Abstract: An electronic device module includes: a substrate; a sealing portion disposed on the substrate; at least one electronic device mounted on the substrate and embedded in the sealing portion; and a roof wiring at least partially disposed on a surface of the sealing portion and electrically connecting the substrate to the at least one electronic device or electrically connecting electronic devices, among the at least one electronic device, to each other. The roof wiring includes: a surface wiring disposed on one surface of the sealing portion; and at least one post wiring connecting the surface wiring to the substrate or to the at least one electronic device, and wherein at least a portion of a circumferential surface of the at least one post wiring is bonded to the surface wiring.

Abstract: An electronic device module includes: a substrate; a sealing portion disposed on the substrate; at least one electronic device mounted on the substrate and embedded in the sealing portion; and a roof wiring at least partially disposed on a surface of the sealing portion and electrically connecting the substrate to the at least one electronic device or electrically connecting electronic devices, among the at least one electronic device, to each other. The roof wiring includes: a surface wiring disposed on one surface of the sealing portion; and at least one post wiring connecting the surface wiring to the substrate or to the at least one electronic device, and wherein at least a portion of a circumferential surface of the at least one post wiring is bonded to the surface wiring.

Abstract: An electronic device module includes a substrate, a first device and a second device mounted on the substrate, and a shielding frame mounted on the substrate to accommodate the first device. The shielding frame includes a heat dissipating portion stacked on the first device, and posts extended from an edge of the heat dissipating portion and spaced apart from each other. A spacing distance between the posts is smaller than a wavelength of an electromagnetic wave introduced into the first device or output from the first device.

Abstract: A semiconductor package includes a substrate, an electronic component mounted on an upper surface of the substrate so that a lower surface of the electronic component faces the upper surface of the substrate, a heat slug disposed on an upper surface of the electronic component so that a lower surface of the heat slug faces the upper surface of the electronic component, a bonding material bonding the heat slug to the upper surface of the electronic component, and an encapsulant in which the heat slug and the electronic component are embedded. A side surface of the heat slug extending between an edge of the lower surface of the heat slug and an edge of an upper surface of the heat slug forms a recess with the upper surface of the electronic component.

Abstract: An electronic device module includes: a substrate; a heating element mounted on a first surface of the substrate; a heat radiating portion coupled to one surface of the heating element; a signal transmission portion mounted on the first surface of the substrate and configured to electrically connect the substrate externally; and a sealing portion sealing the heating element, the heat radiating portion, and the signal transmission portion. The heat radiating portion includes: a heat transfer portion having an area larger than an area of the heating element; and a heat release portion protruding from one surface of the heat transfer portion. The heat release portion has an area smaller than the area of the heat transfer portion and has an exposed surface coplanar with an external surface of the sealing portion.

Abstract: A semiconductor package includes a substrate, an electronic component mounted on an upper surface of the substrate so that a lower surface of the electronic component faces the upper surface of the substrate, a heat slug disposed on an upper surface of the electronic component so that a lower surface of the heat slug faces the upper surface of the electronic component, a bonding material bonding the heat slug to the upper surface of the electronic component, and an encapsulant in which the heat slug and the electronic component are embedded. A side surface of the heat slug extending between an edge of the lower surface of the heat slug and an edge of an upper surface of the heat slug forms a recess with the upper surface of the electronic component.

Abstract: An electronic device module includes a substrate, a first device and a second device mounted on the substrate, and a shielding frame mounted on the substrate to accommodate the first device. The shielding frame includes a heat dissipating portion stacked on the first device, and posts extended from an edge of the heat dissipating portion and spaced apart from each other. A spacing distance between the posts is smaller than a wavelength of an electromagnetic wave introduced into the first device or output from the first device.