Patents by Inventor Jung Hak OH

Jung Hak OH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible circuit board and frame assembly including same
    Patent number: 11309593
    Abstract: Provided is a flexible circuit board installed on a frame to which a bus bar is coupled. The flexible circuit board may include a central portion having a band shape, first connection circuit portions formed at both ends of the central portion and disposed to face each other, second connection circuit portions extending from the first connection circuit portions in parallel with the central portion, and third connection circuit portions extending from the first connection circuit portions and the second connection circuit portions and connected to the bus bar. An overlapped may be formed when each of the second connection circuit portions is folded toward one side of each of the first connection circuit portions.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: April 19, 2022
    Assignee: Yura Corporation Co., Ltd.
    Inventors: Jung Hak Oh, Jin Su Yeom, Jong Won Lee, Tae Hyeon Jeon, Cheon Hyo Lee, Kwang Ouk Sa, Ji Eun Kang, Seung Jun Noh
  • FLEXIBLE CIRCUIT BOARD AND FRAME ASSEMBLY INCLUDING SAME
    Publication number: 20190348720
    Abstract: Provided is a flexible circuit board installed on a frame to which a bus bar is coupled. The flexible circuit board may include a central portion having a band shape, first connection circuit portions formed at both ends of the central portion and disposed to face each other, second connection circuit portions extending from the first connection circuit portions in parallel with the central portion, and third connection circuit portions extending from the first connection circuit portions and the second connection circuit portions and connected to the bus bar. An overlapped may be formed when each of the second connection circuit portions is folded toward one side of each of the first connection circuit portions.
    Type: Application
    Filed: December 27, 2017
    Publication date: November 14, 2019
    Applicant: Yura Corporation Co., Ltd.
    Inventors: Jung Hak OH, Jin Su YEON, Jong Won LEE, Tae Hyeon JEON, Cheon Hyo LEE, Kwang Ouk SA, Ji Eun KANG, Seung Jun NOH