Patents by Inventor Junji Kunisawa
Junji Kunisawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20120308356Abstract: A substrate processing apparatus can prevent photo-corrosion of, e.g., copper interconnects due to exposure of a surface to be processed of a substrate to light, and can perform processing, such as cleaning, of a substrate surface while preventing photo-corrosion of, e.g., copper interconnects due to exposure to light. The substrate processing apparatus includes a plurality of processing areas housing therein processing units which have been subjected to light shielding processing; and at least one transfer area housing therein a transfer robot and disposed between two adjacent ones of the plurality of processing areas. A light shielding wall is provided between the transfer area and each of the two adjacent processing areas, and a light-shielding maintenance door is provided for the front opening of the transfer area. The processing units are coupled to the light shielding walls in a light-shielding manner.Type: ApplicationFiled: May 30, 2012Publication date: December 6, 2012Inventors: Toshio YOKOYAMA, Junji KUNISAWA, Mitsuru MIYAZAKI, Kenichi SUZUKI, Hiroshi SOTOZAKI
-
Patent number: 8029653Abstract: An electroplating apparatus can form a plated film having a more uniform thickness and good film quality over an entire surface of a substrate having a conductive layer (seed layer) whose resistivity is equal to or higher than that of copper.Type: GrantFiled: February 21, 2007Date of Patent: October 4, 2011Assignee: Ebara CorporationInventors: Satoru Yamamoto, Keiichi Kurashina, Takashi Kawakami, Tsutomu Nakada, Hiroyuki Kanda, Junji Kunisawa, Kunihito Ide
-
Publication number: 20110237163Abstract: A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.Type: ApplicationFiled: June 3, 2011Publication date: September 29, 2011Inventors: Seiji Katsuoka, Masahiko Sekimoto, Junji Kunisawa, Mitsuru Miyazaki, Teruyuki Watanabe, Kenichi Kobayashi, Masayuki Kumekawa, Toshio Yokoyama
-
Patent number: 7976362Abstract: A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.Type: GrantFiled: August 3, 2009Date of Patent: July 12, 2011Assignee: Ebara CorporationInventors: Seiji Katsuoka, Masahiko Sekimoto, Junji Kunisawa, Mitsuru Miyazaki, Teruyuki Watanabe, Kenichi Kobayashi, Masayuki Kumekawa, Toshio Yokoyama
-
Patent number: 7901550Abstract: A plating apparatus can form a plated film having a uniform thickness over the entire surface of a substrate without a change of members. The plating apparatus includes a substrate holder, a cathode contact for contacting a conductive film formed on the substrate so that the conductive film serves as a cathode, a ring-shaped seal member for covering the cathode contact and bringing its inner circumferential portion into contact with the peripheral portion of the substrate to seal the peripheral portion of the substrate, an anode disposed so as to face the conductive film formed on the substrate, and an auxiliary cathode disposed with respect to the seal member such that at least part of the auxiliary cathode is exposed on a surface of the seal member. Plating is carried out by bringing the conductive film, the anode and the auxiliary cathode into contact with a plating solution.Type: GrantFiled: October 15, 2007Date of Patent: March 8, 2011Assignee: Ebara CorporationInventors: Natsuki Makino, Keisuke Namiki, Kunihito Ide, Junji Kunisawa, Katsuyuki Musaka
-
Publication number: 20100219078Abstract: A plating apparatus securely carries out a flattening plating of a substrate to form a plated film having a flat surface without using a costly mechanism, and without applying an extra plating to the substrate. The plating apparatus includes a substrate holder; a cathode section having a seal member for watertightly sealing a peripheral portion of the substrate, and a cathode electrode for supplying an electric current to the substrate; an anode disposed in a position facing the surface of the substrate; a porous member disposed between the anode and the surface of the substrate; a constant-voltage control section for controlling a voltage applied between the cathode electrode and the anode at a constant value; and a current monitor section for monitoring an electric current flowing between the cathode electrode and the anode, and feeding back a detection signal to the constant-voltage control section.Type: ApplicationFiled: April 30, 2010Publication date: September 2, 2010Inventors: Keiichi KURASHINA, Mizuki Nagai, Satoru Yamamoto, Hiroyuki Kanda, Koji Mishima, Shinya Morisawa, Junji Kunisawa, Kunihito Ide, Hidenao Suzuki, Emanuel Cooper, Philippe Vereecken, Brett Baker-O'Neal, Hariklia Deligianni
-
Patent number: 7736474Abstract: A plating apparatus securely carries out a flattening plating of a substrate to form a plated film having a flat surface without using a costly mechanism, and without applying an extra plating to the substrate. The plating apparatus includes a substrate holder; a cathode section having a seal member for watertightly sealing a peripheral portion of the substrate, and a cathode electrode for supplying an electric current to the substrate; an anode disposed in a position facing the surface of the substrate; a porous member disposed between the anode and the surface of the substrate; a constant-voltage control section for controlling a voltage applied between the cathode electrode and the anode at a constant value; and a current monitor section for monitoring an electric current flowing between the cathode electrode and the anode, and feeding back a detection signal to the constant-voltage control section.Type: GrantFiled: October 7, 2005Date of Patent: June 15, 2010Assignees: Ebara Corporation, International Business Machines CorporationInventors: Keiichi Kurashina, Mizuki Nagai, Satoru Yamamoto, Hiroyuki Kanda, Koji Mishima, Shinya Morisawa, Junji Kunisawa, Kunihito Ide, Hidenao Suzuki, Emanuel Cooper, Philippe Vereecken, Brett Baker-O'Neal, Hariklia Deligianni
-
Publication number: 20090305612Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.Type: ApplicationFiled: June 3, 2009Publication date: December 10, 2009Inventors: Mitsuru Miyazaki, Seiji Katsuoka, Naoki Matsuda, Junji Kunisawa, Kenichi Kobayashi, Hiroshi Sotozaki, Hiroyuki Shinozaki, Osamu Nabeya, Shinya Morisawa, Takahiro Ogawa, Natsuki Makino
-
Publication number: 20090291624Abstract: A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.Type: ApplicationFiled: August 3, 2009Publication date: November 26, 2009Inventors: Seiji KATSUOKA, Masahiko Sekimoto, Junji Kunisawa, Mitsuru Miyazaki, Teruyuki Watanabe, Kenichi Kobayashi, Masayuki Kumekawa, Toshio Yokoyama
-
Patent number: 7585205Abstract: A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.Type: GrantFiled: October 3, 2007Date of Patent: September 8, 2009Assignee: Ebara CorporationInventors: Seiji Katsuoka, Masahiko Sekimoto, Junji Kunisawa, Mitsuru Miyazaki, Teruyuki Watanabe, Kenichi Kobayashi, Masayuki Kumekawa, Toshio Yokoyama
-
Publication number: 20090095634Abstract: A plating method can form a plated film having a uniform thickness over the entire surface, including the peripheral surface, of a substrate. The plating method includes: disposing an anode so as to face a conductive film, formed on a substrate, which serves as a cathode, and disposing an auxiliary cathode on an ring-shaped seal member for sealing a peripheral portion of the substrate; bringing the conductive film, the anode and the auxiliary cathode into contact with a plating solution; and supplying electric currents between the anode and the conductive film, and between the anode and the auxiliary cathode to carry out plating.Type: ApplicationFiled: October 15, 2007Publication date: April 16, 2009Inventors: Natsuki Makino, Keisuke Namiki, Kunihito Ide, Junji Kunisawa, Katsuyuki Musaka, Philippe Vereecken, Brett C. Baker-O'Neal, Hariklia Deligianni, Keith Kwietniak
-
Publication number: 20090095618Abstract: A plating apparatus can form a plated film having a uniform thickness over the entire surface of a substrate without a change of members. The plating apparatus included a substrate holder, a cathode contact for contacting a conductive film formed on the substrate so that the conductive film serves as a cathode, a ring-shaped seal member for covering the cathode contact and bringing its inner circumferential portion into contact with the peripheral portion of the substrate to seal the peripheral portion of the substrate, an anode disposed so as to face the conductive film formed on the substrate, and an auxiliary cathode disposed to the seal member such that at least part of the auxiliary cathode expose on a surface of the seal member. Plating is carried out by bringing the conductive film, the anode and the auxiliary cathode into contact with a plating solution.Type: ApplicationFiled: October 15, 2007Publication date: April 16, 2009Inventors: Natsuki Makino, Keisuke Namiki, Kunihito Ide, Junji Kunisawa, Katsuyuki Musaka
-
Publication number: 20080296165Abstract: A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion 36 horizontally holding and rotating a substrate with its surface to be plated facing upward. A seal material 90 contacts a peripheral edge portion of the surface, sealing the portion in a watertight manner. A cathode electrode 88 passes an electric current upon contact with the substrate. A cathode portion 38 rotates integrally with the substrate holding portion 36. An electrode arm portion 30 is above the cathode portion 38 and movable horizontally and vertically and has an anode 98 face-down. Plating liquid is poured into a space between the surface to be plated and the anode 98 brought close to the surface to be plated. Thus, plating treatment and treatments incidental thereto can be performed by a single unit.Type: ApplicationFiled: May 27, 2008Publication date: December 4, 2008Inventors: Junji KUNISAWA, Mitsuko ODAGAKI, Natsuki MAKINO, Koji MISHIMA, Kenji NAKAMURA, Hiroaki INOUE, Norio KIMURA, Tetsuo MATSUDA, Hisashi KANEKO, Nobuo HAYASAKA, Katsuya OKUMURA, Manabu TSUJIMURA, Toshiyuki MORITA
-
Patent number: 7442282Abstract: An electrolytic processing apparatus according to an embodiment of the present invention includes: a substrate holder for holding a substrate; a first electrode to make contact with the substrate for passing electricity to a processing surface of the substrate; an electrode head including a high resistance structure and a second electrode, disposed opposite to and in this order from the substrate holder, and a polishing surface facing the processing surface of the substrate held by the substrate holder; an electrolytic solution injection portion for injecting an electrolytic solution between the processing surface of the substrate held by the substrate holder and the second electrode; a relative movement mechanism for moving the substrate holder and the electrode head relative to each other; a press mechanism for pressing the polishing surface of the electrode head against the substrate held by the substrate holder; and a power source for applying a voltage between the first electrode and the second electrodeType: GrantFiled: December 1, 2003Date of Patent: October 28, 2008Assignee: Ebara CorporationInventors: Natsuki Makino, Junji Kunisawa
-
Publication number: 20080251385Abstract: A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion 36 horizontally holding and rotating a substrate with its surface to be plated facing upward. A seal material 90 contacts a peripheral edge portion of the surface, sealing the portion in a watertight manner. A cathode electrode 88 passes an electric current upon contact with the substrate. A cathode portion 38 rotates integrally with the substrate holding portion 36. An electrode arm portion 30 is above the cathode portion 38 and movable horizontally and vertically and has an anode 98 face-down. Plating liquid is poured into a space between the surface to be plated and the anode 98 brought close to the surface to be plated. Thus, plating treatment and treatments incidental thereto can be performed by a single unit.Type: ApplicationFiled: May 7, 2008Publication date: October 16, 2008Inventors: Junji Kunisawa, Mitsuko Odagaki, Natsuki Makino, Koji Mishima, Kenji Nakamura, Hiroaki Inoue, Norio Kimura, Tetsuo Matsuda, Hisashi Kaneko, Nobuo Hayasaka, Katsuya Okumura, Manabu Tsujimura, Toshiyuki Morita
-
Patent number: 7387717Abstract: A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion 36 horizontally holding and rotating a substrate with its surface to be plated facing upward. A seal material 90 contacts a peripheral edge portion of the surface, sealing the portion in a watertight manner. A cathode electrode 88 passes an electric current upon contact with the substrate. A cathode portion 38 rotates integrally with the substrate holding portion 36. An electrode arm portion 30 is above the cathode portion 38 and movable horizontally and vertically and has an anode 98 face-down. Plating liquid is poured into a space between the surface to be plated and the anode 98 brought close to the surface to be plated. Thus, plating treatment and treatments incidental thereto can be performed by a single unit.Type: GrantFiled: August 1, 2003Date of Patent: June 17, 2008Assignees: Ebara Corporation, Kabushiki Kaisha ToshibaInventors: Junji Kunisawa, Mitsuko Odagaki, Natsuki Makino, Koji Mishima, Kenji Nakamura, Hiroaki Inoue, Norio Kimura, Tetsuo Matsuda, Hisashi Kaneko, Nobuo Hayasaka, Katsuya Okumura, Manabu Tsujimura, Toshiyuki Morita
-
Publication number: 20080085658Abstract: A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.Type: ApplicationFiled: October 3, 2007Publication date: April 10, 2008Inventors: Seiji Katsuoka, Masahiko Sekimoto, Junji Kunisawa, Mitsuru Miyazaki, Teruyuki Watanabe, Kenichi Kobayashi, Masayuki Kumekawa, Toshio Yokoyama
-
Publication number: 20080029398Abstract: An electroplating apparatus can form a plated film having a more uniform thickness and good film quality over an entire surface of a substrate having a conductive layer (seed layer) whose resistivity is equal to or higher than that of copper.Type: ApplicationFiled: February 21, 2007Publication date: February 7, 2008Inventors: Satoru Yamamoto, Keiichi Kurashina, Takashi Kawakami, Tsutomu Nakada, Hiroyuki Kanda, Junji Kunisawa, Kunihito Ide
-
Publication number: 20070289604Abstract: To provide an apparatus and a method capable of supplying a gas containing an evaporated reducing organic compound while strictly controlling the flow rate thereof to process a surface of a metal on a substrate without causing any deterioration of various types of films forming a semiconductor element with a simple apparatus configuration. The apparatus includes a process chamber 10 for keeping a substrate W therein, the process chamber 10 being gastight, an evacuation control system 20 for controlling the pressure in the process chamber 10, and a process gas supply system 30 for supplying a process gas containing a reducing organic compound to the process chamber 10.Type: ApplicationFiled: April 27, 2005Publication date: December 20, 2007Inventors: Yukio Fukunaga, Akira Susaki, Junji Kunisawa, Hiroyuki Ueyama, Shohei Shima, Akira Fukunaga, Hideki Tateishi, Junko Mine
-
Patent number: 7208074Abstract: A substrate processing apparatus fills a metal such as copper or the like in fine interconnection patterns or trenches defined in a semiconductor substrate. The substrate processing apparatus has a loading/unloading unit for placing a substrate cassette to allow a substrate to be loaded and unloaded, a substrate treating unit for treating a substrate, and a transfer robot for transferring a substrate between the loading/unloading unit and the substrate treating unit. The loading/unloading unit, the substrate treating unit, and the transfer robot are installed in a single facility. The loading/unloading unit has a rotary table which is horizontally rotatable for positioning the substrate cassette in a position to detect the substrate cassette placed in the loading/unloading unit and to remove the substrate from the substrate cassette with the transfer robot.Type: GrantFiled: December 22, 2003Date of Patent: April 24, 2007Assignee: Ebara CorporationInventors: Koji Mishima, Junji Kunisawa, Natsuki Makino, Norio Kimura, Hiroaki Inoue, Kenji Nakamura, Moriji Matsumoto, Takahiro Nanjo, Mitsuko Odagaki