Abstract: A laminate that includes a substrate made of a polyolefin-based resin and is excellent in adhesion between the substrate and a metal plating layer is provided in a simple manner without roughening the surface of the substrate. In addition, a molded article, a printed wring board, and an electromagnetic wave shield using the laminate using the same are provided. Used is a laminate configured such that on a substrate (A) made of a polyolefin-based resin (a), a primer layer (B) containing a polyolefin-based resin (b) that is organic solvent soluble or water dispersible, a metal particle layer (C), and a metal plating layer (D) are sequentially laminated.

Abstract: The present invention provides an electronic component package including an electronic component mounted on a circuit board having a ground pattern, a mold containing an epoxy resin that encapsulates the electronic component, and a shield layer formed on the mold. The shield layer is formed by stacking a metal particle layer, a copper plating layer, and a nickel plating layer in this order from the mold side, and the shield layer is grounded to the ground pattern. The present invention also provides a method for manufacturing the electronic component package. The electronic component package is excellent in the adhesion of the shield layer.

Abstract: The present invention provides an electronic component package including an electronic component mounted on a circuit board having a ground pattern, a mold containing an epoxy resin that encapsulates the electronic component, and a shield layer formed on the mold. The shield layer is formed by stacking a metal particle layer, a copper plating layer, and a nickel plating layer in this order from the mold side, and the shield layer is grounded to the ground pattern. The present invention also provides a method for manufacturing the electronic component package. The electronic component package is excellent in the adhesion of the shield layer.

Abstract: The present invention provides an electronic component package including an electronic component mounted on a circuit board having a ground pattern, a mold containing an epoxy resin that encapsulates the electronic component, and a shield layer formed on the mold. The shield layer is formed by stacking a metal particle layer, a copper plating laver, and a nickel plating layer in this order from the mold side, and the shield layer is grounded to the ground pattern. The present invention also provides a method for manufacturing the electronic component package. The electronic component package is excellent in the adhesion of the shield layer.

Abstract: There is provided a method for forming an electrically conductive ultrafine pattern which has an excellent pattern cross-sectional shape is provided by a composite technique including a printing process and a plating process, and furthermore, by imparting excellent adhesion to each interface of a laminate including a plating core pattern, an electrically conductive ultrafine pattern which can be preferably used as a highly accurate electric circuit and a method for manufacturing the same are also provided. The method includes (1) a step of applying a resin composition to form a receiving layer on a substrate; (2) a step of printing an ink containing plating core particles by a reverse offset printing method to form a plating core pattern on the receiving layer; and (3) a step of depositing a metal on the plating core pattern formed in the step (2) by an electrolytic plating method.

Abstract: Provided is a method for producing a laminate in which a substrate (A) comprising a resin composition containing polyphenylene sulfide (a1), a primer resin layer (B), a metal layer (C), and a metal plating layer (D) are sequentially stacked, wherein the method is characterized by comprising: a first step of applying a fluid material containing a primer resin to the surface of the substrate (A) by an immersion method to form a primer resin layer (B); a second step of applying a fluid material containing metal particles to the surface of the primer resin layer (B) by an immersion method to form a metal layer (C); and a third step of forming a metal plating layer (D) on the surface of the metal layer (C) by an electroplating method, an electroless plating method, or a combination thereof. By the method for producing a laminate, a metal film can be easily formed with high adhesion on the surface of polyphenylene sulfide, which is a hard-to-bond base material.

Abstract: An object to be achieved by the present invention is to provide a conductive pattern having such a level of adhesion that a conductive layer containing a conductive substance such as silver does not separate from a primer layer with time. The present invention relates to a conductive pattern including a conductive layer (A) containing a compound (a1) having a basic nitrogen atom-containing group and a conductive substance (a2); a primer layer (B) containing a compound (b1) having a functional group [X]; and a substrate layer (C), the conductive layer (A), the primer layer (B), and the substrate layer (C) being stacked, in which a bond is formed by reacting the basic nitrogen atom-containing group of the compound (a1) contained in the conductive layer (A) with the functional group [X] of the compound (b1) contained in the primer layer (B).

Abstract: The present invention provides a laminated body including a support (A) that includes a polyphenylene sulfide resin composition containing a polyphenylene sulfide (a1) and an elastomer (a2), and a metal layer (B) and a metal-plating layer (C) that are laminated on the support (A) in this order, wherein the elastomer (a2) is contained in the polyphenylene sulfide resin composition in an amount in the range of 0.3 to 90 parts by mass relative to 100 parts by mass of the polyphenylene sulfide (a1). The laminated body is excellent in adhesiveness between the polyphenylene sulfide as the support and the metal-plating layer, and also has a thermal resistance so as to maintain the excellent adhesiveness even when exposed to a high-temperature environment.

Abstract: The present invention provides a urethane resin composition containing a urethane resin having polymerizable unsaturated groups and an aqueous medium. The urethane resin is obtained by reacting a polyol with a polyisocyanate. The polyol contains an alkylenediol having two or more polymerizable unsaturated groups or an oxyalkylenediol having two or more polymerizable unsaturated groups. The alkylenediol is represented by general formula (1): HO—R1—OH??(1) (where R1 is a linear alkylene group of one to nine carbon atoms having two or more atomic groups containing a polymerizable unsaturated group in side chains thereof). The oxyalkylenediol (a1-2) is represented by general formula (2): HO—R1O—R2—OR3—OH??(2) (where R1 and R3 are ethylene groups having a total of two or more atomic groups containing a polymerizable unsaturated group in side chains thereof, and R2 is an alkylene group of one to five carbon atoms).

Abstract: The present invention provides an aqueous coating agent including a vinyl polymer (A) having a basic nitrogen atom-containing group and a carboxylic group, a quaternary ammonium salt (B), and an aqueous medium (C). Particularly, the present invention provides an aqueous coating agent including a compound represented by General Formula (1) below as the quaternary ammonium salt (B). The aqueous coating agent has excellent adhesiveness, warm water resistance, corrosion resistance, and chemical resistance, and can form a film that is capable of preventing the deterioration of various substrates. In General Formula (1), R1 to R4 each independently represent an alkyl group having 1 to 20 carbon atoms or an aryl group.

Abstract: The present invention provides an ultraviolet curable composition including: an urethane resin having a polymerizable unsaturated group, which is obtained by reacting a polyol and a polyisocyanate with each other, wherein the polyol contains an alkylene diol having two or more polymerizable unsaturated groups, which is represented by general formula (1), or an oxyalkylene diol having two or more polymerizable unsaturated groups, which is represented by general formula (2); an aqueous medium; and a photopolymerization initiator having an absorption peak at a wavelength in the range of from 320 to 460 nm. The ultraviolet curable composition is satisfactorily cured even when using an LED lamp as a light source, and can form a cured coating film having both elongation and surface hardness.

Abstract: The present invention provides an absorbing-layer-forming composition including a blocked isocyanate such that the amount of the blocked isocyanate is 50% by mass to 100% by mass of the solid content of the absorbing-layer-forming composition and an absorbing substrate, a printed item, and a conductive pattern that are formed using the absorbing-layer-forming composition. The absorbing-layer-forming composition according to the present invention can be used for forming an absorbing layer which is capable of carrying a fluid such as an ink therein and which enables good adhesion between various types of supports and a conductive layer to be achieved. In particular, using a blocked isocyanate having a number-average molecular weight of 1,000 to 5,000 further increases the adhesion between various types of supports and the conductive layer.

Abstract: Provided are a method for forming a high-definition metal pattern which including the steps of (1) forming a receiving layer on a substrate by coating the substrate with a resin composition including a urethane resin having a weight-average molecular weight of five thousand or more or a vinyl resin and a medium, (2) forming a plating-core pattern on the receiving layer by printing an ink including a particle that serves as a plating core on the receiving layer by reverse offset printing, and (3) depositing a metal on the plating-core pattern by electroless plating, a high-definition metal pattern formed by the above-described method, and an electronic component including the high-definition metal pattern.

Abstract: The present invention provides an aqueous coating agent including a vinyl polymer (A) having a basic nitrogen atom-containing group and a carboxylic group, a quaternary ammonium salt (B), and an aqueous medium (C). Particularly, the present invention provides an aqueous coating agent including a compound represented by General Formula (1) below as the quaternary ammonium salt (B). The aqueous coating agent has excellent adhesiveness, warm water resistance, corrosion resistance, and chemical resistance, and can form a film that is capable of preventing the deterioration of various substrates. In General Formula (1), R1 to R4 each independently represent an alkyl group having 1 to 20 carbon atoms or an aryl group.

Abstract: An object to be achieved by the present invention is to provide a conductive pattern having such a level of adhesion that a conductive layer containing a conductive substance such as silver does not separate from a primer layer with time. The present invention relates to a conductive pattern including a conductive layer (A) containing a compound (a1) having a basic nitrogen atom-containing group and a conductive substance (a2); a primer layer (B) containing a compound (b1) having a functional group [X]; and a substrate layer (C), the conductive layer (A), the primer layer (B), and the substrate layer (C) being stacked, in which a bond is formed by reacting the basic nitrogen atom-containing group of the compound (a1) contained in the conductive layer (A) with the functional group [X] of the compound (b1) contained in the primer layer (B).

Abstract: Provided is a laminate in which at least a layer including a support, a primer layer, a first conductive layer, an insulating layer, and a second conductive layer are laminated, wherein the insulating layer is formed by coating at least a portion of or entirety of a surface of the first conductive layer with a resin composition and drying the resin composition; and the second conductive layer includes a second plating seed layer formed by coating a portion of or entirety of a surface of the insulating layer with a fluid containing a conductive substance, and a second plating layer formed on a surface of the second plating seed layer. This laminate has high adhesion between layers and allows the high adhesion to be maintained even upon exposure to a high-temperature and high-humidity environment.

Abstract: The present invention provides a laminate in which at least a layer including a support, a primer layer, a first conductive layer, an insulating layer, and a second conductive layer are laminated, wherein the insulating layer is formed by coating at least a portion of or entirety of a surface of the first conductive layer with a resin composition and drying the resin composition; and the second conductive layer includes a second plating seed layer formed by coating a portion of or entirety of a surface of the insulating layer with a fluid containing a conductive substance, and a second plating layer formed on a surface of the second plating seed layer. This laminate has high adhesion between layers and allows the high adhesion to be maintained even upon exposure to a high-temperature and high-humidity environment.

Abstract: The present invention provides a urethane resin composition containing a urethane resin having polymerizable unsaturated groups and an aqueous medium. The urethane resin is obtained by reacting a polyol with a polyisocyanate. The polyol contains an alkylenediol having two or more polymerizable unsaturated groups or an oxyalkylenediol having two or more polymerizable unsaturated groups. The alkylenediol is represented by general formula (1): HO—R1—OH??(1) (where R1 is a linear alkylene group of one to nine carbon atoms having two or more atomic groups containing a polymerizable unsaturated group in side chains thereof). The oxyalkylenediol (a1-2) is represented by general formula (2): HO—R1O—R2—OR3—OH??(2) (where R1 and R3 are ethylene groups having a total of two or more atomic groups containing a polymerizable unsaturated group in side chains thereof, and R2 is an alkylene group of one to five carbon atoms).

Abstract: Provided is a laminate in which at least a layer including a support, a primer layer, a first conductive layer, an insulating layer, and a second conductive layer are laminated, wherein the insulating layer is formed by coating at least a portion of or entirety of a surface of the first conductive layer with a resin composition and drying the resin composition; and the second conductive layer includes a second plating seed layer formed by coating a portion of or entirety of a surface of the insulating layer with a fluid containing a conductive substance, and a second plating layer formed on a surface of the second plating seed layer. This laminate has high adhesion between layers and allows the high adhesion to be maintained even upon exposure to a high-temperature and high-humidity environment.

Abstract: There is provided a method for forming an electrically conductive ultrafine pattern which has an excellent pattern cross-sectional shape is provided by a composite technique including a printing process and a plating process, and furthermore, by imparting excellent adhesion to each interface of a laminate including a plating core pattern, an electrically conductive ultrafine pattern which can be preferably used as a highly accurate electric circuit and a method for manufacturing the same are also provided. The method includes (1) a step of applying a resin composition to form a receiving layer on a substrate; (2) a step of printing an ink containing plating core particles by a reverse offset printing method to form a plating core pattern on the receiving layer; and (3) a step of depositing a metal on the plating core pattern formed in the step (2) by an electrolytic plating method.