Abstract: The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate.

Abstract: The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate.In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation.

Abstract: Improved vie-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multi-layer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.

Abstract: The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate.In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation.

Abstract: Improved via-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multilayer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.

Abstract: A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating with an opposite similar contact. Displacement damage is averted through accommodating lateral stresses by providing one or more of a conformal opposing contact, by strengthening through coating and base reinforcement and a deformable coating. The contacts are fabricated by physical and chemical processes including sputtering, normal and pulse electroplating and chemical vapor deposition. Pulse electroplating of palladium provides a dendritic deposit of uniform height, uniform rounded points and less branching. The contacts on completion are provided with a surrounding immobilizing material that enhances rigidity.

Abstract: This invention relates to a ceramic module and to methods for forming protruding, upstanding electrically conducting pins by the selective abrasion of a surface 18 of a multilayered ceramic module 10. An abrasive blasting device 40 is disposed adjacent to the surface 18 for directing a stream of abrasive particles 42 against the surface. The particles 42 strike both metallic conductors 20 and 22 and also the ceramic material of the layer 14. Inasmuch as the ceramic material is relatively hard and brittle as compared to the ductile metallic conductors the abrasive particles 42 abrade away the ceramic layer 14 at a faster rate than the ductile metallic material of the conductors 20 and 22. The abrasive particles 42 may be comprised of any suitable abrasive, such as Al.sub.2 O.sub.3, SiC or WC. The module may be rotated beneath a nozzle of the grit blasting device, the nozzle being linearly translated above the surface being abraded.

Abstract: A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating with an opposite similar contact. Displacement damage is averted through accommodating lateral stresses by providing one or more of a conformal opposing contact, by strengthening through coating and base reinforcement and a deformable coating. The contacts are fabricated by physical and chemical processes including sputtering, normal and pulse electroplating and chemical vapor deposition. The contacts on completion are provided with a surrounding immobilizing material that enhances rigidity.

Abstract: A structure, and method of fabrication thereof, having a polymeric layer containing a pattern of oxide particles embedded therein. The regions of the polymeric material having the oxide particles therein have an optical reflectivity or transmitivity which is different than the optical reflectivity or transmitivity of the regions of the polymeric material without the oxide particles. The structure can be used as an optical storage device.

Abstract: An electrical connector is described for making contact with a plurality of convex and deformable contacts on an electronic device. The electrical connector comprises a substrate having a plurality of conductors which extend above its surface. A polymeric material is disposed on the surface of the substrate and has openings which expose the conductors, each opening sized to receive one of the convex, deformable contacts, and to enable electrical connection between the exposed conductors and the deformable contacts. A mechanism is provided for urging the deformable contacts on the electronic device against the exposed conductors. The mechanism exerts sufficient force between the device and the conductors to cause some deformation of the convex contact areas by the conductors.

Abstract: This invention relates to a ceramic module and to methods for forming protruding, upstanding electrically conducting pins by the selective abrasion of a surface 18 of a multilayered ceramic module 10. An abrasive blasting device 40 is disposed adjacent to the surface 18 for directing a stream of abrasive particles 42 against the surface. The particles 42 strike both metallic conductors 20 and 22 and also the ceramic material of the layer 14. Inasmuch as the ceramic material is relatively hard and brittle as compared to the ductile metallic conductors the abrasive particles 42 abrade away the ceramic layer 14 at a faster rate than the ductile metallic material of the conductors 20 and 22. The abrasive particles 42 may be comprised of any suitable abrasive, such as Al.sub.2 O.sub.3, SiC or WC. The module may be rotated beneath a nozzle of the grit blasting device, the nozzle being linearly translated above the surface being abraded.

Abstract: Strengthened ceramic and a method for increasing the mechanical strength of fully sintered ceramic articles, in particular alumina type ceramic and glass-ceramic articles. Such articles are strengthened by forming a compresssive material layer of amorphous silicon dioxide or refractory metal nitride on the surface of the article to be strengthened.

Abstract: A layer of zirconium can be used as an adhesion layer between a ceramic or polyimide substrate and subsequently applied metallic layers. Following the zirconium layer, copper can be deposited followed by a reaction barrier layer and a wettable surface layer such as gold. This type of structure can be used for pin bracing, chip joining, and/or wire connections.