Patents by Inventor Jun Sasaki
Jun Sasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11984730Abstract: This is a technology for non-contact power transmission to the laboratory animal biological information acquisition device 12 embedded in the multiple laboratory animals in the breeding cage 14, and provides the power reception device, which can observe the behavior of laboratory animals from outside without covering the breeding cage 14 with the power transmission side, and which can continuously supply power regardless of the direction and position of the laboratory animals. The secondary coil part 22 includes a magnetic core 31 having a circular cross-section perpendicular to the longitudinal direction, and a plurality of spiral coils 40a and 40b formed by winding a conductor so that the outer shape is substantially rectangular.Type: GrantFiled: June 3, 2019Date of Patent: May 14, 2024Inventors: Fumihiro Sato, Jun Shibuya, Akifusa Yuyama, Shu Sasaki, Yoshiki Furuya, Takehiko Sone, Kenichi Sagara
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Publication number: 20240154359Abstract: A fixing structure of a connector 1 includes a housing 13 and a front holder 15. The front holder 15 includes a detection portion 151, a latching lock 152, and a restriction protrusion 153. The housing 13 includes an accommodation portion 1314, a restriction recessed portion 1315, and a latching portion 1316a. A restriction surface 1533 extending to cross a height direction Z is provided on the restriction protrusion 153, and a contact surface 1315a-1 configured to come into contact with the restriction surface 1533 and support the restriction protrusion 153 is provided on the restriction recessed portion 1315. When the latching lock 152 elastically deforms in the height direction Z, the restriction surface 1533 is in contact with the contact surface 1315a-1.Type: ApplicationFiled: November 7, 2023Publication date: May 9, 2024Applicant: Yazaki CorporationInventors: Yasuhiro SASAKI, Jun ISHIKAWA, Yuki NORO
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Publication number: 20240154360Abstract: A connector includes a housing with a latching lock and a lever latch section which is independent from the latching lock. A partner connector includes a partner housing with a lock section which is latchable by the latching lock. The lever is changeable between a non-latched state and a latched state, wherein when changing the lever from the non-latched state to the latched state, the lever connects the connector to the partner connector so as to cause the connector and the partner connector to approach each other in a forward-rearward direction. The connector is configured to be fixed to the partner connector by the lever being brought into the latched state and by the lock section being brought into a state in which the lock section is latched by the latching lock.Type: ApplicationFiled: November 7, 2023Publication date: May 9, 2024Applicant: Yazaki CorporationInventors: Yasuhiro SASAKI, Jun ISHIKAWA, Yuki NORO
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Patent number: 11958219Abstract: The present disclosure provides a foam molded product and a manufacturing method. The foam molded product is includes a foam body, an insert material having a display unit or a detection unit attached to the foam body, and a surface material affixed to a surface to which at least the insert material is attached. A manufacturing method includes: preparing a pair of molds including a first mold and a second mold; affixing an insert material and a surface material together such that the surface material is in contact with a molding surface of the first mold; closing the pair of molds; injecting a foam resin into a molding space formed by closing the molds; foaming the foam resin to form a foam body; opening the pair of molds; and removing a molded product in which the affixed part and the foam body are integrated.Type: GrantFiled: March 25, 2019Date of Patent: April 16, 2024Assignee: NISSHA CO., LTD.Inventors: Tatsuo Ito, Kenji Okumura, Jun Sasaki, Daichi Hama, Masaru Terashita
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Patent number: 11938729Abstract: A liquid ejection head includes a base plate and at least two device chips in which ejection ports for ejecting a liquid are formed and which are disposed on the base plate. At least one first reference mark is provided on the base plate. A second reference mark is provided on each of the device chips. At least one space is formed between adjacent device chips. The second reference marks and the first reference mark present in the space are disposed on an array axis along which the device chips are arrayed.Type: GrantFiled: August 3, 2021Date of Patent: March 26, 2024Assignee: Canon Kabushiki KaishaInventors: Kazuhiro Asai, Koji Sasaki, Jun Yamamuro, Shingo Nagata
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Publication number: 20240092080Abstract: A liquid ejection head includes a base plate and at least two device chips in which ejection ports for ejecting a liquid are formed and which are disposed on the base plate. At least one first reference mark is provided on the base plate. A second reference mark is provided on each of the device chips. At least one space is formed between adjacent device chips. The second reference marks and the first reference mark present in the space are disposed on an array axis along which the device chips are arrayed.Type: ApplicationFiled: November 22, 2023Publication date: March 21, 2024Inventors: Kazuhiro Asai, Koji Sasaki, Jun Yamamuro, Shingo Nagata
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Publication number: 20240083167Abstract: A liquid ejection head includes a base plate and at least two device chips in which ejection ports for ejecting a liquid are formed and which are disposed on the base plate. At least one first reference mark is provided on the base plate. A second reference mark is provided on each of the device chips. At least one space is formed between adjacent device chips. The second reference marks and the first reference mark present in the space are disposed on an array axis along which the device chips are arrayed.Type: ApplicationFiled: November 22, 2023Publication date: March 14, 2024Inventors: Kazuhiro Asai, Koji Sasaki, Jun Yamamuro, Shingo Nagata
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Publication number: 20240031713Abstract: A resin housing having an electronic component and a method for manufacturing the same are disclosed. The resin housing includes an electronic component mounting film that includes a housing made of resin, a base film disposed along an inner surface of the housing, a circuit pattern layer formed on at least a surface opposite to a side of the housing of the base film, and an electronic component connected to the circuit pattern layer and mounted on a surface opposite to the side of the housing of the base film. The electronic component mounting film is integrated with the housing. An impact absorbing layer covers the electronic component of the electronic component mounting film and a periphery of the electronic component. The circuit pattern layer of the electronic component mounting film is not bent around a portion on which the electronic component is mounted.Type: ApplicationFiled: November 9, 2021Publication date: January 25, 2024Applicant: NISSHA CO.,LTD.Inventors: Chuzo TANIGUCHI, Jun SASAKI, Eiji KAWASHIMA, Yasuisa TAKINISHI
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Patent number: 11842861Abstract: A switch cap for a switch device that can reduce a pressing error of a switch is provided. A three-dimensional first cap main body moves by a force applied to a first abutting portion from a finger which is an operator. A first sensor is disposed in the first cap main body, and detects abutting or approach of the finger to the first abutting portion. A first transmission member is fixed to the inside of the first cap main body, and moves together with the first cap main body for first switching to transmit movement of the first cap main body to a push button which is a predetermined location of a switch device. A first sensor is formed in a flexible printed circuit board (FPC) disposed in the first cap main body, and the FPC is fixed by the first transmission member and the first cap main body.Type: GrantFiled: March 22, 2021Date of Patent: December 12, 2023Assignee: NISSHA CO., LTD.Inventors: Chuzo Taniguchi, Eiji Kawashima, Jun Sasaki
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Publication number: 20230395000Abstract: A first groove is formed in a first main surface of a light guide member. A decorative layer is molded with the light guide member and provided on a second main surface of the light guide member. The decorative layer includes a first light-emitting portion that radiates the visible light emitted from a first light-emitting element from the light guide member and a second light-emitting portion that radiates the visible light emitted from the second light-emitting element from the light guide member. The first light absorbing member is disposed on a first groove bottom of the first groove, and has an absorptivity of visible light, which is higher than that of the light guide member. The first groove is positioned to block an optical path from the first light-emitting element toward a second region and an optical path from the second light-emitting element toward a first region.Type: ApplicationFiled: October 14, 2021Publication date: December 7, 2023Applicant: NISSHA CO.,LTD.Inventors: Shun TANAKA, Masaru TERASHITA, Jun SASAKI, Chuzo TANIGUCHI, Kenichiro SUZUKI
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Publication number: 20230297086Abstract: The environmental change proposing system includes: an acquiring unit configured to acquire processing information regarding processing of a conveyance task from a conveyance robot that has executed the conveyance task using an environmental map; an evaluation computing unit configured to perform an evaluation computation for evaluating, based on the processing information, a virtual layout in which the arrangement of installation objects on the environmental map has been changed; and an output unit configured to generate and output proposal information regarding a change in arrangement of the installation objects, based on an evaluation result of the evaluation computing unit.Type: ApplicationFiled: July 16, 2021Publication date: September 21, 2023Applicant: OMRON CorporationInventors: Yasutaka OKADA, Ryota YAMADA, Jun SASAKI, Tatsuya KOGA
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Publication number: 20230250203Abstract: The present invention aims to provide a composition for a storage battery electrode and a pigment composition each containing a modified polyvinyl acetal resin that has excellent dispersing properties, adhesion, and stability over time and that is capable of preventing degradation caused by an electrolyte solution when used for an electrode of a storage battery, enabling the production of a high-power storage battery. Provided is a modified polyvinyl acetal resin including a chlorine atom-containing structural unit.Type: ApplicationFiled: July 13, 2021Publication date: August 10, 2023Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Keisuke TAKENAKA, Yutaro ASABA, Jun SASAKI
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Publication number: 20230244235Abstract: A route planning system according to one or more embodiments may include an obtaining unit configured to obtain an environmental map indicating, for any obstacle, a location and a degree of certainty that the obstacle is present at that location, a planning unit configured to plan a movement route along which a mobile robot moves, excluding any obstacles in the environmental map, that have a degree of certainty that does not satisfy a predetermined standard, and an output unit configured to output route information, which is information on the planned movement route, to the mobile robot.Type: ApplicationFiled: June 21, 2021Publication date: August 3, 2023Applicant: OMRON CorporationInventors: Yasutaka OKADA, Jun SASAKI, Ryota YAMADA, Tatsuya KOGA
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Patent number: 11683885Abstract: Provided is a sheet-like device suitable for a flexible electrical product that is robust, highly flexible, and operates stably. The sheet-like device includes a first part where a first film layer, a first conversion unit, and a second film layer overlap, a second part where the first film layer is absent and the second film layer is present, and a third part where the first film layer, a second conversion unit, and the second film layer overlap. The first part the second part, and the third part are arranged side by side in this order in a first direction. A first region including the first part the second part, and the third part has an elongation per unit length greater than an elongation per unit length of the first film layer alone when a same force is applied in the first direction at 20° C.Type: GrantFiled: December 2, 2020Date of Patent: June 20, 2023Assignee: NISSHA CO., LTD.Inventors: Nobuo Kubosaki, Chuzo Taniguchi, Jun Sasaki
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Publication number: 20230123719Abstract: A switch cap for a switch device that can reduce a pressing error of a switch is provided. A three-dimensional first cap main body moves by a force applied to a first abutting portion from a finger which is an operator. A first sensor is disposed in the first cap main body, and detects abutting or approach of the finger to the first abutting portion. A first transmission member is fixed to the inside of the first cap main body, and moves together with the first cap main body for first switching to transmit movement of the first cap main body to a push button which is a predetermined location of a switch device. A first sensor is formed in a flexible printed circuit board (FPC) disposed in the first cap main body, and the FPC is fixed by the first transmission member and the first cap main body.Type: ApplicationFiled: March 22, 2021Publication date: April 20, 2023Inventors: Chuzo TANIGUCHI, Eiji KAWASHIMA, Jun SASAKI
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Publication number: 20230075178Abstract: A molded article or an electrical product facilitates layout of a wiring line from an electrical circuit of a circuit film integrally molded with a molded body to a connection terminal. The molded article includes a circuit film and a molded body. The circuit film includes an insulating film and an electrical circuit. The molded body is integrally molded with the circuit film. The circuit film includes a flexible wiring portion. The molded body has a through-hole that penetrates from a first main surface to a second main surface. In the flexible wiring portion, a connection terminal is arranged at a position of passing through the through-hole and beyond the second main surface.Type: ApplicationFiled: January 22, 2021Publication date: March 9, 2023Applicant: NISSHA CO.,LTD.Inventors: Chuzo TANIGUCHI, Ryomei OMOTE, Eiji KAWASHIMA, Junichi SHIBATA, Jun SASAKI, Yoshihiro SAKATA
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Publication number: 20230067899Abstract: Provided is a sheet-like device suitable for a flexible electrical product that is robust, highly flexible, and operates stably. The sheet-like device includes a first part where a first film layer, a first conversion unit, and a second film layer overlap, a second part where the first film layer is absent and the second film layer is present, and a third part where the first film layer, a second conversion unit, and the second film layer overlap. The first part the second part, and the third part are arranged side by side in this order in a first direction. A first region including the first part the second part, and the third part has an elongation per unit length greater than an elongation per unit length of the first film layer alone when a same force is applied in the first direction at 20° C.Type: ApplicationFiled: December 2, 2020Publication date: March 2, 2023Inventors: Nobuo KUBOSAKI, Chuzo TANIGUCHI, Jun SASAKI
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Publication number: 20230054589Abstract: A molded body is molded into a prescribed three-dimensional shape. A protective film covers at least a portion of a surface of the molded body. A circuit film is integrally molded with the molded body. An electric circuit is installed in the circuit film and causes a physical change outside of a molded article or causes an electric signal to be generated in accordance with a physical change outside of the molded article. The protective film or the circuit film has a contact area disposed on the surface of a contact portion. The molded body includes a hot melt adhesive: which is disposed on the surface of the molded body which is opposite skin, with the contact area therebetween; and which defines a three-dimensional shape of the contact area within the prescribed shape. The hot melt adhesive covers at least a portion of the circuit film.Type: ApplicationFiled: January 27, 2021Publication date: February 23, 2023Applicant: NISSHA CO.,LTD.Inventors: Chuzo TANIGUCHI, Ryomei OMOTE, Eiji KAWASHIMA, Jun SASAKI, Yoshihiro SAKATA, Toshitsugu FUJIMURA
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Patent number: 11453205Abstract: An interlayer film for laminated glass has enhanced sound insulating properties at 30° C., and includes first and second layers each containing a thermoplastic resin and a plasticizer. When an absolute value of a difference in cloud point using the thermoplastic resin and plasticizer in each of the first and second layers is Xa, and a content in parts by weight of the entire plasticizer in the interlayer film relative to 100 parts by weight of the entire thermoplastic resin in the interlayer film Z, the interlayer film satisfies the first constitution: “Xa?115 and Z??0.16Xa+59” and/or the second constitution: “the thermoplastic resin in the first layer is polyvinyl acetal resin, and when the acetylation degree on a mole percent basis of the polyvinyl acetal resin in the first layer is represented by Y, Y?2 and Z??0.16Xa?0.2Y+59”.Type: GrantFiled: February 3, 2017Date of Patent: September 27, 2022Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Nami Minakuchi, Tatsuya Iwamoto, Kohei Kani, Jun Sasaki, Yuuma Takeda
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Patent number: 11420425Abstract: Provided is laminated glass capable of preventing generation of a projection in the interlayer film in an end part of laminated glass, and keeping the appearance of laminated glass excellent. Laminated glass according to the present invention is laminate glass including a first lamination glass member, a second lamination glass member, and an interlayer film containing a thermoplastic resin, and when a light irradiation test: “conducting 4 cycles each cycle including the process of irradiating the laminated glass with xenon light at a black panel temperature of 83° C. and a humidity of 50% RH for 144 hours, and dipping the laminated glass in pure water at 80° C. for 24 hours” is conducted in the laminated glass, a ratio of a weight average molecular weight of the thermoplastic resin at a position of 2 mm inwardly from an end part of the laminated glass, to a weight average molecular weight of the thermoplastic resin at a position of 70 mm inwardly from an end part of the laminated glass is more than 0.5.Type: GrantFiled: March 30, 2018Date of Patent: August 23, 2022Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Shougo Yoshida, Manabu Matsumoto, Kazuhiko Nakayama, Jun Sasaki, Moyuru Okano