Patents by Inventor Jung-Ho Shin

Jung-Ho Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11993251
    Abstract: A method and system for controlling an engine clutch of a P2 type parallel hybrid vehicle includes steps of: determining whether or not a learning mode entry condition is satisfied, depending on whether or not a kickdown shift occurs during performance of variable hydraulic control of an engine clutch and based on the degree to which slip of the engine clutch occurs, deriving and storing a learning hydraulic value for suppressing the slip that is to occur when the kickdown shift occurs during the performance of the variable hydraulic control in such a manner that the slip does not occur, when a vehicle state satisfies a predetermined learning mode entry condition, and computing a final hydraulic pressure by adding a hydraulic compensation value to a target hydraulic pressure, when the same kickdown shift situation occurs, and controlling the engine clutch using the computed final hydraulic pressure.
    Type: Grant
    Filed: February 1, 2022
    Date of Patent: May 28, 2024
    Assignee: Hyundai Kefico Corporation
    Inventors: Jun-Hyung Lee, Jung-Mook Choo, Young-Ho Jun, Hyun-Ki Shin, Hyung-Jin Shin
  • Publication number: 20240152539
    Abstract: A method for classifying patent documents may include the steps of identifying original patent documents in a patent pool identified according to a search and/or selection input of a user, determining the first patent documents classified in the classification generated by the user, among the original patent documents in the patent pool; outputting an indication for accuracy related to the automatic classification; and performing the automatic classification for second patent document which are not yet classified, among the patent documents in the patent pool.
    Type: Application
    Filed: January 17, 2024
    Publication date: May 9, 2024
    Applicant: WERT INTELLIGENCE CO.,LTD.
    Inventors: Jung Ho Yun, Jung Hoon Shin
  • Publication number: 20240155212
    Abstract: A camera module includes: a first body including a substrate; an image sensor mounted on the substrate; a second body including a lens module; a ball bearing disposed between the first body and the second body to enable movement of the second body relative to the first body; and a driving member disposed between the first body and the second body to provide driving force to move the second body in at least one direction intersecting an optical axis.
    Type: Application
    Filed: May 16, 2023
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Do Hwan KIM, Ju Ho KIM, Sang Hyun JI, Jung Hyun PARK, Nam Keun OH, Doo Seub SHIN, Dong Hoon LEE, Jong Eun PARK, Sangik CHO
  • Patent number: 11967679
    Abstract: The present invention relates to a composition for a gel polymer electrolyte, which includes a lithium salt, a non-aqueous organic solvent, a polymerization initiator, and an oligomer containing a polycarbonate-based repeating unit, a gel polymer electrolyte in which mechanical strength and ion transfer capability are improved by polymerization of the composition for a gel polymer electrolyte, and a lithium secondary battery in which external impact and stability during high-temperature storage are improved by including the gel polymer electrolyte.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: April 23, 2024
    Assignee: LG ENERGY SOLUTION, LTD.
    Inventors: Kyoung Ho Ahn, Jung Hoon Lee, Won Kyung Shin, Jae Won Lee, Min Jung Kim, Chul Haeng Lee
  • Publication number: 20240127470
    Abstract: In a method of predicting a position of an object at a future time point for a vehicle, video image information at a current time point and at a plurality of time points before the current time point acquired through a camera of the vehicle may be extracted as semantic segmentation image. A mask image imaging an attribute and position information of an object present in each of the video images may be extracted. A position distribution of the object may be predicted by deriving a plurality of hypotheses for a position of the object at a future time point through deep learning by receiving video images at the current time point and the time points before the current time point, a plurality of semantic segmentation images, a plurality of mask images, and ego-motion information of the vehicle, and calculating the plurality of hypotheses as a Gaussian mixture probability distribution.
    Type: Application
    Filed: March 23, 2023
    Publication date: April 18, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, Ewha University - Industry Collaboration Foundation
    Inventors: Hyung-Wook Park, Jang-Ho Shin, Seo-Young Jo, Je-Won Kang, Jung-Kyung Lee
  • Publication number: 20240096071
    Abstract: There is provided a video processing method performed by a computing device, the method including the steps of: collecting video from an external device; generating preprocessed data by extracting two-dimensional or three-dimensional skeleton information from the video; pre-training a first artificial intelligence model including N transformer blocks from the preprocessed data by applying an attention from a body of an object to a plurality of joints, an attention from each of the plurality of joints to the body, and an attention between persons; and learning, when parameters determined as a result of the pre-training of the first artificial intelligence model are transferred, a method of recognizing an action from the video received from the external device, using a second artificial intelligence model including the N transformer blocks on the basis of the parameters, wherein N is a natural number equal to or larger than 2.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 21, 2024
    Applicant: KOREA ELECTRONICS TECHNOLOGY INSTITUTE
    Inventors: Sa Im SHIN, Jung Ho KIM, Bo Eun KIM
  • Patent number: 11932618
    Abstract: Disclosed are novel compounds of Chemical Formula 1, optical isomers of the compounds, and pharmaceutically acceptable salts of the compounds or the optical isomers. The compounds, isomers, and salts exhibit excellent activity as GLP-1 receptor agonists. In particular, they, as GLP-1 receptor agonists, exhibit excellent glucose tolerance, thus having a great potential to be used as therapeutic agents for metabolic diseases. Moreover, they exhibit excellent pharmacological safety for cardiovascular systems.
    Type: Grant
    Filed: March 13, 2023
    Date of Patent: March 19, 2024
    Assignee: ILDONG PHARMACEUTICAL CO., LTD.
    Inventors: Hong Chul Yoon, Kyung Mi An, Myong Jae Lee, Jin Hee Lee, Jeong-geun Kim, A-rang Im, Woo Jin Jeon, Jin Ah Jeong, Jaeho Heo, Changhee Hong, Kyeojin Kim, Jung-Eun Park, Te-ik Sohn, Changmok Oh, Da Hae Hong, Sung Wook Kwon, Jung Ho Kim, Jae Eui Shin, Yeongran Yoo, Min Whan Chang, Eun Hye Jang, In-gyu Je, Ji Hye Choi, Gunhee Kim, Yearin Jun
  • Publication number: 20240088751
    Abstract: A motor includes a rotor and a stator, in which the rotor includes: a rotor core including a plurality of core portions disposed on a rotation shaft along an axial direction of the rotor, wherein the rotor core includes a core flow path through which a cooling fluid passes through each core portion; and a cooling plate which is inserted between the two divided core portions so that both surfaces are joined to the two neighboring core portions, and a distribution flow path that distributes the cooling fluid supplied from a cooling flow path of the rotation shaft into the core flow path of the two neighboring core portions is provided between at least one of the two neighboring core portions and the cooling plate.
    Type: Application
    Filed: February 1, 2023
    Publication date: March 14, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Jung Woo LEE, Young Jin SHIN, Ju Ho LEE, Young Chul KIM, Jong Hoon LEE
  • Patent number: 11295972
    Abstract: The present disclosure provides a method for transfer and assembly of RGB micro-light-emitting diodes using vacuum suction force whereby the vacuum state of micrometer-sized adsorption holes to which micro-light-emitting diodes formed on a mother substrate or a temporary substrate are bonded is controlled selectively, so that only the micro-light-emitting diode devices desired to be detached from the mother substrate or the temporary substrate are detached from the mother substrate or the temporary substrate using vacuum suction force and then transferred to a target substrate.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: April 5, 2022
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Keon Jae Lee, Han Eol Lee, Tae Jin Kim, Jung Ho Shin, Sang Hyun Park
  • Patent number: 10910224
    Abstract: A method for fabricating a semiconductor device includes: forming a gate trench in a semiconductor substrate; forming a gate dielectric layer over a bottom surface and sidewalls of the gate trench; forming a first work function layer over the gate dielectric layer; doping a work function adjustment element to form a second work function layer which overlaps with the sidewalls of the gate trench; forming a gate conductive layer that partially fills the gate trench; and forming doped regions inside the semiconductor substrate on both sides of the gate trench.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: February 2, 2021
    Assignee: SK hynix Inc.
    Inventors: Tae-Su Jang, Jin-Chul Park, Ji-Hwan Park, Il-Sik Jang, Seong-Wan Ryu, Se-In Kwon, Jung-Ho Shin, Dae-Jin Ham
  • Publication number: 20200411323
    Abstract: A method for fabricating a semiconductor device includes: forming a gate trench in a semiconductor substrate; forming a gate dielectric layer over a bottom surface and sidewalls of the gate trench; forming a first work function layer over the gate dielectric layer; doping a work function adjustment element to form a second work function layer which overlaps with the sidewalls of the gate trench; forming a gate conductive layer that partially fills the gate trench; and forming doped regions inside the semiconductor substrate on both sides of the gate trench.
    Type: Application
    Filed: September 14, 2020
    Publication date: December 31, 2020
    Inventors: Tae-Su JANG, Jin-Chul PARK, Ji-Hwan PARK, Il-Sik JANG, Seong-Wan RYU, Se-In KWON, Jung-Ho SHIN, Dae-Jin HAM
  • Patent number: 10811260
    Abstract: A method for fabricating a semiconductor device includes: forming a gate trench in a semiconductor substrate; forming a gate dielectric layer over a bottom surface and sidewalls of the gate trench; forming a first work function layer over the gate dielectric layer; doping a work function adjustment element to form a second work function layer which overlaps with the sidewalls of the gate trench; forming a gate conductive layer that partially fills the gate trench; and forming doped regions inside the semiconductor substrate on both sides of the gate trench.
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: October 20, 2020
    Assignee: SK hynix Inc.
    Inventors: Tae-Su Jang, Jin-Chul Park, Ji-Hwan Park, Il-Sik Jang, Seong-Wan Ryu, Se-In Kwon, Jung-Ho Shin, Dae-Jin Ham
  • Publication number: 20200211879
    Abstract: The present disclosure provides a method for transfer and assembly of RGB micro-light-emitting diodes using vacuum suction force whereby the vacuum state of micrometer-sized adsorption holes to which micro-light-emitting diodes formed on a mother substrate or a temporary substrate are bonded is controlled selectively, so that only the micro-light-emitting diode devices desired to be detached from the mother substrate or the temporary substrate are detached from the mother substrate or the temporary substrate using vacuum suction force and then transferred to a target substrate
    Type: Application
    Filed: December 26, 2019
    Publication date: July 2, 2020
    Inventors: Keon Jae LEE, Han Eol LEE, Tae Jin KIM, Jung Ho SHIN, Sang Hyun PARK
  • Publication number: 20190378749
    Abstract: The present disclosure provides a method for transferring a semiconductor device using a micro-vacuum module, wherein the micro-vacuum module includes: a vacuum-forming substrate having a plurality of through-holes, which are connected to an external pump module and a vacuum control unit, formed; and a pattern-forming unit equipped with a single channel or a plurality of independent channels, which is coupled to the vacuum-forming substrate, wherein the plurality of channels are formed to be communicated respectively to a plurality of vacuum holes which have a smaller size than the size of a semiconductor device to be transferred, and the plurality of vacuum holes, having a diameter smaller than 100 ?m, are contacted to a micro semiconductor device having a width and a length of 100 ?m or smaller and the micro semiconductor device is transferred using vacuum adsorption.
    Type: Application
    Filed: December 19, 2018
    Publication date: December 12, 2019
    Inventors: Keon Jae Lee, Han Eol Lee, Tae Jin Kim, Jung Ho Shin, Sang Hyun Park
  • Publication number: 20190244820
    Abstract: A method for fabricating a semiconductor device includes: forming a gate trench in a semiconductor substrate; forming a gate dielectric layer over a bottom surface and sidewalls of the gate trench; forming a first work function layer over the gate dielectric layer; doping a work function adjustment element to form a second work function layer which overlaps with the sidewalls of the gate trench; forming a gate conductive layer that partially fills the gate trench; and forming doped regions inside the semiconductor substrate on both sides of the gate trench.
    Type: Application
    Filed: April 12, 2019
    Publication date: August 8, 2019
    Inventors: Tae-Su JANG, Jin-Chul PARK, Ji-Hwan PARK, Il-Sik JANG, Seong-Wan RYU, Se-In KWON, Jung-Ho SHIN, Dae-Jin HAM
  • Patent number: 10371972
    Abstract: Disclosed herein is a display apparatus including a liquid crystal panel configured to display an image; a backlight unit including: a light source; and an optical member disposed at a path of light emitted from the light source toward the liquid crystal panel; a chassis disposed on the backlight unit and having a plurality of insertion holes along edges thereof; and a frame configured to support the liquid crystal panel and the optical member, the liquid crystal panel and the optical member provided between the frame and the chassis, wherein the frame is coupled to the plurality of insertion holes of the chassis by fitting.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: August 6, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung Ho Shin, Heong Seog Lee, Jai-Ho Jeong
  • Patent number: 10304684
    Abstract: A method for fabricating a semiconductor device includes: forming a gate trench in a semiconductor substrate; forming a gate dielectric layer over a bottom surface and sidewalls of the gate trench; forming a first work function layer over the gate dielectric layer; doping a work function adjustment element to form a second work function layer which overlaps with the sidewalls of the gate trench; forming a gate conductive layer that partially fills the gate trench; and forming doped regions inside the semiconductor substrate on both sides of the gate trench.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: May 28, 2019
    Assignee: SK hynix Inc.
    Inventors: Tae-Su Jang, Jin-Chul Park, Ji-Hwan Park, Il-Sik Jang, Seong-Wan Ryu, Se-In Kwon, Jung-Ho Shin, Dae-Jin Ham
  • Patent number: 10290785
    Abstract: A laminating structure of an electronic device using a transferring element according to the present disclosure includes a target substrate, a bottom electrode formed on the target substrate, an electronic device which is bonded to the bottom electrode, a top contact formed on the electronic device, a transferring element which is placed between the bottom electrode and the electronic device on the target substrate, and a top electrode connected to the electronic device, wherein the transferring element attached to the carrier substrate comes into contact with the electronic device, and is then transferred onto the target substrate.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: May 14, 2019
    Assignee: CENTER FOR INTEGRATED SMART SENSORS FOUNDATION
    Inventors: Keon Jae Lee, Han Eol Lee, Do Hyun Kim, Jung Ho Shin, Seong Kwang Hong
  • Publication number: 20190103532
    Abstract: A laminating structure of an electronic device using a transferring element according to the present disclosure includes a target substrate, a bottom electrode formed on the target substrate, an electronic device which is bonded to the bottom electrode, a top contact formed on the electronic device, a transferring element which is placed between the bottom electrode and the electronic device on the target substrate, and a top electrode connected to the electronic device, wherein the transferring element attached to the carrier substrate comes into contact with the electronic device, and is then transferred onto the target substrate.
    Type: Application
    Filed: October 3, 2017
    Publication date: April 4, 2019
    Inventors: Keon Jae Lee, Han Eol Lee, Do Hyun Kim, Jung Ho Shin, Seong Kwang Hong
  • Publication number: 20180174845
    Abstract: A method for fabricating a semiconductor device includes: forming a gate trench in a semiconductor substrate; forming a gate dielectric layer over a bottom surface and sidewalls of the gate trench; forming a first work function layer over the gate dielectric layer; doping a work function adjustment element to form a second work function layer which overlaps with the sidewalls of the gate trench; forming a gate conductive layer that partially fills the gate trench; and forming doped regions inside the semiconductor substrate on both sides of the gate trench.
    Type: Application
    Filed: September 25, 2017
    Publication date: June 21, 2018
    Inventors: Tae-Su JANG, Jin-Chul PARK, Ji-Hwan PARK, Il-Sik JANG, Seong-Wan RYU, Se-In KWON, Jung-Ho SHIN, Dae-Jin HAM