Abstract: A display module includes a display panel, a driver integrated circuit, a flexible printed circuit (FPC), a drive signal wiring and a power wiring. The driver integrated circuit applies power and a drive signal to the display panel. The FPC is electrically connected between the driver integrated circuit and a PCB. The drive signal wiring is extended from the FPC to the display panel through the driver integrated circuit and may transmit the drive signal to the display panel. The power wiring transmits the power to the display panel. The power wiring includes a first power line extended from the FPC to the driver integrated circuit, and a second power line extended from the first power line to the display panel. The second power line does not intersect the drive signal wiring, and a ground slit is not generated.

Abstract: A display module includes a display panel, a driver integrated circuit, a flexible printed circuit (FPC), a drive signal wiring and a power wiring. The driver integrated circuit applies power and a drive signal to the display panel. The FPC is electrically connected between the driver integrated circuit and a PCB. The drive signal wiring is extended from the FPC to the display panel through the driver integrated circuit and may transmit the drive signal to the display panel. The power wiring transmits the power to the display panel. The power wiring includes a first power line extended from the FPC to the driver integrated circuit, and a second power line extended from the first power line to the display panel. The second power line does not intersect the drive signal wiring, and a ground slit is not generated.

Abstract: A test apparatus for measuring electromagnetic interference (EMI) of an image sensor integrated circuit (IC) device may include an EMI test jig configured to drive a mounted image sensor IC device on one or more test conditions; an electromagnetic (EM) shielding box configured to shield external EM waves from other directions except an upper direction, the EM shielding box accepting the EMI test jig; an EM emission sensing probe configured to sense EM emissions from the image sensor IC device, the EM emission sensing probe being separated from and adjacent to the image sensor IC device in the upper direction when sensing EM emissions; and a spectrum analyzer configured to connect to the EM emission sensing probe, the spectrum analyzer configured to evaluate the EM emissions from the image sensor IC device.

Abstract: Provided is a connection structure capable of reducing the distortion of a signal. The connection structure includes a first interconnection layer including a plurality of signal lines configured to transmit an operating signal generated by a driver to a receiver; a second interconnection layer including at least one ground line configured to connect the driver and ground terminals of the receiver; and an insulating layer interposed between the first and second interconnection layers to electrically insulate the signal lines from the ground line.

Abstract: Disclosed is a portable computer with improved transception sensitivity to radio wave data. The portable computer includes an antenna for transceiving radio wave data. The antenna is disposed opposite to a display panel driver, a display region of the portable computer interposed therebetween.

Abstract: Provided is a connection structure capable of reducing the distortion of a signal. The connection structure includes a first interconnection layer including a plurality of signal lines configured to transmit an operating signal generated by a driver to a receiver; a second interconnection layer including at least one ground line configured to connect the driver and ground terminals of the receiver; and an insulating layer interposed between the first and second interconnection layers to electrically insulate the signal lines from the ground line.