Patents by Inventor Jung-sang Ko

Jung-sang Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cooling device with micro cooling fin
    Patent number: 6425439
    Abstract: A cooling device with micro cooling fins is provided. The cooling device includes a substrate, a plurality of vibrating type cooling fins extending from the substrate, and a blast fan for ventilating the substrate to cool the substrate and the vibrating type cooling fins and for causing the vibrating type cooling fins to vibrate. Accordingly, micro cooling fins formed on the surface of a substrate change the flowing path of the air and improve the performance of heat transfer near the surface of the substrate due to their vibration. In other words, the resistance to heat transfer is decreased and the performance of heat transfer is improved by disturbing the formation of a heat boundary layer, which is formed on a smooth surface. Since the cooling device provides improved heat transfer performance compared to an existing cooling device, an area and volume for heat transfer can be decreased so that the cooling device can be miniaturized.
    Type: Grant
    Filed: December 31, 2001
    Date of Patent: July 30, 2002
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Geunbae Lim, Hayong Yun, Jung Hyun Lee, Yukeun Eugene Pak, Jung-sang Ko, Sung-jin Kim
  • Cooling device with micro cooling fin
    Publication number: 20020056543
    Abstract: A cooling device with micro cooling fins is provided. The cooling device includes a substrate, a plurality of vibrating type cooling fins extending from the substrate, and a blast fan for ventilating the substrate to cool the substrate and the vibrating type cooling fins and for causing the vibrating type cooling fins to vibrate. Accordingly, micro cooling fins formed on the surface of a substrate change the flowing path of the air and improve the performance of heat transfer near the surface of the substrate due to their vibration. In other words, the resistance to heat transfer is decreased and the performance of heat transfer is improved by disturbing the formation of a heat boundary layer, which is formed on a smooth surface. Since the cooling device provides improved heat transfer performance compared to an existing cooling device, an area and volume for heat transfer can be decreased so that the cooling device can be miniaturized.
    Type: Application
    Filed: December 31, 2001
    Publication date: May 16, 2002
    Inventors: Geunbae Lim, Hayong Yun, Jung Hyun Lee, Yukeun Eugene Pak, Jung-sang Ko, Sung-Jin Kim
  • Cooling device with micro cooling fin
    Patent number: 6334480
    Abstract: A cooling device with micro cooling fins is provided. The cooling device includes a substrate, a plurality of vibrating type cooling fins extending from the substrate, and a blast fan for ventilating the substrate to cool the substrate and the vibrating type cooling fins and for causing the vibrating type cooling fins to vibrate. Accordingly, micro cooling fins formed on the surface of a substrate change the flowing path of the air and improve the performance of heat transfer near the surface of the substrate due to their vibration. In other words, the resistance to heat transfer is decreased and the performance of heat transfer is improved by disturbing the formation of a heat boundary layer, which is formed on a smooth surface. Since the cooling device provides improved heat transfer performance compared to an existing cooling device, an area and volume for heat transfer can be decreased so that the cooling device can be miniaturized.
    Type: Grant
    Filed: November 1, 2000
    Date of Patent: January 1, 2002
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Geunbae Lim, Hayong Yun, Jung Hyun Lee, Yukeun Eugene Pak, Jung-sang Ko, Sung-jin Kim