Patents by Inventor Junichiro Oishi

Junichiro Oishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7654207
    Abstract: An XY stage comprises a base, a movable table which is disposed on the base so as to be movable in an X direction and a Y direction in an X-Y plane, and a work member which is provided on the movable table. The XY stage further comprises: a first linear motor for giving a driving force in the X direction to the movable table at the same height as the center of gravity of a movable section composed of the movable table and the work member; and a second linear motor for giving a driving force in the Y direction to the movable table at the same height as the center of gravity of the movable section.
    Type: Grant
    Filed: September 5, 2000
    Date of Patent: February 2, 2010
    Assignee: NEC Corporation
    Inventors: Maho Shoji, Noriyuki Kubota, Junichiro Oishi
  • Patent number: 6533158
    Abstract: Disclosed is a wire bonding apparatus which has a structure as simple and as light as possible, which substantially reduces the inertia in a Z-direction rotating portion swinging at a high speed in the Z-direction, and which can realize a stable high-speed swinging of the Z-direction rotating portion while restraining vibration. A wire bonding apparatus (21) is arranged on a base capable of moving in X- and Y-directions by an XY stage, and is equipped with a wire clamp (22) rotatable in the Z-direction perpendicular to the X- and Y-directions. A driving portion (15) imparts a wire gripping force to the wire clamp. An elastic sack-like member (14) is arranged on the wire clamp and adapted to change its shape by a fluid introduced by the driving portion (15) through a tube (23), to thereby generate a wire gripping force.
    Type: Grant
    Filed: October 29, 2001
    Date of Patent: March 18, 2003
    Assignee: NEC Corporation
    Inventors: Junichiro Oishi, Noriyuki Kubota
  • Publication number: 20020040920
    Abstract: Disclosed is a wire bonding apparatus which has a structure as simple and as light as possible, which substantially reduces the inertia in a Z-direction rotating portion swinging at a high speed in the Z-direction, and which can realize a stable high-speed swinging of the Z-direction rotating portion while restraining vibration. A wire bonding apparatus (21) is arranged on a base capable of moving in X- and Y-directions by an XY stage, and is equipped with a wire clamp (22) rotatable in the Z-direction perpendicular to the X- and Y-directions. A driving portion (15) imparts a wire gripping force to the wire clamp. An elastic sack-like member (14) is arranged on the wire clamp and adapted to change its shape by a fluid introduced by the driving portion (15) through a tube (23), to thereby generate a wire gripping force.
    Type: Application
    Filed: October 29, 2001
    Publication date: April 11, 2002
    Applicant: NEC CORPORATION
    Inventors: Junichiro Oishi, Noriyuki Kubota