Patents by Inventor Jung Hua LIANG

Jung Hua LIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE USING THE SAME
    Publication number: 20090108445
    Abstract: A substrate structure is provided. The substrate structure includes a substrate and a patterned wiring layer formed on the substrate. The patterned wiring layer includes a plurality of conductive traces. An isolation layer covers the patterned wiring layer and has an opening to expose a portion of at least one of the conductive traces therefrom. A plurality of conductive coatings covers the exposed portions of the conductive traces. The present invention further provides a semiconductor package with the above substrate structure.
    Type: Application
    Filed: August 18, 2008
    Publication date: April 30, 2009
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Jung Hua LIANG