Abstract: A semiconductor package structure includes at least one first semiconductor die, at least one second semiconductor die and an encapsulant. The first semiconductor die has a first surface and includes a plurality of first pillar structures disposed adjacent to the first surface. The second semiconductor die is electrically connected to the first semiconductor die. The encapsulant covers the first semiconductor die and the second semiconductor die. A lower surface of the encapsulant is substantially coplanar with an end surface of each of the first pillar structures and a surface of the second semiconductor die.

Abstract: A device structure includes a first electronic structure and a plurality of first electric contacts. The first electronic structure has a surface and a center. The first electric contacts are exposed from the surface. The first electric contacts are spaced by a pitch that increases with increasing distance from the center.

Abstract: A semiconductor device package includes a first electronic component, a plurality of first conductive traces, a second electronic component, a plurality of second conductive traces and a plurality of first conductive structures. The first electronic component has a first active surface. The first conductive traces are disposed on and electrically connected to the first active surface. The second electronic component is stacked on the first electronic component. The second electronic component has an inactive surface facing the first active surface, a second active surface opposite the inactive surface, and at least one lateral surface connecting the second active surface and the inactive surface. The second conductive traces are electrically connected to the second active surface, and extending from the second active surface to the lateral surface. The first conductive structures are electrically connecting the second conductive traces to the first conductive traces, respectively.

Abstract: A power tool is provided, which comprises a housing, a motor located within the housing, and a motion sensor. The motion sensor is adapted to control the operation of the motor in response to changes in position or angle of the power tool. The motion sensor can determine the angle between the power tool and the horizontal plane, and operation of the motor is controlled accordingly.

Abstract: A semiconductor package includes a redistribution layer (RDL) structure, a first die, a molding compound and an interconnect structure. The first die is disposed on the RDL structure. The molding compound is disposed on the RDL structure. The interconnect structure electrically connects the first die to the RDL structure.

Abstract: A semiconductor package includes a redistribution layer (RDL) structure, a first die, a molding compound and an interconnect structure. The first die is disposed on the RDL structure. The molding compound is disposed on the RDL structure. The interconnect structure electrically connects the first die to the RDL structure.

Abstract: A blower is provided, which comprises a housing, a blowpipe coupled to the housing, a motor located within the housing, and blades driven by the motor to generate air flow. The blower also comprises a motion sensor. The motion sensor is adapted to control the operation of the motor in response to changes in position or angle of the blower. The motion sensor can determine the angle between the blower and the horizontal plane, thereby intelligently determining whether the user wants to carry the blower by hand and wants to perform air blowing, and controls the operation of the motor accordingly.

Abstract: A semiconductor package structure includes at least one semiconductor die, at least one conductive pillar, an encapsulant and a circuit structure. The semiconductor die has an active surface. The conductive pillar is disposed adjacent to the active surface of the semiconductor die. The encapsulant covers the semiconductor die and the conductive pillar. The encapsulant defines at least one groove adjacent to and surrounding the conductive pillar. The circuit structure is electrically connected to the conductive pillar.

Abstract: A semiconductor device package includes a first redistribution layer (RDL), a first die, a second die, a second RDL and an encapsulant. The first die is disposed on the first RDL and is electrically connected to the first RDL. The first die has a first electrical contact. The second die is disposed on the first RDL and is electrically connected to the first RDL. The second die has a first electrical contact. The second RDL is surrounded by the first RDL. The second RDL has a first electrical contact electrically connected to the first electrical contact of the first die and a second electrical contact electrically connected to the first electrical contact of the second die. A size of the first electrical contact of the second RDL is greater than a size of the second electrical contact of the second RDL.

Abstract: Disclosed is a method that includes receiving, at a layer 2 switch, a first message to establish a fast re-switch tunnel between the layer 2 switch and a standby wireless controller and receiving, at the layer 2 switch, a second message to trigger use of the fast re-switch tunnel. The switch receives data and forwards the data to the standby wireless controller through the fast re-switch tunnel. Once MAC tables are updated for the standby wireless controller, the fast re-switch tunnel can be torn down.

Abstract: A semiconductor package includes a semiconductor die, a plurality of conductive bumps, a shielding layer, an encapsulant and a redistribution layer. The semiconductor die has an active surface, a backside surface and a lateral surface. The conductive bumps are disposed on the active surface of the semiconductor die. The shielding layer is disposed on the lateral surface of the semiconductor die. The encapsulant covers the shielding layer, and has a first surface and a second surface opposite to the first surface. The redistribution layer is disposed on the first surface of the encapsulant and electrically connected to the semiconductor die through the conductive bumps. The shielding layer is electrically connected to the redistribution layer.

Abstract: A charger adapted to charge either one of a first battery pack and a second battery pack. The first battery pack and the second battery pack have respectively a first interface and a second interface being substantially different from each other. The charger includes a housing having a receiving area in which the first battery pack and the second battery pack can be selectively received in such a way that the first battery pack is accommodated in a first region and the second battery pack is accommodated in a second region. The receiving area is at least partially defined by the first region partially overlapping the second region. The charger according to the invention is adapted to charge more than one type of battery pack, which saves cost and space needed for two separate chargers.

Abstract: A semiconductor package includes a semiconductor die, a plurality of conductive bumps, a shielding layer, an encapsulant and a redistribution layer. The semiconductor die has an active surface, a backside surface and a lateral surface. The conductive bumps are disposed on the active surface of the semiconductor die. The shielding layer is disposed on the lateral surface of the semiconductor die. The encapsulant covers the shielding layer, and has a first surface and a second surface opposite to the first surface. The redistribution layer is disposed on the first surface of the encapsulant and electrically connected to the semiconductor die through the conductive bumps. The shielding layer is electrically connected to the redistribution layer.

Abstract: A semiconductor package includes a semiconductor die, a plurality of conductive bumps, a shielding layer, an encapsulant and a redistribution layer. The semiconductor die has an active surface, a backside surface and a lateral surface. The conductive bumps are disposed on the active surface of the semiconductor die. The shielding layer is disposed on the lateral surface of the semiconductor die. The encapsulant covers the shielding layer, and has a first surface and a second surface opposite to the first surface. The redistribution layer is disposed on the first surface of the encapsulant and electrically connected to the semiconductor die through the conductive bumps. The shielding layer is electrically connected to the redistribution layer.

Abstract: A semiconductor package device comprises a circuit layer, an electronic component disposed on the circuit layer, a package element and a first encapsulant. The package element is disposed on the circuit layer. The package element includes at least two electrical contacts electrically connected to the circuit layer. The first encapsulant is disposed on the circuit layer. The first encapsulant encapsulates the electronic component and the package element and exposes the electrical contacts of the package element.

Abstract: A pouch battery contains a pouch, an electrode material and a safety protection device. The electrode material is located in the pouch. The safety protection device is configured to generate an action based on a change in gas pressure within the pouch. In this way, even if the pouch battery is abnormal, its internal circuit can be cut off in time to avoid providing power to external devices while being under abnormal conditions.

Abstract: A method is provided in one example embodiment and includes configuring on a network element a first tunnel from the network element to a first network, wherein the configuring comprises mapping a nexthop address of the local network element to a transport address of the tunnel on the network to create a first nexthop-to-transport mapping for the network element; and advertising the first nexthop-to-transport mapping along with routing information for the network element to remote network elements.

Abstract: Disclosed is a method that includes receiving, at a layer 2 switch, a first message to establish a fast re-switch tunnel between the layer 2 switch and a standby wireless controller and receiving, at the layer 2 switch, a second message to trigger use of the fast re-switch tunnel. The switch receives data and forwards the data to the standby wireless controller through the fast re-switch tunnel. Once MAC tables are updated for the standby wireless controller, the fast re-switch tunnel can be torn down.

Abstract: A semiconductor device package includes a first redistribution layer (RDL), a first die, a second die, a second RDL and an encapsulant. The first die is disposed on the first RDL and is electrically connected to the first RDL. The first die has a first electrical contact. The second die is disposed on the first RDL and is electrically connected to the first RDL. The second die has a first electrical contact. The second RDL is surrounded by the first RDL. The second RDL has a first electrical contact electrically connected to the first electrical contact of the first die and a second electrical contact electrically connected to the first electrical contact of the second die. A size of the first electrical contact of the second RDL is greater than a size of the second electrical contact of the second RDL.

Abstract: A blower is provided, which comprises a housing, a blowpipe coupled to the housing, a motor located within the housing, and blades driven by the motor to generate air flow. The blower also comprises a motion sensor. The motion sensor is adapted to control the operation of the motor in response to changes in position or angle of the blower. The motion sensor can determine the angle between the blower and the horizontal plane, thereby intelligently determining whether the user wants to carry the blower by hand and wants to perform air blowing, and controls the operation of the motor accordingly.