Abstract: A semiconductor device can include a field insulating film on a substrate and a fin-type pattern of a particular material, on the substrate, having a first sidewall and an opposing second sidewall. The fin-type pattern can include a first portion of the fin-type pattern that protrudes from an upper surface of the field insulating film and a second portion of the fin-type pattern disposed on the first portion. A third portion of the fin-type pattern can be disposed on the second portion where the third portion can be capped by a top rounded surface of the fin-type pattern and the first sidewall can have an undulated profile that spans the first, second and third portions.

Abstract: A substrate processing apparatus includes: a conveyor belt configured to have an outer surface on which a bottom surface of a substrate is seated; and a polishing head unit configured to face an upper surface of the substrate, wherein the polishing head unit includes: a polishing head connected to a driver; a polishing pad configured to face the polishing head; a polishing pad fixing ring disposed between the polishing head and the polishing pad; and a temperature sensor configured to overlap the polishing pad fixing ring and to be spaced apart from the polishing pad fixing ring.

Abstract: A multi-vial connector includes a main body, the upper side of which is coupled to a liquid medication extraction device, a plurality of sub-bodies arranged around the main body, a spike formed at the sub-body and inserted into a vial, and a liquid medication flow channel extending from the spike to the main body through the sub-body. A liquid medication can be extracted from a plurality of vials at the same time in a safe and convenient manner. The safety, convenience, and rapidity for extracting a liquid medication may be improved.

Abstract: The present application relates to a battery charging method and charging system which can prevent degradation of a battery and enhance the lifetime characteristics thereof. In one aspect, the charging method includes charging a battery at a first C-rate higher than a reference C-rate, wherein the C-rate represents charge or discharge current/a rated capacity of the battery. The charging method also includes charging the battery at a second C-rate lower than the reference C-rate. The charging of the battery at the first C-rate includes at least one rest period for temporarily stopping the charging of the battery.

Abstract: The present application relates to a battery charging method and charging system which can prevent degradation of a battery and enhance the lifetime characteristics thereof. In one aspect, the charging method includes charging a battery at a first C-rate higher than a reference C-rate, wherein the C-rate represents charge or discharge current/a rated capacity of the battery. The charging method also includes charging the battery at a second C-rate lower than the reference C-rate. The charging of the battery at the first C-rate includes at least one rest period for temporarily stopping the charging of the battery.

Abstract: A lead frame for a chip package includes a heat spreader and permits the mounting of various sized chips on the same sized lead frame. The lead frame includes a plurality of leads having outer portions and inner portions; a heat spreader having a rim portion adapted to be attached to ends of the inner portions of the leads and a projecting portion that projects between the ends of the inner portions of the leads such that an upper surface of the projecting portion is in approximately the same plane as an upper surface of the inner portions of the leads. An insulative adhesive may be used to attach the ends of the inner portions of the leads to the rim portion of the heat spreader. Also, insulation members may be attached to upper surfaces of the ends of the inner portions of the leads for receiving a large size chip.