Abstract: A production method of an optical waveguide for a connector is provided, which reduces an optical coupling loss. Cores are formed in a crossing pattern, a branched pattern or a linear pattern, and then an over-cladding layer formation photosensitive resin layer is formed over the cores. In turn, a heat treatment is performed at a temperature of 70° C. to 130° C. to properly form mixed layers in interfaces between the cores and the photosensitive resin layer. By thus forming the mixed layers, the connector optical waveguide can be produced as having a reduced optical coupling loss.

Abstract: An optical connection structure which permits easy and automatic alignment between the optical axes of optical fibers and the optical axes of cores of an optical waveguide, and a production method which ensures that an optical waveguide for the optical connection structure can be efficiently produced with higher dimensional accuracy are provided. An over-cladding layer of the optical waveguide includes an extension portion provided in a longitudinal end portion thereof, and optical fiber fixing grooves are provided in the extension portion as extending along extension lines of cores coaxially with the cores and each having opposite ends, one of which is open in an end face of the extension portion and the other of which is closed. Optical fibers are fitted and fixed in the respective optical fiber fixing grooves. The over-cladding layer further includes a boundary portion (6) provided between the other closed ends of the optical fiber fixing grooves and the cores.

Abstract: Disclosed is inexpensive optical waveguide for an optical connector which is accurately positioned across the width of cores when inserted in and fixed in an optical waveguide fixing through hole of a ferrule to provide low optical coupling loss when connected, an optical connector using the same, and a method of manufacturing the same. An optical waveguide for an optical connector includes cores, an under cladding layer, and an over cladding layer. The strip-shaped optical waveguide has a longitudinal end portion configured to be fixed in a predetermined through hole provided in a ferrule of an optical connector. The cores are formed on the under cladding layer by a photolithographic method. The over cladding layer is formed with respect to the positions of the cores or positioning alignment marks by a photolithographic method. The over cladding layer covers the cores, and the under cladding layer including crosswise end surfaces thereof.

Abstract: An optical waveguide device is provided which is capable of reducing light propagation losses in the cores of an optical waveguide when the optical waveguide is formed on a surface of a substrate, regardless of the type of substrate. A photosensitive resin layer (4A) for over cladding layer formation is made of a photosensitive resin composition of a non-solvent type, and is heated prior to the exposure thereof to light. This causes interface portions between the cores (3) and the photosensitive resin layer (4A) to be formed into mixed layers (5). This reduces light propagation losses.

Abstract: A novel polyimide compound which has a low linear expansion coefficient and permits film formation by a spin coating method or the like, a preparation method for the polyimide compound, and an optical film and an optical waveguide produced by employing the compound. The polyimide compound has a structural unit represented by the following general formula (1): wherein X is a covalent single bond, —CH2—, —C(CF3)2— or —CR(R?)— (wherein R and R?, which may be the same or different, are each a C1 to C6 alkyl group or an aryl group); A and B, which may be the same or different, are substituents each selected from a hydroxyl group, a halogen group and a C1 to C4 alkyl group; a and b, which are the numbers of the substituents A and B, respectively, are each an integer of 0 to 2; and o, p and q are each an integer of 1 to 5.

Abstract: A method of manufacturing an optical waveguide device capable of suppressing the surface roughening of core side surfaces of an optical waveguide. Forming an under cladding layer on the front surface of a substrate; forming a photosensitive resin layer for core formation on a surface of the under cladding layer; wherein, in forming the cores, (A) irradiation light transmitted through the photosensitive resin layer, reaching the front surface of the substrate having an arithmetic mean roughness (Ra) in the range of 1 to 2 nm, or (B) irradiation light transmitted through the photosensitive resin layer and reflected from the bottom surface, where the front surface and back surface both have an arithmetic mean roughness (Ra) in the range of 1 to 2 nm.

Abstract: A manufacturing method of an optical waveguide device and an optical waveguide device obtained thereby. An under cladding layer is formed on the front surface of a colored-layer-coated PET substrate including a PET substrate portion and a colored layer of a color that absorbs irradiation light and formed on the back surface of the PET substrate portion, and then a photosensitive resin layer for the formation of cores is formed thereon. In forming the cores, when the irradiation light reaches the bottom surface of the PET substrate portion, most of the irradiation light is absorbed by the colored layer, so that there is little irradiation light reflected from the bottom surface of the PET substrate portion. This significantly reduces the irradiation light reflected diffusely from the PET substrate portion and reaching the photosensitive resin layer to thereby effectively suppress the surface roughening of the side surfaces of the cores.

Abstract: A manufacturing method of an optical waveguide device which is capable of suppressing the surface roughening of core side surfaces of an optical waveguide when the optical waveguide is formed on a roughened surface of a substrate. An under cladding layer is formed on a roughened surface of a substrate made of a material that absorbs irradiation light, and then a photosensitive resin layer for the formation of cores is formed thereon. Irradiation light is directed toward this photosensitive resin layer to expose the photosensitive resin layer in a predetermined pattern to the irradiation light. When the irradiation light transmitted through the photosensitive resin layer for the formation of the cores and the under cladding layer reaches the surface of the substrate, the irradiation light is absorbed by the substrate, so that there is little irradiation light reflected from the surface of the substrate.

Abstract: To provide a manufacturing method of an optical waveguide device which is capable of suppressing the surface roughening of core side surfaces of an optical waveguide when the optical waveguide is formed on a surface of a metal substrate. An under cladding layer 2 containing an irradiation light absorbing agent is formed on a surface of a metal substrate 1 which is a roughened surface. Alternatively, an irradiation light absorbing layer is formed prior to the formation of the under cladding layer free from the irradiation light absorbing agent. In a subsequent step of forming cores 3, irradiation light directed onto a photosensitive resin layer for the formation of the cores 3 and transmitted through the photosensitive resin layer is absorbed or attenuated in the under cladding layer 2 containing the above-mentioned irradiation light absorbing agent or in the irradiation light absorbing layer.

Abstract: A mounting structure of a semiconductor device includes an electroconductive film provided on a substrate. An insulating film is formed on the electroconductive film, and provided with an opening portion to expose a part of the electroconductive film, and its internal stress is set to serve as a compression stress. An anisotropic electroconductive binding material is disposed across the part of the electroconductive film exposed by the opening portion and the insulating film. A semiconductor device has a plurality of electrodes, and is disposed on the anisotropic electroconductive binding material. The electrodes are electrically connected with the electroconductive film through the anisotropic electroconductive binding material.

Abstract: Polyclonal antibody specific for a phosphorylated linker region in Smad2 and/or Smad3.

Abstract: An adhesive of the invention is used for polarizing plate to provide a transparent protective film on at least one side of a polarizer and comprises a resin solution comprising a polyvinyl alcohol-based resin, a crosslinking agent and a colloidal metal compound with an average particle size of 1 nm to 100 nm, wherein 200 parts by weight or less of the colloidal metal compound is added to 100 parts by weight of the polyvinyl alcohol-based resin. The adhesive for polarizing plate can reduce the occurrence of knicks.

Abstract: A mounting structure of a semiconductor device includes an electroconductive film provided on a substrate. An insulating film is formed on the electroconductive film, and provided with an opening portion to expose a part of the electroconductive film, and its internal stress is set to serve as a compression stress. An anisotropic electroconductive binding material is disposed across the part of the electroconductive film exposed by the opening portion and the insulating film. A semiconductor device has a plurality of electrodes, and is disposed on the anisotropic electroconductive binding material. The electrodes are electrically connected with the electroconductive film through the anisotropic electroconductive binding material.

Abstract: Polyclonal antibody specific for a phosphorylated linker region in Smad2 and/or Smad3.

Abstract: An ink jet print head comprises a substrate formed with a heating resistor, an ink path defining member for defining an ink supply path, and a orifice plate, and in the orifice plate, there is formed an ink outlet at the position opposing the heating resistor. Further, a heating zone surrounding the heating resistor is formed at the position corresponding to the heating resistor of the ink supply path. The channel resistance of the ink supply path is set so that a relationship is established between a quantity q of the discharged ink drop, a sectional area A of the ink outlet, and a maximal projection h that a meniscus of the ink has when it projects from the ink outlet after it has restored the exit level from a retreat position it had after the drop of the ink had been discharged, such that 0<h<0.3 q/A. Consequently, there is obtained a high-speed printing of high quality without dispersion.

Abstract: An ink jet print head comprises a substrate formed with a heating resistor, an ink path defining member for defining an ink supply path, and a orifice plate, and in the orifice plate, there is formed an ink outlet at the position opposing the heating resistor. Further, a heating zone surrounding the heating resistor is formed at the position corresponding to the heating resistor of the ink supply path. The channel resistance of the ink supply path is set so that a relationship is established between a quantity q of the discharged ink drop, a sectional area A of the ink outlet, and a maximal projection h that a meniscus of the ink has when it projects from the ink outlet after it has restored the exit level from a retreat position it had after the drop of the ink had been discharged, such that 0<h<0.3 q/A. Consequently, there is obtained a high-speed printing of high quality without dispersion.

Abstract: An ink jet print head comprises a substrate formed with a heating resistor, an ink path defining member for defining an ink supply path, and a orifice plate, and in the orifice plate, there is formed an ink outlet at the position opposing the heating resistor. Further, a heating zone surrounding the heating resistor is formed at the position corresponding to the heating resistor of the ink supply path. The channel resistance of the ink supply path is set so that a relationship is established between a quantity q of the discharged ink drop, a sectional area A of the ink outlet, and a maximal projection h that a meniscus of the ink has when it projects from the ink outlet after it has restored the exit level from a retreat position it had after the drop of the ink had been discharged, such that 0<h<0.3 q/A. Consequently, there is obtained a high-speed printing of high quality without dispersion.

Abstract: An ink jet head having a plurality of drive columns includes a plate having a plurality of diaphragm portions which are bonded to end surfaces of the drive columns with an adhesive, respectively. Each of the diaphragm portions is driven by a drive column corresponding to the diaphragm portion thereby to eject ink droplets. One of the diaphragm portion and the corresponding drive column includes an accommodating groove for accommodating an excess adhesive produced when bonding the diaphragm portion to the end surface of the drive column.

Abstract: An ink jet print head comprises a substrate formed with a heating resistor, an ink path defining member for defining an ink supply path, and an orifice plate, and in the orifice plate, there is formed an ink outlet at the position opposing the heating resistor. Further, a heating zone surrounding the heating resistor is formed at the position corresponding to the heating resistor of the ink supply path. The channel resistance of the ink supply path is set so that a relationship is established between a quantity q of the discharged ink drop, a sectional area A of the ink outlet, and a maximal projection h that a meniscus of the ink has when it projects from the ink outlet after it has restored the exit level from a retreat position it had after the drop of the ink had been discharged such that 0<h<0.3q/A 0<h<0.25q/A. Consequently, there is obtained a high-speed printing of high quality without dispersion.

Abstract: A mounting structure of a semiconductor device includes an electroconductive film provided on a substrate. An insulating film is formed on the electroconductive film, and provided with an opening portion to expose a part of the electroconductive film, and its internal stress is set to serve as a compression stress. An anisotropic electroconductive binding material is disposed across the part of the electroconductive film exposed by the opening portion and the insulating film. A semiconductor device has a plurality of electrodes, and is disposed on the anisotropic electroconductive binding material. The electrodes are electrically connected with the electroconductive film through the anisotropic electroconductive binding material.