Patents by Inventor Jun Woo CHUNG

Jun Woo CHUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240186635
    Abstract: The present disclosure includes a frame side member forming a chassis frame and disposed on both sides of a vehicle in a forward-backward direction, a battery disposed to overlap inwardly from the frame side member in a horizontal direction, and a battery case surrounding the battery and coupled to the frame side member, wherein a cross section of the frame side member forms a plurality of closed spaces.
    Type: Application
    Filed: May 10, 2023
    Publication date: June 6, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Won Hae LEE, Nam Ho KIM, Dae Ki JEONG, Su Jin LEE, Jun Woo PARK, Jeong Hoon HAN, Eun Bi KIM, Sun Keun PARK, Byung Joo CHUNG, Seung Hak LEE, Seung Min JEONG
  • Publication number: 20240178499
    Abstract: A battery pack mounting structure of a vehicle includes: a frame side member of a chassis frame provided so that an upper end portion thereof is located at a position spaced downward by a predetermined reference downward distance from a step height set in consideration of ease of boarding of passengers; a battery case provided so that a battery accommodated in the battery case overlaps the frame side member in a horizontal direction thereof; a case side portion forming a side surface of the battery case, coupled to a lower side of the frame side member, and including a lower end portion aligned with a lowest ground height of the vehicle; and a case lower plate forming the battery case while supporting a lower side of the battery and disposed at a position spaced upwards from the lowest ground height.
    Type: Application
    Filed: May 10, 2023
    Publication date: May 30, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Won Hae LEE, Nam Ho KIM, Jun Woo PARK, Seung Min JEONG, Eun Bi KIM, Sun Keun PARK, Byung Joo CHUNG, Seung Hak LEE, Jeong Hoon HAN
  • Patent number: 11990634
    Abstract: A battery pack mounting structure of a vehicle includes: a frame side member of a chassis frame provided so that an upper end portion thereof is located at a position spaced downward by a predetermined reference downward distance from a step height set in consideration of ease of boarding of passengers; a battery case provided so that a battery accommodated in the battery case overlaps the frame side member in a horizontal direction thereof; a case side portion forming a side surface of the battery case, coupled to a lower side of the frame side member, and including a lower end portion aligned with a lowest ground height of the vehicle; and a case lower plate forming the battery case while supporting a lower side of the battery and disposed at a position spaced upwards from the lowest ground height.
    Type: Grant
    Filed: May 10, 2023
    Date of Patent: May 21, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Won Hae Lee, Nam Ho Kim, Jun Woo Park, Seung Min Jeong, Eun Bi Kim, Sun Keun Park, Byung Joo Chung, Seung Hak Lee, Jeong Hoon Han
  • Publication number: 20240155505
    Abstract: A method of a first user equipment (UE) may comprise: receiving a downlink (DL) reference signal transmitted by a base station using a beam included in a beam candidate group to be used for sidelink (SL) communication with a second UE; measuring a DL reference signal received power (RSRP) of the DL reference signal; determining a transmit power of a beam included in the beam candidate group based on the measured DL RSRP; and transmitting SL data to the second UE with the determined transmit power.
    Type: Application
    Filed: October 31, 2023
    Publication date: May 9, 2024
    Inventors: Jun Hyeong KIM, Go San NOH, Seon Ae KIM, Il Gyu KIM, Hee Sang CHUNG, Dae Soon CHO, Sung Woo CHOI, Seung Nam CHOI, Jung Pil CHOI
  • Patent number: 11979227
    Abstract: An operation method of a relay node may include: receiving, from a first communication node, first data composed of n bits; receiving, from a second communication node, second data composed of m bits; in response to determining that n is greater than m, generating first T-data of m bits excluding (n-m) bits from the n-bits of the first data and first R-data of (n-m) bits; generating third data by performing a network coding operation on the first T-data and the second data; transmitting the third data to the first communication node; and transmitting the third data and the first R-data to the second communication node.
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: May 7, 2024
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jun Hyeong Kim, Gyu Il Kim, Go San Noh, Hee Sang Chung, Dae Soon Cho, Sung Woo Choi, Seung Nam Choi, Jung Pil Choi
  • Patent number: 10977475
    Abstract: A fingerprint recognition sensor according to an exemplary embodiment of the present invention includes: a photo sensor for sensing light that is diffuse-reflected from a finger of a user and incident on the photo sensor, or that is transmitted through the finger and incident on the photo sensor; a first matrix positioned on the photo sensor and including a first opening; a second matrix positioned on the first matrix and including a second opening; and a cover layer including one surface contacting the finger and positioned on the second matrix, wherein, from among light that is diffuse-reflected from the finger and incident on the cover layer or that is transmitted through the finger and incident on the cover layer, light having an angle, formed by a normal line on the one surface of the cover layer and a path of the light incident on the cover layer, that is greater than a critical angle, sequentially passes through the second opening and the first opening and is incident on the photo sensor.
    Type: Grant
    Filed: July 5, 2019
    Date of Patent: April 13, 2021
    Assignee: SILICON DISPLAY TECHNOLOGY
    Inventors: Jong Woo Jin, Jin Hyeong Yu, Hyunwoo Jin, Jun Woo Chung, Youn Duck Nam
  • Publication number: 20200012833
    Abstract: A fingerprint recognition sensor according to an exemplary embodiment of the present invention includes: a photo sensor for sensing light that is diffuse-reflected from a finger of a user and incident on the photo sensor, or that is transmitted through the finger and incident on the photo sensor; a first matrix positioned on the photo sensor and including a first opening; a second matrix positioned on the first matrix and including a second opening; and a cover layer including one surface contacting the finger and positioned on the second matrix, wherein, from among light that is diffuse-reflected from the finger and incident on the cover layer or that is transmitted through the finger and incident on the cover layer, light having an angle, formed by a normal line on the one surface of the cover layer and a path of the light incident on the cover layer, that is greater than a critical angle, sequentially passes through the second opening and the first opening and is incident on the photo sensor.
    Type: Application
    Filed: July 5, 2019
    Publication date: January 9, 2020
    Inventors: Jong Woo JIN, Jin Hyeong YU, Hyunwoo JIN, Jun Woo CHUNG, Youn Duck NAM