Abstract: A layout structure of a standard cell using vertical nanowire (VNW) FETs is provided. A p-type transistor region in which VNW FETs are formed and an n-type transistor region in which VNW FETs are formed are provided between a power supply interconnect VDD and a power supply interconnect VSS. A local interconnect is placed across the p-type transistor region and the n-type transistor region. The top electrode of a transistor that is a dummy VNW FET is connected with the local interconnect.

Abstract: A semiconductor integrated circuit device provided with vertical nanowire (VNW) FETs includes a tap cell. The tap cell includes a power supply interconnect extending in a first direction and a bottom region of a first conductivity type formed in a top portion of a well or substrate of the first conductivity type. The bottom region overlaps the power supply interconnect as viewed from top and is connected with the power supply interconnect.

Abstract: A layout structure of a capacitance cell using a complementary FET (CFET) is provided. A capacitance part includes a first three-dimensional transistor of a first conductivity type and a second three-dimensional transistor of a second conductivity type formed above the first transistor in the depth direction. The source and drain of the first transistor are both connected to VDD or VSS, and the source and drain of the second transistor are both connected to VDD or VSS. The gates of the first and second transistors are both connected to the gate of a transistor included in a fixed-value output part, and are supplied with VDD or VSS.

Abstract: A semiconductor integrated circuit device including standard cells including fin transistors includes, at a cell row end, a cell-row-terminating cell that does not contribute to a logical function of a circuit block. The cell-row-terminating cell includes a plurality of fins extending in an X direction. Ends of the plurality of fins on the inner side of the circuit block are near a gate structure placed at a cell end and do not overlap with the gate structure in a plan view, and ends of the plurality of fins on an outer side of the circuit block overlap with any one of a gate structure in a plan view.

Abstract: A semiconductor integrated circuit device including standard cells including fin transistors includes, at a cell row end, a cell-row-terminating cell that does not contribute to a logical function of a circuit block. The cell-row-terminating cell includes a plurality of fins extending in an X direction. Ends of the plurality of fins on the inner side of the circuit block are near a gate structure placed at a cell end and do not overlap with the gate structure in a plan view, and ends of the plurality of fins on an outer side of the circuit block overlap with any one of a gate structure in a plan view.

Abstract: A semiconductor integrated circuit device includes a standard cell having a plurality of height regions. A plurality of partial circuits having an identical function and each operating in response to common signals S and NS are arranged in any one of the height regions. A metal interconnect forming part of a supply path for the common signal S is arranged in the height region so as to be connected to the partial circuits, and a metal interconnect forming part of a supply path for the common signal S is arranged in the height region so as to be connected to the partial circuits.

Abstract: The present disclosure attempts to provide a capacitor cell having a large capacitance value per unit area in a semiconductor integrated circuit device using a three-dimensional transistor device. A logic cell includes a three-dimensional transistor device. A capacitor cell includes a three-dimensional transistor device. A length of a portion, of a local interconnect, which protrudes from a three-dimensional diffusion layer in a direction away from a power supply interconnect in the capacitor cell is greater than a length of a portion, of a local interconnect, which protrudes from a three-dimensional diffusion layer in a direction away from a power supply interconnect in the logic cell.

Abstract: The present disclosure attempts to provide a capacitor cell having a large capacitance value per unit area in a semiconductor integrated circuit device using a three-dimensional transistor device. A logic cell includes a three-dimensional transistor device. A capacitor cell includes a three-dimensional transistor device. A length of a portion, of a local interconnect, which protrudes from a three-dimensional diffusion layer in a direction away from a power supply interconnect in the capacitor cell is greater than a length of a portion, of a local interconnect, which protrudes from a three-dimensional diffusion layer in a direction away from a power supply interconnect in the logic cell.

Abstract: A semiconductor integrated circuit device includes a standard cell having a plurality of height regions. A plurality of partial circuits having an identical function and each operating in response to common signals S and NS are arranged in any one of the height regions. A metal interconnect forming part of a supply path for the common signal S is arranged in the height region so as to be connected to the partial circuits, and a metal interconnect forming part of a supply path for the common signal S is arranged in the height region so as to be connected to the partial circuits.

Abstract: A semiconductor integrated circuit device provided with vertical nanowire (VNW) FETs includes a tap cell. The tap cell includes a power supply interconnect extending in a first direction and a bottom region of a first conductivity type formed in a top portion of a well or substrate of the first conductivity type. The bottom region overlaps the power supply interconnect as viewed from top and is connected with the power supply interconnect.

Abstract: A layout structure of a capacitance cell using vertical nanowire (VNW) FETs is provided. The capacitance cell includes a plurality of first-conductivity type VNW FETs lining up in the X direction, provided between a first power supply interconnect and a second power supply interconnect. The plurality of first-conductivity type VNW FETs include at least one first VNW FET having a top and a bottom connected with the first power supply interconnect and a gate connected with the second power supply interconnect.

Abstract: A layout structure of a standard cell using vertical nanowire (VNW) FETs is provided. A p-type transistor region in which VNW FETs are formed and an n-type transistor region in which VNW FETs are formed are provided between a power supply interconnect VDD and a power supply interconnect VSS. A local interconnect is placed across the p-type transistor region and the n-type transistor region. The top electrode of a transistor that is a dummy VNW FET is connected with the local interconnect.

Abstract: In a semiconductor integrated circuit device using three-dimensional transistor devices, a delay cell having a large delay value per unit area is implemented. A first cell, which is a logic cell, includes three-dimensional transistor devices. A second cell, which is a delay cell, includes three-dimensional transistor devices. The length by which a second local interconnect protrudes from a second solid diffusion layer portion in a direction away from a power supply interconnect in the second cell is greater than the length by which a first local interconnect protrudes from a first solid diffusion layer portion in a direction away from the power supply interconnect in the first cell.

Abstract: A semiconductor integrated circuit device including standard cells including fin transistors includes, at a cell row end, a cell-row-terminating cell that does not contribute to a logical function of a circuit block. The cell-row-terminating cell includes a plurality of fins extending in an X direction. Ends of the plurality of fins on the inner side of the circuit block are near a gate structure placed at a cell end and do not overlap with the gate structure in a plan view, and ends of the plurality of fins on an outer side of the circuit block overlap with any one of a gate structure in a plan view.

Abstract: A semiconductor integrated circuit device including standard cells including fin transistors includes, at a cell row end, a cell-row-terminating cell that does not contribute to a logical function of a circuit block. The cell-row-terminating cell includes a plurality of fins extending in an X direction. Ends of the plurality of fins on the inner side of the circuit block are near a gate structure placed at a cell end and do not overlap with the gate structure in a plan view, and ends of the plurality of fins on an outer side of the circuit block overlap with any one of a gate structure in a plan view.

Abstract: A semiconductor integrated circuit device using nanowire FETs has a circuit block in which a plurality of cell rows each including a plurality of standard cells lined up in the X direction are placed side by side in the Y direction. The plurality of standard cells each include a plurality of nanowires that extend in the X direction and are placed at a predetermined pitch in the Y direction. The plurality of standard cells have a cell height, that is a size in the Y direction, M times (M is an odd number) as large as half the pitch of the nanowires.

Abstract: In a semiconductor integrated circuit device using three-dimensional transistor devices, a delay cell having a large delay value per unit area is implemented. A first cell, which is a logic cell, includes three-dimensional transistor devices. A second cell, which is a delay cell, includes three-dimensional transistor devices. The length by which a second local interconnect protrudes from a second solid diffusion layer portion in a direction away from a power supply interconnect in the second cell is greater than the length by which a first local interconnect protrudes from a first solid diffusion layer portion in a direction away from the power supply interconnect in the first cell.

Abstract: A semiconductor integrated circuit device includes a standard cell having a plurality of height regions. A plurality of partial circuits having an identical function and each operating in response to common signals S and NS are arranged in any one of the height regions. A metal interconnect forming part of a supply path for the common signal S is arranged in the height region so as to be connected to the partial circuits, and a metal interconnect forming part of a supply path for the common signal S is arranged in the height region so as to be connected to the partial circuits.

Abstract: The present disclosure attempts to provide a capacitor cell having a large capacitance value per unit area in a semiconductor integrated circuit device using a three-dimensional transistor device. A logic cell includes a three-dimensional transistor device. A capacitor cell includes a three-dimensional transistor device. A length of a portion, of a local interconnect, which protrudes from a three-dimensional diffusion layer in a direction away from a power supply interconnect in the capacitor cell is greater than a length of a portion, of a local interconnect, which protrudes from a three-dimensional diffusion layer in a direction away from a power supply interconnect in the logic cell.

Abstract: A semiconductor integrated circuit device including standard cells including fin transistors includes, at a cell row end, a cell-row-terminating cell that does not contribute to a logical function of a circuit block. The cell-row-terminating cell includes a plurality of fins extending in an X direction. Ends of the plurality of fins on the inner side of the circuit block are near a gate structure placed at a cell end and do not overlap with the gate structure in a plan view, and ends of the plurality of fins on an outer side of the circuit block overlap with any one of a gate structure in a plan view.