Patents by Inventor Jung Hyun Woo

Jung Hyun Woo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10120824
    Abstract: A bridge hoard includes a printed circuit board (PCB) and a protocol converter mounted on the PCB to perform a conversion operation converting between a first communication protocol and a second communication protocol different from the first communication protocol. The bridge board further includes a first connector configured to communicate according to the first communication protocol and a second connector configured to communicate according to the second communication protocol. The bridge board additionally includes a hole formed in the PCB. The PCB is shaped as a concave polygon. The concave polygon includes a first region and a second region. The first region includes a first edge and a second edge, which extends in parallel to the first edge, along a first direction. The second region includes a third edge and a fourth edge, which extends in parallel to the third edge, along a second direction perpendicular to the first direction.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: November 6, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Han Hong Lee, Jae Hong Park, Jung Hyun Woo, Sung Woo Joo, Chang Hoon Han
  • Patent number: 10019041
    Abstract: A solid state drive (SSD) housing assembly includes an SSD housing and an extension frame. The SSD housing includes a first extension joint and a first mounting joint. The first mounting joint is a mechanism by which the housing can be mounted to an external device. The SSD housing has the form of a rectangular case in which an SSD module is held. The extension frame includes a second extension joint and a second mounting joint. The second mounting joint is a mechanism by which the frame can be mounted to the external device. The extension frame is attachable to and detachable from the SSD housing by virtue of the first extension joint and the second extension joint.
    Type: Grant
    Filed: January 3, 2017
    Date of Patent: July 10, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jung-Hyun Woo, Jae-Hong Park, Han-Hong Lee, Sung-Woo Joo, Chang-Hoon Han
  • Publication number: 20180035551
    Abstract: A semiconductor memory device including a case including an upper case, a lower case, support structures extending from the lower case to the upper case, a printed circuit board (PCB) in the case and supported by the support structures, a leaf spring on a lower surface of the PCB, the leaf spring seated on support surfaces of the support structures, and a solder layer between the PCB and the leaf spring, the solder layer coupling the PCB with the leaf spring may be provided.
    Type: Application
    Filed: February 9, 2017
    Publication date: February 1, 2018
    Applicant: Samsung Electronics Co., Ltd.
    Inventor: Jung-hyun Woo
  • Publication number: 20170308132
    Abstract: A solid state drive (SSD) housing assembly includes an SSD housing and an extension frame. The SSD housing includes a first extension joint and a first mounting joint. The first mounting joint is a mechanism by which the housing can be mounted to an external device. The SSD housing has the form of a rectangular case in which an SSD module is held. The extension frame includes a second extension joint and a second mounting joint. The second mounting joint is a mechanism by which the frame can be mounted to the external device. The extension frame is attachable to and detachable from the SSD housing by virtue of the first extension joint and the second extension joint.
    Type: Application
    Filed: January 3, 2017
    Publication date: October 26, 2017
    Inventors: JUNG-HYUN WOO, JAE-HONG PARK, HAN-HONG LEE, SUNG-WOO JOO, CHANG-HOON HAN
  • Publication number: 20170293585
    Abstract: A bridge hoard includes a printed circuit board (PCB) and a protocol converter mounted on the PCB to perform a conversion operation converting between a first communication protocol and a second communication protocol different from the first communication protocol. The bridge board further includes a first connector configured to communicate according to the first communication protocol and a second connector configured to communicate according to the second communication protocol. The bridge board additionally includes a hole formed in the PCB. The PCB is shaped as a concave polygon. The concave polygon includes a first region and a second region. The first region includes a first edge and a second edge, which extends in parallel to the first edge, along a first direction. The second region includes a third edge and a fourth edge, which extends in parallel to the third edge, along a second direction perpendicular to the first direction.
    Type: Application
    Filed: October 26, 2016
    Publication date: October 12, 2017
    Inventors: Han Hong Lee, Jae Hong Park, Jung Hyun Woo, Sung Woo Joo, Chang Hoon Han
  • Patent number: D854545
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: July 23, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung-Hyun Woo, Jae-Hong Park, Han-Hong Lee, Sung-Woo Joo, Chang-Hoon Han