Abstract: A light emitting apparatus includes a patterned conductive layer, a light emitting device on the patterned conductive layer, and a first light diffusion layer. The light emitting device and the patterned conductive layer are embedded in the first light diffusion layer. A method of forming such a light emitting apparatus is also disclosed.

Abstract: A method for forming a molded circuit board is provided. The method includes the steps of forming a circuit having a first section and a second section on a conductive substrate, the first section and the second section being coplanar; then deforming the conductive substrate by mold-pressing, so that the first section and the second section become non-coplanar; providing a plastic material to cover the circuit and the conductive substrate; curing the plastic material by injection-molding; and removing the conductive substrate to expose the circuit. The molded circuit board made by this method is also provided.

Abstract: A light emitting apparatus includes a patterned conductive layer, a light emitting component, and a first light diffusion layer, wherein the light emitting component is disposed on the patterned conductive layer and the light emitting component and the patterned conductive layer are embedded into the first light diffusion layer. The method for manufacturing the light emitting apparatus is also disclosed.

Abstract: The present invention discloses a printed circuit board. The printed circuit board is made by the method of providing a substrate; forming a first circuit on the substrate; depositing a thin film on the substrate; building an electronic component on the substrate by the thin film and allowing the electronic component to electrically connect the first circuit; forming a blanket dielectric layer enclosing the electronic component; and removing the substrate.

Abstract: A light emitting apparatus includes a patterned conductive layer, a light emitting component, and a first light diffusion layer, wherein the light emitting component is disposed on the patterned conductive layer and the light emitting component and the patterned conductive layer are embedded into the first light diffusion layer. The method for manufacturing the light emitting apparatus is also disclosed.

Abstract: Disclosed is a method of fabricating a carbon monoxide detector and a carbon monoxide detector fabricated using the same. Particularly disclosed is a method of fabricating a carbon monoxide detector, which can operate at room temperature and process high detecting selection, and the detector fabricated using the same. The method comprises: providing a substrate having an upper surface; forming two electrode sets on the upper surface of the substrate, and the two electrode sets combined to provide an interdigitated array electrode; forming a tin dioxide layer, which covers the portion of the two electrode sets and the portion of the upper surface; and forming an organic polymer layer on the surface of the tin dioxide layer.

Abstract: The present invention discloses an interconnection structure which is formed by a method comprising providing a first conductive substrate, a second conductive substrate, and an insulating substrate; respectively forming a first circuit and a second circuit on the first conductive substrate and the second conductive substrate; forming a conductive bump on the second circuit; and connecting the insulating substrate with the first circuit and the second circuit by pressing the first conductive substrate, the insulating substrate and the second conductive substrate, wherein the conductive bump penetrates the insulating substrate to contact the first circuit.

Abstract: A light emitting apparatus includes a patterned conductive layer, a light emitting device on the patterned conductive layer, and a first light diffusion layer. The light emitting device and the patterned conductive layer are embedded in the first light diffusion layer. A method of forming such a light emitting apparatus is also disclosed.

Abstract: A flat field emission illumination module comprises a top substrate; a bottom substrate including a plurality of cathodes and of electron emitters, wherein the cathodes are located on the top surface of the bottom substrate and the electron emitters are mounted on the cathodes; an anode interposed between the top and bottom substrates, where the anode is provided at its bottom surface with a plurality of grooves or openings, and where the electron emitters, after assembly of the flat field emission illumination module, are accommodated in the grooves or the openings; and an illumination layer positioned at the inner surface of the grooves or openings, so as to enhance a cooling effect of field emission backlight modules, to raise the illumination efficiency of the illumination module, and to reduce the difficulty in packaging of the module.

Abstract: A method for forming a molded circuit board is provided. The method includes the steps of forming a circuit having a first section and a second section on a conductive substrate, the first section and the second section being coplanar; then deforming the conductive substrate by mold-pressing, so that the first section and the second section become non-coplanar; providing a plastic material to cover the circuit and the conductive substrate; curing the plastic material by injection-molding; and removing the conductive substrate to expose the circuit. The molded circuit board made by this method is also provided.

Abstract: A lamp apparatus with an alarm function is disclosed, which includes a power supply circuit and a base, and a light and a gas warning apparatus mounted on the base. The gas warning apparatus comprises an alarm device and a gas sensor. The gas sensor transmits an actuating signal to the alarm device for triggering the alarm device to actuate an alarm correspondingly when the gas sensor detects a hazardous gas. Therefore, the gas warning apparatus mounted within the lamp not only uses the power of the lamp for supplying the necessary power continuously but also eliminates unsightly other wiring.

Abstract: The present invention relates to a surface plasmon resonance detector, that is portable and easy to operate, and its optical-fiber biosensor unit can be readily replaced. The SPR detector of the present invention comprises: a light source; an optical-fiber biosensor unit having a well, a coating layer, and a core layer; an optical detector; a plurality of optical fibers connecting with the light source, the optical-fiber biosensor unit and the optical detector; and a calculation and display unit connecting with the optical detector, wherein the optical detector receives the optical signals from the optical detector and display the calculation results thereof. Besides, the SPR detector of the present invention has high sensitivity and is able to identify species of trace biomolecules.

Abstract: A method for manufacturing resettable fuses has acts of forming multiple first and second bottom electrodes in pairs on a substrate, laminating a fuse layer on the substrate, forming multiple top electrodes respectively over the pairs of bottom electrodes, forming multiple conductive holes respectively through the top electrodes and the second bottom electrodes, removing the substrate, optionally forming isolation and contact elements and separating individual resettable fuses. Thereby, the manufacturing process and the structure of the resettable fuse are simplified, and the hold current of the resettable fuse is increased.

Abstract: A functional PCB module in accordance with the present invention comprises a frame having at least one chip recess, at least one chip mounted in the chip recess, at least one printed circuit formed on one side of the frame and material filling the chip recess. The chip has terminals interconnected to the printed circuit. Since the chip is embedded in the frame to complete the functional PCB module, the functional PCB module is effectively thinner. Furthermore, two or more functional PCB modules are easily combined to form a multi-layer PCB by using a vacuum compression process.

Abstract: A lighting device composed of a thin LED module has an LED module, a heat sink and a thermally conductive layer clamped between the LED module and the heat sink. The LED module is composed of multiple LED chips densely arranged on a conductive layer in an array without any substrate. By removing the substrate, the lighting device is thin. Additionally, the heat sink is composed of a sealed chamber, vaporable liquid inside the chamber and multiple fins attached to the chamber. Since vaporable liquid transfers heat rapidly and evenly in a gaseous state and the fins increase outside surface areas of the heat sink, the heat sink operates more efficiently, and the lighting device is not easily damaged from accumulated heat.

Abstract: A method for manufacturing resettable fuses has acts of forming multiple first and second bottom electrodes in pairs on a substrate, laminating a fuse layer on the substrate, forming multiple top electrodes respectively over the pairs of bottom electrodes, forming multiple conductive holes respectively through the top electrodes and the second bottom electrodes, removing the substrate, optionally forming isolation and contact elements and separating individual resettable fuses. Thereby, the manufacturing process and the structure of the resettable fuse are simplified, and the hold current of the resettable fuse is increased.

Abstract: A packaging method for preparing thin integrated circuits comprises: forming a circuit layer with multiple sections on a substrate; attaching multiple electronic elements to the circuit layer between two sections of the circuit layer; applying an encapsulant layer to protect the electronic elements; and removing the substrate to expose the circuit layer. By removing the substrate, the exposed circuit can be connected to another circuit board and the integrated circuit is much thinner.

Abstract: A method for preparing thin integrated circuits having multiple circuit layers has the following acts of: forming a first circuit layer on a substrate; depositing at least one resin and copper layer on the first circuit layer; forming a second circuit layer on the at least one resin and copper layer; electrically connecting the first and second circuit layers; attaching electronic components to the first or second circuit layers; applying an encapsulant layer to protect the electronic components; and removing the substrate to expose the first circuit layer. By removing the substrate, the integrated circuit is much thinner.