Patents by Inventor Jun Young Lim
Jun Young Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10321562Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.Type: GrantFiled: July 24, 2017Date of Patent: June 11, 2019Assignee: LG INNOTEK CO., LTDInventors: Jun Young Lim, Woong Sik Kim, Hyung Kyu Yoon, Min Hwan Kim
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Publication number: 20180310404Abstract: An embodiment of the present invention relates to a flexible printed circuit board (FPCB), which is applied to various electronic display devices, and may provide the FPCB, including a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.Type: ApplicationFiled: September 12, 2016Publication date: October 25, 2018Inventors: Jun Young LIM, Woong Sik KIM, Hyung Kyu YOON
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Patent number: 10020248Abstract: Provided is a tape for electronic devices with lead crack and a method of manufacturing the tape. According to the present invention, by forming a cutting portion on a narrow circuit pattern to be connected from an inner lead to an outer lead and further forming the cutting portion within a resin application portion, the problem of occurrence of cracks along a width of a narrow wiring can be avoided. The tape may include a first lead and a second lead formed on a dielectric substrate and a cutting portion formed on one of the first lead and the second lead wherein the cutting portion is formed within a resin application portion.Type: GrantFiled: May 13, 2016Date of Patent: July 10, 2018Assignee: LG INNOTEK CO., LTD.Inventors: Dae Sung Yoo, Han Mo Koo, Ki Tae Park, Jun Young Lim, Tae Ki Hong
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Patent number: 10020280Abstract: The present invention relates to a method of manufacturing a carrier tape, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.Type: GrantFiled: July 6, 2015Date of Patent: July 10, 2018Assignee: LG INNOTEK CO., LTD.Inventors: Tae Ki Hong, Dong Guk Jo, Han Mo Koo, Jun Young Lim, Ki Tae Park, Sang Ki Cho, Dae Sung Yoo, Nak Ho Song, Joo Chul Kim, Jae Sung Jo
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Publication number: 20180027651Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.Type: ApplicationFiled: July 24, 2017Publication date: January 25, 2018Inventors: Jun Young LIM, Woong Sik KIM, Hyung Kyu YOON, Min Hwan KIM
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Patent number: 9648731Abstract: The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching.Type: GrantFiled: February 7, 2014Date of Patent: May 9, 2017Assignee: LG INNOTEK CO., LTD.Inventors: Tae Ki Hong, Jun Young Lim, Ki Tae Park, Sang Ki Cho, Dae Sung Yoo, Han Mo Koo
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Patent number: 9480152Abstract: The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching.Type: GrantFiled: July 22, 2011Date of Patent: October 25, 2016Assignee: LG INNOTEK CO., LTD.Inventors: Tae Ki Hong, Han Mo Koo, Jun Young Lim, Ki Tae Park, Sang Ki Cho, Dae Sung Yoo
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Publication number: 20160254219Abstract: Provided is a tape for electronic devices with lead crack and a method of manufacturing the tape. According to the present invention, by forming a bending portion on a narrow circuit pattern to be connected from an inner lead to an outer lead and further forming the bending portion within a resin application portion, crack occurred in a narrow wiring width can be avoided. The tape may includes a first lead and a second lead formed on a dielectric substrate and a bending portion formed on one of the first lead and the second lead wherein the bending portion is formed within a resin application portion.Type: ApplicationFiled: May 13, 2016Publication date: September 1, 2016Applicant: LG INNOTEK CO., LTD.Inventors: Dae Sung YOO, Han Mo KOO, Ki Tae PARK, Jun Young LIM, Tae Ki HONG
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Publication number: 20150311176Abstract: The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability ofType: ApplicationFiled: July 6, 2015Publication date: October 29, 2015Inventors: Tae Ki Hong, Dong Guk Jo, Han Mo Koo, Jun Young Lim, Ki Tae Park, Sang Ki Cho, Dae Sung Yoo, Nak Ho Song, Joo Chul Kim, Jae Sung Jo
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Patent number: 9105631Abstract: The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability ofType: GrantFiled: June 13, 2014Date of Patent: August 11, 2015Assignee: LG INNOTEK CO., LTD.Inventors: Tae Ki Hong, Dong Guk Jo, Han Mo Koo, Jun Young Lim, Ki Tae Park, Sang Ki Cho, Dae Sung Yoo, Nak Ho Song, Joo Chul Kim, Jae Sung Jo
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Publication number: 20140291004Abstract: The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability ofType: ApplicationFiled: June 13, 2014Publication date: October 2, 2014Inventors: Tae Ki Hong, Dong Guk Jo, Han Mo Koo, Jun Young Lim, Ki Tae Park, Sang Ki Cho, Dae Sung Yoo, Nak Ho Song, Joo Chul Kim, Jae Sung Jo
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Patent number: 8791370Abstract: The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a wiring pattern and a metal plating layer formed on a base film comprises a transfer area including a row of sprocket holes arranged along the edges of the base film at predetermined intervals, and wherein the transfer area includes an exposure area from which the base film is exposed, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.Type: GrantFiled: February 23, 2010Date of Patent: July 29, 2014Assignee: LG Innotek Co., Ltd.Inventors: Tae Ki Hong, Dong Guk Jo, Han Mo Koo, Jun Young Lim, Ki Tae Park, Sang Ki Cho, Dae Sung Yoo, Nak Ho Song, Joo Chul Kim, Jae Sung Jo
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Publication number: 20140151093Abstract: The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching.Type: ApplicationFiled: February 7, 2014Publication date: June 5, 2014Applicant: LG INNOTEK CO., LTD.Inventors: Tae Ki HONG, Jun Young LIM, Ki Tae PARK, Sang Ki CHO, Dae Sung YOO, Han Mo KOO
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Publication number: 20130308289Abstract: Provided is a tape for electronic devices with lead crack and a method of manufacturing the tape. According to the present invention, by forming a bending portion on a narrow circuit pattern to be connected from an inner lead to an outer lead and further forming the bending portion within a resin application portion, crack occurred in a narrow wiring width can be avoided. The tape may include a first lead and a second lead formed on a dielectric substrate and a bending portion formed on one of the first lead and the second lead wherein the bending portion is formed within a resin application portion.Type: ApplicationFiled: October 12, 2011Publication date: November 21, 2013Applicant: LG INNOTEK CO., LTD.Inventors: Dae Sung Yoo, Han Mo Koo, Ki Tae Park, Jun Young Lim, Tae Ki Hong
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Patent number: 8376709Abstract: Disclosed are an impeller of a suction-enforced type, and a fan-motor for a vacuum cleaner having the same. The fan-motor having the impeller of the suction-enforced type includes: a motor housing; a motor installed in the motor housing; an impeller casing coupled to the upper portion of the motor housing; the impeller of the suction-enforced type installed in the impeller casing and connected to a rotation shaft of the motor; and a guide vane installed at the lower portion of the impeller of the suction-enforced type, for guiding the air sucked into the impeller casing to the motor side. As a result, suction efficiency of the impeller is improved, and thus efficiency of the fan-motor for the vacuum cleaner is improved.Type: GrantFiled: October 20, 2006Date of Patent: February 19, 2013Assignee: LG Electronics Inc.Inventors: Myung-Keun Yoo, Jun-Young Lim
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Publication number: 20120330442Abstract: Disclosed is a control apparatus and method of a clothes treating machine. Power consumption can be expected or detected when an operation of the clothes treating apparatus is determined, and greenhouse gas emissions to an energy source or electricity prices according can be expected on the basis of power consumption. In addition, reasonable operations can be determined on the basis of recommended operation conditions provided by the clothes treating apparatus, and power consumption of the clothes treating machine, greenhouse gas emissions to an energy source or electricity prices can be easily calculated without providing an additional complicated power detection circuit.Type: ApplicationFiled: January 15, 2010Publication date: December 27, 2012Applicant: LG ELECTRONICS INC.Inventors: Jin-Seong Hwang, Jun-Young Lim, Mun-Seok Seo
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Publication number: 20120186862Abstract: The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching.Type: ApplicationFiled: July 22, 2011Publication date: July 26, 2012Applicant: LG Innotek Co., Ltd.Inventors: Tae Ki Hong, Han Mo Koo, Jun Young Lim, Ki Tae Park, Sang Ki Cho, Dae Sung Yoo
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Patent number: 8228156Abstract: An insulation transformer and a key input circuit having the same are disclosed. The insulation transformer includes: a core having a certain gap; and primary and secondary coils wound on the core. According to the insulation transformer, the operation deficiency of the insulation transformer can be reduced and thus the signal transmission efficiency can be improved. Also, the key input circuit including: an insulation transformer includes a core having a certain gap, and primary and secondary coils wound on the core; a microcomputer connected with the primary coil; and a key input unit connected with the secondary coil and including multiple resistors and switches. According to the key input circuit having the insulation transformer, the reliability of the operation of the key input circuit can be improved and user inconvenience that may be caused by an operation error can be prevented.Type: GrantFiled: October 17, 2007Date of Patent: July 24, 2012Assignee: LG Electronics Inc.Inventors: Jun-Young Lim, Sang-Young Kim
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Patent number: 8146783Abstract: Disclosed is a refrigerator having a dispenser, including a main body having a cooling chamber and a door for selectively shielding the cooling chamber. The refrigerator also includes a container accommodating unit and a communication chute that passes through a front surface of the door and guides content to a dispensing cavity defined by the container accommodating unit. The refrigerator further includes an obstruction unit disposed in the container accommodating unit, and movable, about a plane perpendicular to the front which content guided by the communication chute is relatively obstructed by the obstruction unit and a second position in which content guided by the communication chute is relatively unobstructed by the obstruction unit.Type: GrantFiled: March 12, 2009Date of Patent: April 3, 2012Assignee: LG Electronics Inc.Inventors: Seung-Hwan Oh, Ho-Youn Lee, Jun-Young Lim
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Patent number: 8142160Abstract: Disclosed is a high speed type impeller, including: a body having a shaft coupling hole into which a rotation shaft of a motor is coupled, the outer circumference of the body being widened from the top to bottom end in the insertion direction of the rotation shaft to form a bent surface, a step portion shadowed in the radial direction being formed on the top end of the body; a plurality of blades installed on the bent surface of the body to be bent at a predetermined angle to the rotation shaft direction; and an upper reinforcing ring installed at the step portion of the body. Even through the impeller is made of a low cost material, the reinforcing ring reinforces the weak portion of the impeller to improve durability. Reliability of the impeller is attained with high economical efficiency.Type: GrantFiled: October 24, 2006Date of Patent: March 27, 2012Assignee: LG Electronics Inc.Inventors: Myung-Keun Yoo, Jun-Young Lim