Patents by Inventor Jung-Min Kim
Jung-Min Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11735364Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a metal wire, a conductive metal, and a base resin.Type: GrantFiled: October 27, 2021Date of Patent: August 22, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jun Hyeon Kim, Hae Sol Kang, Bon Seok Koo, San Kyeong, Chang Hak Choi, Jung Min Kim
-
Patent number: 11721468Abstract: A coil component includes a support substrate; a coil portion disposed on the support substrate; a body embedding the support substrate and the coil portion therein, and having a first surface and a second surface opposing each other, a third surface and a fourth surface opposing each other and respectively connecting the first and second surfaces; lead-out portions extending from the coil portion and respectively exposed from the third and fourth surfaces of the body; a surface-insulating layer disposed on the third and fourth surfaces of the body and having openings respectively exposing the lead-out portions; and external electrodes arranged on the surface-insulating layer and respectively connected to the lead-out portions respectively exposed through the openings, wherein a width of each of the external electrodes is narrower than a width of the body.Type: GrantFiled: June 25, 2020Date of Patent: August 8, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kwi Jong Lee, Jung Min Kim, Sung Jin Huh, Jin Hyuck Yang, Jae Wook Lee, Ji Hyun Eom
-
Patent number: 11705283Abstract: A multilayer ceramic electronic component includes a ceramic body including a first internal electrode and a second internal electrode disposed to be alternately stacked with a dielectric layer interposed therebetween, a first external electrode connected to the first internal electrode and including a first electrode layer, a first conductive layer, and a first metal layer, a second external electrode connected to the second internal electrode and including a second electrode layer, a second conductive layer, and a second metal layer, and a first coating layer disposed on the ceramic body, the first electrode layer and the second electrode layer, wherein the first coating layer may include an alkyl(meth)acrylate-based polymer.Type: GrantFiled: September 7, 2021Date of Patent: July 18, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyo Yeol Lee, Seung Hun Han, In Young Kang, Jung Min Kim, Jeong Ryeol Kim
-
Patent number: 11694844Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction and including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in the first direction, and external electrodes disposed on the third and fourth surfaces, wherein the external electrodes include an electrode layer disposed on the body and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a conductive metal, an epoxy resin, and an acrylic resin.Type: GrantFiled: May 5, 2021Date of Patent: July 4, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Byung Woo Kang, Bon Seok Koo, Jeong Ryeol Kim, Jung Min Kim, Jae Seok Yi, Ji Hye Han, Hye Jin Park
-
Patent number: 11688546Abstract: A coil component includes a support substrate and a coil portion disposed on the support substrate, a body in which the support substrate and the coil portion are embedded, first and second lead portions extending from the coil portion and respectively exposed to a surface of the body, a surface insulating layer disposed on the surface of the body and having openings respectively exposing the first and second lead portions, and first and second external electrodes disposed on the surface insulating layer and connected to the first and second lead portions exposed through the openings. Each of the first and second external electrodes includes a first metal layer formed of a metal and in direct contact with the first and second lead portions.Type: GrantFiled: June 24, 2020Date of Patent: June 27, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kwi Jong Lee, Jung Min Kim, Young Seuck Yoo, Sung Jin Huh, Jin Hyuck Yang, Tae Hyun Kim
-
Publication number: 20230197344Abstract: A multilayer electronic component includes a body including a dielectric layer and a plurality of internal electrodes stacked with the dielectric layer interposed therebetween and external electrodes disposed outside the body, wherein the external electrodes include a first electrode layer connected to the internal electrodes and including a conductive metal, a first resin electrode layer disposed on the first electrode layer and including a first conductive connecting portion including an intermetallic compound and a resin and a second resin electrode layer disposed on the first resin electrode layer and including a plurality of metal particles and a resin.Type: ApplicationFiled: November 1, 2022Publication date: June 22, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ji Hye Han, Jung Min Kim, Hong Je Choi, Byung Woo Kang, Hye Jin Park, Sang Wook Lee, Bon Seok Koo
-
Patent number: 11674154Abstract: In some aspects, the disclosure relates to compositions and methods for treating fibrodysplasia ossificans progressiva (FOP) in a subject. In some aspects, the disclosure provides isolated nucleic acids, and vectors such as rAAV vectors, configured to express transgenes that inhibit (e.g., decrease) expression of mutated AVCR1 gene in muscle cells or connective tissues.Type: GrantFiled: December 2, 2021Date of Patent: June 13, 2023Assignee: University of MassachusettsInventors: Jae-Hyuck Shim, Guangping Gao, Jun Xie, Yeon-Suk Yang, Jung min Kim, Sachin Chaugule
-
Publication number: 20230170146Abstract: A multilayer capacitor includes a body including a stack structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and disposed on the body, wherein each of the first and second external electrodes includes a conductive resin layer including a resin, a plurality of metal particles, and a conductive connection portion connecting portions of the plurality of metal particles to each other, and in the conductive resin layer, a volume ratio of metal particles spaced apart from the conductive connection portion, among the plurality of metal particles, to a sum of the plurality of metal particles and the conductive connection portion is greater than 0% and less than 4.9%.Type: ApplicationFiled: May 18, 2022Publication date: June 1, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hong Je Choi, Jung Min Kim, Ji Hye Han, Byung Woo Kang, Hye Jin Park, Sang Wook Lee, Bon Seok Koo, Jung Won Lee
-
Publication number: 20230170147Abstract: A multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes stacked on each other interposing the dielectric layer therebetween, and external electrodes respectively disposed on the body, wherein the external electrode includes: a first electrode layer connected to the internal electrode; and a second electrode layer disposed on the first electrode layer, and including a conductive portion including an silver (Ag)-tin (Sn) alloy and a resin, and a ratio of an area of the Ag—Sn alloy to an area of the conductive portion satisfies 3 to 50% in at least a portion of a cross-section of the second electrode layer.Type: ApplicationFiled: February 4, 2022Publication date: June 1, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hye Jin PARK, Bon Seok KOO, Jung Min KIM, Hong Je CHOI, Byung Woo KANG, Ji Hye HAN, Sang Wook LEE
-
Patent number: 11651901Abstract: A multilayer electronic component includes: a body including dielectric layers and internal electrodes disposed alternately with the dielectric layers; and external electrodes disposed on the body, wherein each of the external electrodes includes: an electrode layer connected to the internal electrodes; a first intermetallic compound layer disposed on the electrode layer and including Cu3Sn; a second intermetallic compound layer disposed on the first intermetallic compound layer and including Cu6Sn5; and a conductive resin layer disposed on the second intermetallic compound layer and including a conductive connection portion including a low melting point metal, a plurality of metal particles, and a base resin, and an average thickness of the first intermetallic compound layer is 0.5 to 2.5 ?m.Type: GrantFiled: August 31, 2021Date of Patent: May 16, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Il Ro Lee, Jung Min Kim, Hong Je Choi, Sang Wook Lee, Seon Ho Park, Jeong Ryeol Kim, Bon Seok Koo
-
Publication number: 20230135148Abstract: A multilayer capacitor, includes: a body including a dielectric layer and first and second internal electrode, and a first external electrode and a second external electrode, each disposed an exterior of the body, the first external electrode being connected to the first internal electrode and the second external electrode being connected to the second internal electrode, wherein the first external electrode and the second external electrode include an electrode layer disposed on the body, and including a first intermetallic compound and glass; and a conductive resin layer disposed on the electrode layer, and including a plurality of metal particles and a resin.Type: ApplicationFiled: April 4, 2022Publication date: May 4, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Byung Woo KANG, Bon Seok KOO, Jung Min KIM, Ji Hye HAN, Hye Jin PARK, Sang Wook LEE, Hong Je CHOI
-
Patent number: 11636984Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.Type: GrantFiled: April 29, 2022Date of Patent: April 25, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Seok Yi, Jung Min Kim, Bon Seok Koo, Chang Hak Choi, Il Ro Lee, Byung Woo Kang, San Kyeong, Hae Sol Kang
-
Publication number: 20230119122Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, an intermetallic compound layer disposed on the electrode layer and including a first intermetallic compound and glass, and a conductive resin layer disposed on the intermetallic compound layer and including a conductive connection portion including a second intermetallic compound and a low-melting-point metal, a plurality of metal particles, and a resin. A ratio of a length of a first direction component of a region having the first intermetallic compound, with respect to a length of a first direction component of the intermetallic compound layer, is 20% or more.Type: ApplicationFiled: February 28, 2022Publication date: April 20, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ji Hye HAN, Jung Min KIM, Byung Woo KANG, Hong Je CHOI, Hye Jin PARK, Sang Wook LEE, Bon Seok KOO, Jung Won LEE
-
Publication number: 20230094110Abstract: A capacitor component includes a body including a dielectric layer and an internal electrode layer; and an external electrode disposed on one surface of the body, wherein the external electrode includes first electrode layers disposed on the one surface of the body to be spaced apart from each other, and covering a region of the one surface of the body through which the internal electrode layer is exposed; a second electrode layer including a base resin and a conductive connection portion disposed in the base resin, and disposed on the one surface of the body to cover the first electrode layers; and an intermetallic compound disposed only between each of the first electrode layers and the second electrode layer.Type: ApplicationFiled: January 10, 2022Publication date: March 30, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung Min Kim, Hong Je Choi, Ji Hye Han, Byung Woo Kang, Hye Jin Park, Sang Wook Lee, Bon Seok Koo, Jung Won Lee
-
Publication number: 20230066593Abstract: A multilayer electronic component include a first non-conductive resin layer, extending between a conductive resin layer and an electrode layer of a first external electrode, and a second non-conductive resin layer extending between a conductive resin layer and an electrode layer of a second external electrode. The first non-conductive layer and the second non-conductive layer may be spaced apart from each other to suppress arc discharge and to improve bending strength.Type: ApplicationFiled: October 24, 2022Publication date: March 2, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Seok YI, Il Ro LEE, Chang Hak CHOI, Bon Seok KOO, Jung Min KIM, Byung Woo KANG, San KYEONG
-
Patent number: 11594374Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other and alternately stacked with the respective dielectric layers interposed therebetween; a first external electrode connected to the first internal electrodes; a second external electrode connected to the second internal electrodes; and a protective layer disposed on the ceramic body, the first external electrode, and the second external electrode, wherein the protective layer includes an adhesion assisting layer and a coating layer.Type: GrantFiled: June 3, 2021Date of Patent: February 28, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyo Yeol Lee, Seung Hun Han, Sang Wook Lee, Jung Min Kim, Jeong Ryeol Kim
-
Patent number: 11562859Abstract: A multilayered capacitor includes a shock absorbing layer disposed between an upper layer of a capacitor body and a conductive resin layer of an external electrode and between a lower layer of the capacitor body and the conductive resin layer of the external electrode. A length of the shock absorbing layer is longer than that of the conductive resin layer, thereby improving warpage strength characteristics of the capacitor body.Type: GrantFiled: October 19, 2021Date of Patent: January 24, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Seok Yi, Jung Min Kim, Chang Hak Choi, Bon Seok Koo, Byung Woo Kang, Hae Sol Kang, San Kyeong, Jun Hyeon Kim
-
Patent number: 11508522Abstract: A multilayer electronic component include a first non-conductive resin layer, extending between a conductive resin layer and an electrode layer of a first external electrode, and a second non-conductive resin layer extending between a conductive resin layer and an electrode layer of a second external electrode. The first non-conductive layer and the second non-conductive layer may be spaced apart from each other to suppress arc discharge and to improve bending strength.Type: GrantFiled: April 24, 2020Date of Patent: November 22, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Seok Yi, Il Ro Lee, Chang Hak Choi, Bon Seok Koo, Jung Min Kim, Byung Woo Kang, San Kyeong
-
Patent number: 11469051Abstract: A multilayer capacitor includes a capacitor body including first to six surfaces, and including a dielectric layer, first and second internal electrodes, and first and second external electrodes. The first and second external electrodes include first and second sintered layers, and first and second plating layers, respectively. An insulating layer is disposed on the capacitor body, to cover an end portion of a first band portion of the first sintered layer and an end portion of a second band portion of the second sintered layer, and has a maximum thickness of 10 ?m or more. A portion of the first band portion of the first sintered layer is exposed from the insulating layer. A portion of the second band portion of the second sintered layer is exposed from the insulating layer.Type: GrantFiled: April 16, 2021Date of Patent: October 11, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ji Hye Han, Jung Min Kim, Jae Seok Yi, Hye Jin Park, Byung Woo Kang, Jeong Ryeol Kim, Bon Seok Koo, Il Ro Lee
-
Patent number: 11466239Abstract: A biological material manufacturing device according to an embodiment of the inventive concept includes a main body and a head unit that is rotatable on the main body. The main body includes a main groove and a first container groove connected to the main groove. The head unit includes a pillar provided in the main groove and a protruding part that protrudes from the pillar.Type: GrantFiled: January 31, 2020Date of Patent: October 11, 2022Assignee: VIEA Logis Co., Ltd.Inventors: Chul-Hong Choi, Dong-Wook Shin, In-Sang Yoon, Jung-Min Kim