Patents by Inventor Jung Yong Park

Jung Yong Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11923564
    Abstract: A method for producing a battery module is provided. The method for producing a battery module includes: stacking a plurality of battery cells; disposing a plurality of bus bars adjacent to electrode leads respectively provided at the plurality of battery cells; by a welding jig, pressing the electrode leads so that the electrode leads come into contact with the bus bars, respectively; and welding the electrode leads and the bus bars through an opening formed in the welding jig.
    Type: Grant
    Filed: May 10, 2022
    Date of Patent: March 5, 2024
    Assignee: LG ENERGY SOLUTION, LTD.
    Inventors: Ho-June Chi, Jung-Hoon Lee, Jeong-O Mun, Jin-Yong Park
  • Publication number: 20240073445
    Abstract: Disclosed is a method of decoding an image and a method of encoding an image. The method of decoding an image includes: obtaining motion-constrained tile set information; determining, on the basis of the motion-constrained tile set information, a first boundary region of a collocated tile set within a reference picture, which corresponds to a motion-constrained tile set; padding a second boundary region corresponding to the first boundary region; and performing inter prediction on the motion-constrained tile set by using a collocated tile set that includes the padded second boundary region.
    Type: Application
    Filed: November 8, 2023
    Publication date: February 29, 2024
    Applicants: Electronics and Telecommunications Research Institute, CHIPS&MEDIA, INC
    Inventors: Ha Hyun LEE, Jung Won KANG, Sung Chang LIM, Jin Ho LEE, Hui Yong KIM, Dae Yeon KIM, Dong Jin PARK
  • Publication number: 20150060114
    Abstract: Disclosed herein is a rigid flexible printed circuit board (PCB) including: a flexible area having a flexible copper foil laminate in which circuit layers are formed on an insulating material, and cover lays formed on the laminate; and rigid areas having insulating layers and copper layers built-up on both sides of the flexible area, and flattening materials to flatten outer surfaces of the insulating layers.
    Type: Application
    Filed: November 22, 2013
    Publication date: March 5, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Yong PARK, Tae Ho Ko, Seok Cheol Song
  • Publication number: 20140096377
    Abstract: A method of manufacturing a rigid-flexible printed circuit board in accordance with an embodiment of the present invention includes: providing a pair of rigid boards and a flexible substrate inserted in between the pair of rigid boards and having one end thereof extended outside the pair of rigid boards; mounting a cover film on an extended area of the flexible substrate; providing a pair of pressing jigs disposed, respectively, above and below the rigid boards and the flexible substrate, having a protruded part formed on each thereof corresponding to a step difference between the rigid boards and the flexible substrate, and configured to press the pair of rigid boards and the flexible substrate and press the flexible substrate and the cover film mounted thereon; and pressing the rigid boards, the flexible substrate and the cover film with the pressing jigs.
    Type: Application
    Filed: October 2, 2013
    Publication date: April 10, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung-Yong Park, Jung-Woo KIM
  • Publication number: 20140082937
    Abstract: Disclosed herein is a method of manufacturing a rigid flexible printed circuit board, including: preparing a flexible substrate having an inner layer circuit pattern formed on one surface or both surfaces thereof and divided into a rigid region and a flexible region; forming a protective layer in the flexible region of the flexible substrate; forming a coverlay so as to expose the protective layer on one surface of the flexible substrate; stacking a rigid insulating layer in the rigid region and stacking a metal layer in the protective layer and the rigid insulating layer; forming an outer layer circuit layer by patterning the metal layer and removing the metal layer in the flexible region; and removing the protective layer.
    Type: Application
    Filed: September 23, 2013
    Publication date: March 27, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jung Yong Park, Seok Cheol Song, Myong Keun Jung, Jae Woo Joung
  • Publication number: 20130292164
    Abstract: Disclosed herein is a rigid-flexible substrate including: a rigid area including a circuit layer; a flexible area formed at one end of the rigid area; and a raw material formed over the flexible area and having indentation formed on a surface thereof.
    Type: Application
    Filed: April 25, 2013
    Publication date: November 7, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Yong Park, Myeong Hui Jung, Jae Woo Joung, Dae Hyung You
  • Publication number: 20130298021
    Abstract: A method and an apparatus are disclosed for moving an execution point of a multimedia file through an expansive search of a multimedia file being executed by the multimedia executing apparatus. When the multimedia executing apparatus enters into an expansive search mode during a display of a progress bar having an execution point for execution of a multimedia file on a screen according to the execution of the multimedia file, an enlarged progress bar representing an enlarged section of the progress bar including the execution point is displayed on the screen.
    Type: Application
    Filed: March 11, 2013
    Publication date: November 7, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung-Yong PARK, Jung-Min YOON, Sang-Uk LEE
  • Patent number: 8015835
    Abstract: An internal cooling apparatus for automobiles includes a first expansion valve for spraying a coolant to a main evaporator through a high-pressure pipe, a compressor receiving the coolant evaporated in the main evaporator through a low-pressure pipe, a condenser receiving the coolant compressed in the compressor, and a plurality of sub-evaporators each being installed inside of a seat to contact an automobile passenger. One end of each of the sub-evaporators is communicated with the high-pressure pipe and the other end thereof is communicated with the low-pressure pipe such that part of the coolant sprayed through the first expansion valve is supplied to the compressor via each of the sub-evaporators.
    Type: Grant
    Filed: October 30, 2008
    Date of Patent: September 13, 2011
    Assignee: Korea Delphi Automotive Systems Corporation
    Inventors: Kwang Yong Lee, Young Jo Park, Dong Han Kim, Jung Yong Park, Jae Ho Jeong
  • Patent number: D817234
    Type: Grant
    Filed: January 3, 2017
    Date of Patent: May 8, 2018
    Assignee: Honda Motor Co., Ltd.
    Inventor: Jung Yong Park
  • Patent number: D951159
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: May 10, 2022
    Inventors: Ji-Su Oh, Jung-Yong Park
  • Patent number: D951840
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: May 17, 2022
    Inventors: Man-Hee Cho, Jung-Yong Park
  • Patent number: D952918
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: May 24, 2022
    Inventors: Hyub Jegal, Jung-Yong Park, Dong-Hoon Choo, Jin-Hyoung Cho
  • Patent number: D952919
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: May 24, 2022
    Inventors: Hyub Jegal, Jung-Yong Park, Dong-Hoon Choo, Jin-Hyoung Cho
  • Patent number: D956290
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: June 28, 2022
    Inventors: Moon-Soo Park, Jung-Yong Park, Ju-Whan Moon, Hyun-Soo Kim
  • Patent number: D957706
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: July 12, 2022
    Inventors: Hyub Jegal, Jung-Yong Park, Dong-Hoon Choo, Jin-Hyoung Cho
  • Patent number: D960414
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: August 9, 2022
    Inventors: Hyub Jegal, Jung-Yong Park, Dong-Hoon Choo, Jin-Hyoung Cho
  • Patent number: D961453
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: August 23, 2022
    Inventor: Jung-Yong Park
  • Patent number: D971807
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: December 6, 2022
    Inventors: Kyeong-Kuk Cho, Jung-Yong Park
  • Patent number: D994566
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: August 8, 2023
    Inventors: Je-Won Choi, Jung-Yong Park
  • Patent number: D1016673
    Type: Grant
    Filed: May 18, 2023
    Date of Patent: March 5, 2024
    Inventor: Jung Yong Park