, 2003
    Publication date: June 24, 2004
    Inventors: Akira Ishii, Jun Mitsudo