Abstract: A wafer grinder withholds a lateral force and adjusts a tilt of worktable with precision. The wafer grinder is used to grind a wafer; that is, the tilt angle of wafer can be adjusted so that wafer is ground with precision. The wafer grinder has a housing module, a rotary worktable module, air pressure spindle module and an adjustment module.

Abstract: A wafer grinder withholds a lateral force and adjusts a tilt of worktable with precision. The wafer grinder is used to grind a wafer; that is, the tilt angle of wafer can be adjusted so that wafer is ground with precision. The wafer grinder has a housing module, a rotary worktable module, air pressure spindle module and an adjustment module.

Abstract: In a turret indexing device, a coupling containing three gear members is employed in a turret indexing device to cooperate with an indexing disc mounted on an output shaft which is adapted to hold an indexing head. The coupling is operated by a first cam fixedly mounted on an input shaft through a lever mechanism, and the indexing disc is driven by a second cam fixedly mounted on the same input shaft. The three gear members include a first gear member fixedly mounted on a collar slidably mounted on the output shaft, a second gear member which is fixedly mounted on a stationary housing, and third gear member fixedly mounted on a head end of the output shaft.