Abstract: A battery pack according to an embodiment of the present disclosure is connected to a rectifier, and is composed of a (+) terminal formed by connecting a plurality of (+) terminals of a plurality of battery modules, a (+) output terminal connected to a (+) input terminal of the rectifier, a BMS configured to control charging or discharging of the battery pack, and a current path forming unit disposed between the (+) terminal and the (+) output terminal and configured to form a current path between the (+) terminal and the (+) output terminal according to the control by the BMS.

Abstract: A battery pack according to an embodiment of the present disclosure is connected to a rectifier, and is composed of a (+) terminal formed by connecting a plurality of (+) terminals of a plurality of battery modules, a (+) output terminal connected to a (+) input terminal of the rectifier, a BMS configured to control charging or discharging of the battery pack, and a current path forming unit disposed between the (+) terminal and the (+) output terminal and configured to form a current path between the (+) terminal and the (+) output terminal according to the control by the BMS.

Abstract: The present invention presents a printed circuit board heat dissipation system using a highly conductive heat dissipation pad, the heat dissipation system comprising: one or more electronic components mounted on a printed circuit board; the printed circuit board having formed thereon a conductive pattern providing current paths between the mounted one or more electronic components; and a highly conductive heat dissipation pad discharging heat generated due to the current flowing in the conductive pattern of the printed circuit board.

Abstract: The present invention presents a printed circuit board heat dissipation system using a highly conductive heat dissipation pad, the heat dissipation system comprising: one or more electronic components mounted on a printed circuit board; the printed circuit board having formed thereon a conductive pattern providing current paths between the mounted one or more electronic components; and a highly conductive heat dissipation pad discharging heat generated due to the current flowing in the conductive pattern of the printed circuit board.

Abstract: A backlight unit includes a plurality of fluorescent lamps divided into a plurality of groups of fluorescent lamps arranged in parallel, each group including at least two fluorescent lamps, and a plurality of inverters electrically connected with the plurality of fluorescent lamps by respectively corresponding to the plurality of groups of fluorescent lamps.