Abstract: A semiconductor package includes a package base substrate including a potential plate. An interposer is arranged on the package base substrate and comprises at least one interposer through electrode, at least one first connection bump, and at least one second connection bump. A first stacked chip unit is arranged on the interposer and comprises a first semiconductor chip and at least one second semiconductor chips arranged on the first semiconductor chip. At least one passive device unit is arranged on the package base substrate. The at least one passive device unit is spaced apart from the interposer in a horizontal direction parallel to an upper surface of the package base substrate. The at least one first connection bump is a dummy bump. The potential plate electrically connects the at least one first connection bump and a power terminal of the at least one passive device unit to each other.

Abstract: Disclosed is a method implemented with a computer system executing instructions for a semiconductor design simulation. The method includes generating a plurality of floor plans placing a plurality of circuit blocks differently, generating a plurality of power models from the plurality of floor plans, and selecting a layout corresponding to one of the plurality of floor plans by selecting at least one power model satisfying system requirements from among the plurality of power models.

Abstract: Disclosed is a method implemented with a computer system executing instructions for a semiconductor design simulation. The method includes generating a plurality of floor plans placing a plurality of circuit blocks differently, generating a plurality of power models from the plurality of floor plans, and selecting a layout corresponding to one of the plurality of floor plans by selecting at least one power model satisfying system requirements from among the plurality of power models.

Abstract: Disclosed herein is a wood plastic composite panel made of a resin composite in which wood fiber having a size of 80 to 300 meshes is included in a synthetic resin matrix, the wood plastic composite panel being provided at the entire surface thereof with an embossed structure of a lumber cut-open pattern having an average depth of 200 to 900 ?m and a linear micro concavo-convex structure having an average depth of 10 to 500 ?m, the panel having a reflection rate of 10 to 50% when light is incident on the surface of the panel at an incidence angle of 60 degrees. The wood plastic composite panel according to the present invention has excellent strength and durability. Furthermore, the wood plastic composite panel according to the present invention exhibits excellent appearance and texture comparable with cut-open surfaces of natural lumbers although the panel has a surface structure different from the cut-open surfaces of the natural lumbers.

Abstract: Disclosed is an articulated bracket for a fence. The articulated bracket which couples a pillar member and a horizontal member disposed between the pillar members, includes a first articulated part which is coupled with the pillar member and formed with an internal space communicated with an outside; and a second articulated part formed with a center portion disposed in the internal space of the first articulated part and a connection portion fastened to the horizontal member, wherein the connection portion is pivoted on the center portion.

Abstract: Disclosed herein are a method of manufacturing a wood plastic composite panel, including a panel manufacturing process of extruding and cooling a resin complex, such that wood fiber is uniformly dispersed into a synthetic resin matrix, to manufacture the resin complex into the form of a panel, an embossing process of forming a wood pattern corresponding to the cut-open surface of a natural lumber on the surface of the panel to a predetermined depth, and a brushing process of removing some of a synthetic resin layer from the surface of the panel to form linear micro concavo-convex parts to a predetermined depth, and an apparatus for manufacturing a wood plastic composite panel that is capable of efficiently performing the same.

Abstract: Provided is a process for preparing a wood fiber-polymer composite containing a wood fiber component and a polymer resin, comprising inducing chemical bonding reaction between the wood fiber and polymer by application of an ultrasonic wave upon contact of the wood fiber component with the molten polymer resin. The process of the present invention enables production of a composite having superior mechanical, thermal and Theological processing properties, by induction of chemical bonding between the wood fiber and polymer resin even without use of additional additives. Consequently, the present invention provides advantages such as reduction of composite production costs, no need to select and change kinds of additives corresponding to components of the composite and thereby high flexibility of manufacturing process.

Abstract: Disclosed herein are a method of manufacturing a wood plastic composite panel, including a panel manufacturing process of extruding and cooling a resin complex, such that wood fiber is uniformly dispersed into a synthetic resin matrix, to manufacture the resin complex into the form of a panel, an embossing process of forming a wood pattern corresponding to the cut-open surface of a natural lumber on the surface of the panel to a predetermined depth, and a brushing process of removing some of a synthetic resin layer from the surface of the panel to form linear micro concavo-convex parts to a predetermined depth, and an apparatus for manufacturing a wood plastic composite panel that is capable of efficiently performing the same.

Abstract: A moisture impermeable edge reinforced wood composite structural system includes a wood composite panel having opposing faces, at least one moisture impermeable reinforcement edge, and at least one moisture impermeable reinforcement perimeter zone. The perimeter zone is a coating of a moisture impermeable reinforcement/resin matrix material which provides the structural system with improved fastener performance and reduced panel edge swell as a result of moisture exposure.

Abstract: Disclosed herein is a wood plastic composite panel made of a resin composite in which wood fiber having a size of 80 to 300 meshes is included in a synthetic resin matrix, the wood plastic composite panel being provided at the entire surface thereof with an embossed structure of a lumber cut-open pattern having an average depth of 200 to 900 ?m and a linear micro concavo-convex structure having an average depth of 10 to 500 ?m, the panel having a reflection rate of 10 to 50% when light is incident on the surface of the panel at an incidence angle of 60 degrees. The wood plastic composite panel according to the present invention has excellent strength and durability. Furthermore, the wood plastic composite panel according to the present invention exhibits excellent appearance and texture comparable with cut-open surfaces of natural lumbers although the panel has a surface structure different from the cut-open surfaces of the natural lumbers.

Abstract: Disclosed herein is a solid-state extrusion-orientation process. The process produces a polymer-oriented profile by compressing a billet through an extrusion die, in which the billet comprises crystalline or semi-crystalline polymers or a composite containing the polymers and an organic or inorganic filler. The process comprises the steps of preheating a pressure chamber to a temperature of a polymer's melting point or less, applying ultrasound to the extrusion die positioned next to the pressure chamber and having a smaller cross-sectional area that the pressure chamber, and extruding the billet through the pressure chamber and the extrusion die to produce the polymer-oriented profile. This process eliminates the step of heating the extrusion die, thereby ensuring convenient and rapid operation while providing a polymer profile having a smooth surface without any defects.

Abstract: A moisture impermeable edge reinforced wood composite structural system includes a wood composite panel having opposing faces, at least one moisture impermeable reinforcement edge, and at least one moisture impermeable reinforcement perimeter zone. The perimeter zone is a coating of a moisture impermeable reinforcement/resin matrix material which provides the structural system with improved fastener performance and reduced panel edge swell as a result of moisture exposure.