Abstract: There are provided an air-conditioning device that can easily perform fan setting to obtain a proper air volume in accordance with external static pressure, and a method of controlling the air-conditioning device. There is executed air volume setting processing (S3 to S14) for measuring an actual rotation number (r_MAX) when a fan motor for driving an air blowing fan is set to a maximum output, and setting the rotation number corresponding to a target air volume of the air blowing fan under normal operation of the built-in type air-conditioning device.

Abstract: There are provided an air-conditioning device that can easily perform fan setting to obtain a proper air volume in accordance with external static pressure, and a method of controlling the air-conditioning device. There is executed air volume setting processing (S3 to S14) for measuring an actual rotation number (r_MAX) when a fan motor for driving an air blowing fan is set to a maximum output, and setting the rotation number corresponding to a target air volume of the air blowing fan under normal operation of the built-in type air-conditioning device.

Abstract: In an outdoor unit having a housing containing a heat exchange chamber and a machine chamber vertically partitioned by a partition plate, an electrical component box includes a main body portion disposed in the machine chamber and having a first electrical component unit, and a protrusion portion protruding from the machine chamber into the heat exchange chamber and having a second electrical component unit. The main body portion and the protrusion portion are joined to form an air flowing path for sucking cooling air from the back surface side of the machine chamber, branching the cooling air into first cooling air directly flowing to the sink tank and second cooling air passing over electrical parts of the first electrical component unit and then converging with the first cooling air at the entrance of the sink tank.

Abstract: An electronic component mounting apparatus includes two second linear-motion devices on each of which an image pickup device and a mounting head are placed so as to be movable in an X direction, a first linear-motion device for moving the second linear-motion devices in a Y direction independently of each other, in which the image pickup device is placed at such a position as to be contained within an X-directional width of the mounting head and moreover contained within a Y-directional total width of the mounting head and the second linear-motion device. Thus, since the image pickup region of the camera is contained within the moving region of the mounting head, there is no need for ensuring a moving distance taking into account only the camera's image pickup region, so that the moving-axis length of the second linear-motion devices can be reduced.

Abstract: A conical-shaped distributing member 41 is disposed in a refrigerant distributing portion 32 distributing refrigerant, an orifice 34 is disposed by being positioned at an axis 16X of the conical body, the orifice 34 is held by a stop ring 37, and the stop ring 37 urges the orifice 34 in a flow direction of the refrigerant.

Abstract: In an outdoor unit having a housing containing a heat exchange chamber and a machine chamber vertically partitioned by a partition plate, an electrical component box includes a main body portion disposed in the machine chamber and having a first electrical component unit, and a protrusion portion protruding from the machine chamber into the heat exchange chamber and having a second electrical component unit. The main body portion and the protrusion portion are joined to form an air flowing path for sucking cooling air from the back surface side of the machine chamber, branching the cooling air into first cooling air directly flowing to the sink tank and second cooling air passing over electrical parts of the first electrical component unit and then converging with the first cooling air at the entrance of the sink tank.

Abstract: A conical-shaped distributing member 41 is disposed in a refrigerant distributing portion 32 distributing refrigerant, an orifice 34 is disposed by being positioned at an axis 16X of the conical body, the orifice 34 is held by a stop ring 37, and the stop ring 37 urges the orifice 34 in a flow direction of the refrigerant.

Abstract: An electronic component mounting apparatus includes two second linear-motion devices on each of which an image pickup device and a mounting head are placed so as to be movable in an X direction, a first linear-motion device for moving the second linear-motion devices in a Y direction independently of each other, in which the image pickup device is placed at such a position as to be contained within an X-directional width of the mounting head and moreover contained within a Y-directional total width of the mounting head and the second linear-motion device. Thus, since the image pickup region of the camera is contained within the moving region of the mounting head, there is no need for ensuring a moving distance taking into account only the camera's image pickup region, so that the moving-axis length of the second linear-motion devices can be reduced.

Abstract: A semiconductor device having a semiconductor layer, includes: a first impurity atom having a covalent bond radius larger than a minimum radius of a covalent bond of a semiconductor constituent atom of a semiconductor layer; and a second impurity atom having a covalent bond radius smaller than a maximum radius of the covalent bond of the semiconductor constituent atom; wherein the first and second impurity atoms are arranged in a nearest neighbor lattice site location and at least one of the first and second impurity atoms is electrically active.

Abstract: For implementing a method of mounting electronic components, and an apparatus therefor, which has a much reduced tact time, the nozzles 3a, 3b, 3c, 3d, 3e and 3f are kept in holes 5 provided in a straight line row in nozzle stocker 4 in the order of use sequence. When the type of electronic components to be mounted on a circuit board changes, transfer head 1 has to go to a place above the nozzle stocker 4 to replace the nozzle. In the invented mounting method, and mounting apparatus, the transfer head 1 is required to move only to a place above the next nozzle 3b after returning the used nozzle 3a to a hole 5. Thus the stroke L of transfer head 1 needed for the nozzle exchange is significantly reduced, and the nozzle may be replaced within a short time.

Abstract: A semiconductor device having a semiconductor layer, includes: a first impurity atom having a covalent bond radius larger than a minimum radius of a covalent bond of a semiconductor constituent atom of a semiconductor layer; and a second impurity atom having a covalent bond radius smaller than a maximum radius of the covalent bond of the semiconductor constituent atom; wherein the first and second impurity atoms are arranged in a nearest neighbor lattice site location and at least one of the first and second impurity atoms is electrically active.

Abstract: A semiconductor device having a semiconductor layer, includes: a first impurity atom having a covalent bond radius larger than a minimum radius of a covalent bond of a semiconductor constituent atom of a semiconductor layer; and a second impurity atom having a covalent bond radius smaller than a maximum radius of the covalent bond of the semiconductor constituent atom; wherein the first and second impurity atoms are arranged in a nearest neighbor lattice site location and at least one of the first and second impurity atoms is electrically active.

Abstract: A semiconductor device having a semiconductor layer, includes: a first impurity atom having a covalent bond radius larger than a minimum radius of a covalent bond of a semiconductor constituent atom of a semiconductor layer; and a second impurity atom having a covalent bond radius smaller than a maximum radius of the covalent bond of the semiconductor constituent atom; wherein the first and second impurity atoms are arranged in a nearest neighbor lattice site location and at least one of the first and second impurity atoms is electrically active.

Abstract: A plating system includes a housing forming an outer face thereof. The housing is composed of a frame and a plurality of panels fitted into the frame. Heat contraction is utilized to cover the frame and the panels with synthetic resin films.

Abstract: Liquid treatment units are disposed in multi-tiers surrounding a main-arm 35. Among liquid treatment units, plating units M1 through M4 are disposed on a lower tier side, and a unit for post-treatment process such as a cleaning unit 70 where a cleaner atmosphere is necessary is disposed on an upper tier side. Thereby, an improvement in an area efficiency and the formation and maintenance of a clean atmosphere can be simultaneously obtained.

Abstract: For implementing a method of mounting electronic components, and an apparatus therefor, which has a much reduced tact time, the nozzles 3a, 3b, 3c, 3d, 3e and 3f are kept in holes 5 provided in a straight line row in nozzle stocker 4 in the order of use sequence. When the type of electronic components to be mounted on a circuit board changes, transfer head 1 has to go to a place above the nozzle stocker 4 to replace the nozzle. In the invented mounting method, and mounting apparatus, the transfer head 1 is required to move only to a place above the next nozzle 3b after returning the used nozzle 3a to a hole 5. Thus the stroke L of transfer head 1 needed for the nozzle exchange is significantly reduced, and the nozzle may be replaced within a short time.

Abstract: For implementing a method of mounting electronic components, and an apparatus therefor, which has a much reduced tact time, the nozzles 3a, 3b, 3c, 3d, 3e and 3f are kept in holes 5 provided in a straight line row in nozzle stocker 4 in the order of use sequence. When the type of electronic components to be mounted on a circuit board changes, transfer head 1 has to go to a place above the nozzle stocker 4 to replace the nozzle. In the invented mounting method, and mounting apparatus, the transfer head 1 is required to move only to a place above the next nozzle 3b after returning the used nozzle 3a to a hole 5. Thus the stroke L of transfer head 1 needed for the nozzle exchange is significantly reduced, and the nozzle may be replaced within a short time.

Abstract: A tray feeder sequentially takes pallets, each holding a tray storing electronic parts, out of a magazine and feeds them to a pick-up position where the electronic parts are picked up by a transfer head of an electronic parts-mounting apparatus. The tray feeder comprises the magazines for containing the pallets in a stacked manner, a drawing portion for drawing the pallet from the magazine and carrying the same thereon, a lifting-lowering portion for vertically moving the drawing portion, a non-mounted-parts discharge portion provided above the magazines, and a replenishing portion for receiving the pallet, holding the empty tray from which the electronic parts have been picked up, and for recharging the pallet after fresh electronic parts are replenished. With this construction, there can be achieved the tray feeder that is excellent in the operation efficiency and is compact in size.

Abstract: Trays within a tray feeder provided with electronic components requiring a higher accuracy of mounting position such as QFPs, etc. are collectively placed at one side of a recognition device equipped with a line sensor. A transfer head picks up an electronic component in the tray and discerns a position of the electronic component by moving over the line sensor in one and the same fixed direction at all the time. This scanning direction is the same as a direction of calibration of a nozzle of the transfer head. Accordingly, a detecting error in the position of electronic component caused by the scanning direction is eliminated and the electronic component can be mounted with a high positional accuracy on a substrate.

Abstract: Liquid treatment units are disposed in multi-tiers surrounding a main-arm 35. Among liquid treatment units, plating units M1 through M4 are disposed on a lower tier side, and a unit for post-treatment process such as a cleaning unit 70 where a cleaner atmosphere is necessary is disposed on an upper tier side. Thereby, an improvement in an area efficiency and the formation and maintenance of a clean atmosphere can be simultaneously obtained.