Patents by Inventor Jung Aun Lee
Jung Aun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20170018513Abstract: There are provided a semiconductor package including an antenna formed integrally therewith, and a method of manufacturing the same. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part or the substrate part and electrically connected to the semiconductor chip.Type: ApplicationFiled: September 27, 2016Publication date: January 19, 2017Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Do Jae YOO, Jung Ho YOON, Chul Gyun PARK, Myeong Woo HAN, Jung Aun LEE
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Patent number: 9496219Abstract: A semiconductor package including an antenna formed integrally therewith. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part and electrically connected to the semiconductor chip.Type: GrantFiled: July 3, 2013Date of Patent: November 15, 2016Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Do Jae Yoo, Jung Ho Yoon, Chul Gyun Park, Myeong Woo Han, Jung Aun Lee
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Patent number: 9397403Abstract: There is provided a dipole antenna. The dipole antenna according to embodiments of the present invention includes: a substrate having a predetermined dielectric constant; and an antenna unit including at least one pair of electrodes and feed lines disposed on one surface of the substrate, wherein the electrodes receive current through the feed lines to generate a signal radiated in a direction in parallel with the one surface of the substrate.Type: GrantFiled: December 21, 2011Date of Patent: July 19, 2016Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Myeong Woo Han, Jung Aun Lee
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Publication number: 20160126200Abstract: A semiconductor device package is provided with integrated antenna for wireless applications. The semiconductor device package comprises a substrate including a semiconductor chip mounted thereon: a protective layer covering the semiconductor chip; a metal pattern mounted on the protective layer; and a first connective member connecting the semiconductor chip and the metal pattern. According to this configuration, the semiconductor device package is capable of being easily manufactured while minimizing the electrical distance between the metal pattern for use as an antenna and the semiconductor chip.Type: ApplicationFiled: December 9, 2015Publication date: May 5, 2016Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Myeong Woo HAN, Do Jae YOO, Jung Aun LEE, Jung Ho YOON, Chul Gyun PARK
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Patent number: 9245858Abstract: A semiconductor device package is provided with integrated antenna for wireless applications. The semiconductor device package comprises a substrate including a semiconductor chip mounted thereon; a protective layer covering the semiconductor chip; a metal pattern mounted on the protective layer; and a first connective member connecting the semiconductor chip and the metal pattern. According to this configuration, the semiconductor device package is capable of being easily manufactured while minimizing the electrical distance between the metal pattern for use as an antenna and the semiconductor chip.Type: GrantFiled: September 21, 2011Date of Patent: January 26, 2016Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Myeong Woo Han, Do Jae Yoo, Jung Aun Lee, Jung Ho Yoon, Chul Gyun Park
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Patent number: 9184505Abstract: There is provided a dielectric cavity antenna including: a multilayer substrate having an opening formed in at least a portion of a predetermined surface thereof; a dielectric cavity inserted into the multilayer substrate to radiate an electromagnetic wave signal through the opening; a feed line feeding power to the dielectric cavity; and at least one metal pattern formed in an inner portion of the dielectric cavity or on a surface thereof to thereby be electromagnetically coupled to the feed line.Type: GrantFiled: January 31, 2012Date of Patent: November 10, 2015Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Myeong Woo Han, Jung Aun Lee, Nam Heung Kim
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Patent number: 9147923Abstract: There is provided a differential mode amplifier driving circuit, including: a first port having one end connected to a single signal; a second port having one end connected to a differential signal; a first transmission line having one end grounded; and a third port having one end connected to the first transmission line and the other end connected to the differential signal.Type: GrantFiled: March 14, 2012Date of Patent: September 29, 2015Assignees: Samsung Electro-Mechanics Co., Ltd., Korea University Research & Business FoundationInventors: Myeong Woo Han, Jung Aun Lee, Kook Joo Lee, Moonil Kim
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Patent number: 9093856Abstract: Disclosed herein is a display system incorporating wired and wireless charging apparatuses, including: a switching processing unit supplying and processing a power of a power supply unit according to a mode selected through a switch; a wireless charging unit connected to the switching processing unit and including a pad for wireless charging; a wired charging unit connected to the switching processing unit and a terminal for wired charging; a display unit connected to the switching processing unit; and a control unit connected to the switching processing unit to control operations according to the mode.Type: GrantFiled: October 2, 2012Date of Patent: July 28, 2015Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Myeong Woo Han, Joun Sup Park, Dong Woon Chang, Kwang Du Lee, Jung Aun Lee, Chan Yong Jeong
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Patent number: 9048542Abstract: Disclosed herein are a side-face radiation antenna and a wireless communication module. According to an embodiment of the present invention, there is provided the side-face radiation antenna including a via patch part formed at a side portion of a module substrate including laminated substrates to perform a side-face radiation, and formed by metal filled in a plurality of vias arranged at a predetermined interval in the side portion and connected, and a feed line part inserted between intermediate layers of the module substrate, and connected to the via at a center portion of the via patch part. In addition, there is provided the wireless communication module including the side-face radiation antenna.Type: GrantFiled: December 28, 2012Date of Patent: June 2, 2015Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Myeong Woo Han, Jung Aun Lee, Nam Heung Kim
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Patent number: 9007269Abstract: Embodiments of the invention provide a dielectric waveguide antenna including a dielectric waveguide transmitting a signal applied from a power feeder, a dielectric waveguide radiator radiating the signal transmitted from the dielectric waveguide to the air through a first aperture, and a matching unit formed in a portion of the dielectric waveguide and controlling a serial reactance and a parallel reactance to thereby perform impedance matching between the dielectric waveguide radiator and the air, in order to reduce reflection generated in the first aperture during the radiation of the signal through the first aperture. Reflection in the aperture is reduced through the matching unit having various structures, thereby making it possible to improve characteristics of the dielectric waveguide antenna.Type: GrantFiled: February 20, 2014Date of Patent: April 14, 2015Assignees: Samsung Electro-Mechanics Co., Ltd., Korea University Research and Business FoundationInventors: Jung Aun Lee, Myeong Woo Han, Chul Gyun Park, Moonil Kim, Seung Ho Choi, Kook Joo Lee
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Publication number: 20140168024Abstract: Embodiments of the invention provide a dielectric waveguide antenna including a dielectric waveguide transmitting a signal applied from a power feeder, a dielectric waveguide radiator radiating the signal transmitted from the dielectric waveguide to the air through a first aperture, and a matching unit formed in a portion of the dielectric waveguide and controlling a serial reactance and a parallel reactance to thereby perform impedance matching between the dielectric waveguide radiator and the air, in order to reduce reflection generated in the first aperture during the radiation of the signal through the first aperture. Reflection in the aperture is reduced through the matching unit having various structures, thereby making it possible to improve characteristics of the dielectric waveguide antenna.Type: ApplicationFiled: February 20, 2014Publication date: June 19, 2014Applicants: KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION, SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung Aun LEE, Myeong Woo HAN, Chul Gyun PARK, Moonil KIM, Seung Ho CHOI, Kook Joo LEE
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Patent number: 8749434Abstract: A dielectric resonator antenna is disclosed that includes a multi-layer substrate on which a plurality of insulating layers and conductor layers are alternately stacked. The dielectric resonator antenna also includes a first conductor plate that has an opening part on the upper portion of the top insulating layer of the multi-layer substrate and a second conductor plate that is formed on the lower portion of the bottom insulating layer from the first conductor plate. The insulating layer is formed with at least two stacked layers and is disposed at a position corresponding to the opening part. The dielectric resonator antenna also includes a plurality of first metal via holes, a feeding part and a matching substrate that is stacked on the opening part and is stacked with at least one insulating layer.Type: GrantFiled: July 22, 2010Date of Patent: June 10, 2014Assignees: Samsung Electro-Mechanics Co., Ltd., Korea University Research and Business FoundationInventors: Myeong Woo Han, Jung Aun Lee, Chul Gyun Park, Seung Ho Choi, Moonil Kim, Kook Joo Lee
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Patent number: 8736031Abstract: There is provided a semiconductor package, and more particularly, a semiconductor package including an antenna embedded in an inner portion thereof. The semiconductor package includes: a semiconductor chip; a main antenna disposed to be adjacent to the semiconductor chip and electrically connected thereto; a sealing part sealing both of the semiconductor chip and the main antenna; and an auxiliary antenna formed on an outer surface of the sealing part and coupled to the main antenna.Type: GrantFiled: September 23, 2011Date of Patent: May 27, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jung Aun Lee, Myeong Woo Han, Do Jae Yoo, Chul Gyun Park
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Patent number: 8723732Abstract: A dielectric resonator antenna embedded in a multilayer substrate is described. The dielectric resonator antenna includes a multilayer substrate, a first conductive plate, a second conductive plate, a plurality of first metal via holes, a feeding part configured to feed a dielectric resonator, and a conductive pattern part inserted into the dielectric resonator so that a vertical metal interface is formed in the dielectric resonator.Type: GrantFiled: July 9, 2010Date of Patent: May 13, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jung Aun Lee, Chul Gyun Park, Moonil Kim, Kook Joo Lee
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Patent number: 8692731Abstract: Disclosed herein is a dielectric waveguide antenna including: a dielectric waveguide transmitting a signal applied from a power feeder; a dielectric waveguide radiator radiating the signal transmitted from the dielectric waveguide to the air through a first aperture; and a matching unit formed in a portion of the dielectric waveguide and controlling a serial reactance and a parallel reactance to thereby perform impedance matching between the dielectric waveguide radiator and the air, in order to reduce reflection generated in the first aperture during the radiation of the signal through the first aperture. Reflection in the aperture is reduced through the matching unit having various structures, thereby making it possible to improve characteristics of the dielectric waveguide antenna.Type: GrantFiled: April 21, 2011Date of Patent: April 8, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jung Aun Lee, Myeong Woo Han, Chul Gyun Park, Moonil Kim, Seung Ho Choi, Kook Joo Lee
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Publication number: 20140043189Abstract: Disclosed herein is a dielectric resonator array antenna including one or more series-feed type array elements installed to be arranged in parallel in a multilayer substrate, wherein first high frequency signals having the same or different phases or time delays are adjusted to be applied to the respective series-feed type array elements and respective radiated 1D array beams are individually used or combined to adjust beamforming of 2D array beams. Also, since the series-feed type array element is configured by connecting a plurality of dielectric resonator antennas in series, it can be easily and simply fed in series through coupling generated by the intervals between the feeding lines of the pertinent feeding unit of the plurality of dielectric resonator antennas connected in series. In addition, the broadband characteristics can be obtained by using the plurality of dielectric resonator antennas, whereby the overall antenna performance can be enhanced.Type: ApplicationFiled: December 17, 2012Publication date: February 13, 2014Applicants: KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION, SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung Aun Lee, Moonil Kim, Kook Joo Lee
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Publication number: 20130292809Abstract: A semiconductor package including an antenna formed integrally therewith. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part and electrically connected to the semiconductor chip.Type: ApplicationFiled: July 3, 2013Publication date: November 7, 2013Inventors: Do Jae YOO, Jung Ho Yoon, Chul Gyun Park, Myeong Woo Han, Jung Aun Lee
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Publication number: 20130169376Abstract: There is provided a differential mode amplifier driving circuit, including: a first port having one end connected to a single signal; a second port having one end connected to a differential signal; a first transmission line having one end grounded; and a third port having one end connected to the first transmission line and the other end connected to the differential signal.Type: ApplicationFiled: March 14, 2012Publication date: July 4, 2013Inventors: Myeong Woo Han, Jung Aun Lee, Kook Joo Lee, Moonil Kim
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Publication number: 20130127669Abstract: There is provided a dielectric cavity antenna including: a multilayer substrate having an opening formed in at least a portion of a predetermined surface thereof; a dielectric cavity inserted into the multilayer substrate to radiate an electromagnetic wave signal through the opening; a feed line feeding power to the dielectric cavity; and at least one metal pattern formed in an inner portion of the dielectric cavity or on a surface thereof to thereby be electromagnetically coupled to the feed line.Type: ApplicationFiled: January 31, 2012Publication date: May 23, 2013Inventors: Myeong Woo Han, Jung Aun Lee, Nam Heung Kim
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Publication number: 20130082891Abstract: There is provided a dipole antenna. The dipole antenna according to embodiments of the present invention includes: a substrate having a predetermined dielectric constant; and an antenna unit including at least one pair of electrodes and feed lines disposed on one surface of the substrate, wherein the electrodes receive current through the feed lines to generate a signal radiated in a direction in parallel with the one surface of the substrate.Type: ApplicationFiled: December 21, 2011Publication date: April 4, 2013Inventors: Myeong Woo HAN, Jung Aun Lee