Patents by Inventor Junji Shinozaki
Junji Shinozaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20040029992Abstract: An adhesive material is used for connecting a protuberant electrode of an electronic component to a terminal electrode of a circuit board for carrying said electronic component through the adhesive material containing at least one curable resin and inorganic particles.Type: ApplicationFiled: August 5, 2003Publication date: February 12, 2004Applicant: SONY CHEMICALS CORP.Inventors: Motohide Takeichi, Junji Shinozaki
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Patent number: 6641928Abstract: An adhesive for semiconductor chips contains a first resin component which is polymerizable, a first hardener for inducing a self-polymerization reaction of the first resin component and a second hardener which is addition-polymerized with the first resin component. When the adhesive is applied on a wiring board and a semiconductor chip is applied thereon and heat is applied, the second hardener is addition-polymerized with the backbone of the three-dimensional network formed by the self-polymerization reaction of the first resin component. The first temperature at which the addition polymerization zone becomes a rubbery structure is lower than the second temperature at which the backbone becomes a rubbery structure, so that the elastic modulus loss sharply increases at the first temperature to reduce the stress between the semiconductor chip and the wiring board.Type: GrantFiled: October 5, 2001Date of Patent: November 4, 2003Assignee: Sony Chemicals Corp.Inventors: Motohide Takeichi, Misao Konishi, Junji Shinozaki, Yasushi Akutsu
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Patent number: 6632320Abstract: An adhesive material is used for connecting a protuberant electrode of an electronic component to a terminal electrode of a circuit board for carrying said electronic component through the adhesive material containing at least one curable resin and inorganic particles. The adhesive material is characterized in that as to the inorganic particles, their specific surface area S (m2/g) satisfies Equation (1) below, their mean particle size D1 (&mgr;m) and maximum particle size D2 (&mgr;m) respectively satisfy Equations (2) and (3) below, 3<S<17 (1) D1≦5 (2) D2≦0.5(h1+h2) (3) (wherein h1 represents the height of the protuberant electrode in the electronic component, and h2 represents the height of the terminal electrode in the circuit board), and the content of said inorganic particles is 10 to 60 vol %.Type: GrantFiled: August 3, 2000Date of Patent: October 14, 2003Assignee: Sony Chemicals Corp.Inventors: Motohide Takeichi, Junji Shinozaki
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Publication number: 20030178132Abstract: A connection structure manufacturing method for obtaining a connection structure in which first and second connection terminals are electrically connected, comprises disposing the second connection terminals (connection terminals of a semiconductor element) facing the first connection terminals (connection terminals of a circuit board) through the agency of a thermosetting anisotropic conductive adhesive (anisotropic conductive film), and pressing the second connection terminals while heating and curing the thermosetting anisotropic conductive adhesive. The pressing rate of the second connection terminals is kept at 50 mm/min or less, and the first and second connection terminals are brought into contact through the agency of the conductive particles in the thermosetting anisotropic conductive adhesive before the viscosity of the thermosetting anisotropic conductive adhesive reaches 107 Pa·s as a result of heating and curing.Type: ApplicationFiled: March 5, 2003Publication date: September 25, 2003Applicant: Sony Chemicals Corp.Inventor: Junji Shinozaki
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Patent number: 6611065Abstract: The present invention is a connection material which enables a flexible circuit board to be connected to a bare IC chip without causing a shoulder touch effect. The connection material contains an insulating adhesive and a flaky or fibrous insulating filler dispersed therein is used for connecting a film-like flexible circuit board and a bare IC chip. The aspect ratio of the flaky or fibrous insulating filler is no less than 20.Type: GrantFiled: November 14, 2001Date of Patent: August 26, 2003Assignee: Sony Chemicals CorporationInventors: Motohide Takeichi, Junji Shinozaki
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Patent number: 6566422Abstract: A connecting material for bonding and connecting elements each having electrodes thereon in a correspondingly confronting relation to each other, while attaining electroconductive connection between the corresponding electrodes, which material has a high heat resistance and can avoid occurrence of faulty electrical conductance even in the case of bonding elements having a large number of electrodes arranged, thus, at a considerably small interval under such a condition that the bonded assembly is exposed to a service environment of high temperature or of high temeperature and high humidity, wherein the connecting material contains a thermosetting resin and an inorganic filler and has, after having been cured, characteristic features of a modulus of elasticity of 1-12 GPa, a glass transition temperature Tg of 120-200° C., a coefficient of linear expansion (&agr;1) of 50 ppm/° C. or less at temperatures below the Tg and a coefficient of linear expansion (&agr;2) of 110 ppm/° C.Type: GrantFiled: September 15, 2000Date of Patent: May 20, 2003Assignee: Sony Chemicals CorporationInventors: Hidekazu Yagi, Motohide Takeichi, Junji Shinozaki
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Patent number: 6475641Abstract: A connecting material that can be used in the mounting of semiconductor devices on a circuit substrate for semiconductor devices, contains the following components A to C: (A) an epoxy resin; (B) a phenol compound having two or more phenolic hydroxyl groups; and (C) a latent curing agent, where it is preferred that if the ratio of the number of phenolic hydroxyl group equivalents of the phenol compound of component B to the number of epoxy equivalents of the epoxy resin in the connecting material is 0.2 to 1.0.Type: GrantFiled: May 24, 2001Date of Patent: November 5, 2002Assignee: Sony Chemicals Corp.Inventors: Junji Shinozaki, Motohide Takeichi
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Publication number: 20020098319Abstract: The present invention is a connection material which enables a flexible circuit board to be connected to a bare IC chip without causing a shoulder touch effect. The connection material contains an insulating adhesive and a flaky or fibrous insulating filler dispersed therein is used for connecting a film-like flexible circuit board and a bare IC chip. The aspect ratio of the flaky or fibrous insulating filler is no less than 20.Type: ApplicationFiled: November 14, 2001Publication date: July 25, 2002Applicant: SONY CHEMICALS CORP.Inventors: Motohide Takeichi, Junji Shinozaki
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Publication number: 20020062918Abstract: An adhesive for semiconductor chips contains a first resin component which is polymerizable, a first hardener for inducing a self-polymerization reaction of the first resin component and a second hardener which is addition-polymerized with the first resin component. When the adhesive is applied on a wiring board and a semiconductor chip is applied thereon and heat is applied, the second hardener is addition-polymerized with the backbone of the three-dimensional network formed by the self-polymerization reaction of the first resin component. The first temperature at which the addition polymerization zone becomes a rubbery structure is lower than the second temperature at which the backbone becomes a rubbery structure, so that the elastic modulus loss sharply increases at the first temperature to reduce the stress between the semiconductor chip and the wiring board.Type: ApplicationFiled: October 5, 2001Publication date: May 30, 2002Applicant: SONY CHEMICALS CORP.Inventors: Motohide Takeichi, Misao Konishi, Junji Shinozaki, Yasushi Akutsu
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Publication number: 20020009597Abstract: A connecting material that can be used in the mounting of semiconductor devices on a circuit substrate for semiconductor devices, contains the following components A to C:Type: ApplicationFiled: May 24, 2001Publication date: January 24, 2002Applicant: SONY CHEMICALS CORP.Inventors: Junji Shinozaki, Motohide Takeichi
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Patent number: 6020059Abstract: A multilayer anisotropic electroconductive adhesive, comprises an anisotropic electroconductive adhesive layer and laminated to at least one side thereof an insulating adhesive layer. The anisotropic electroconductive adhesive layer comprises a film-forming resin and electroconductive particles and has a melt viscosity at 150.degree. C. of 100 poise or higher, and the insulating adhesive layer comprises a latent curing agent and a resin having a functional group and has a melt viscosity at 150.degree. C. of less than 100 poise.Type: GrantFiled: July 23, 1998Date of Patent: February 1, 2000Assignee: Sony Chemicals CorporationInventors: Yukio Yamada, Masao Saito, Junji Shinozaki, Motohide Takeichi
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Patent number: 5965064Abstract: An anisotropically electroconductive adhesive to be used for establishing electric connection between terminals of, for example, an IC chip and of a circuit pattern, at a low cost with high reliabilities both in the establishment of electric connection and in the insulation upon the connection without suffering from short-circuiting between circuit lines in the circuit and without causing any obstruction on the circuit, even when the terminals or the circuit lines are disposed at close intervals, which adhesive comprises an electrically insulating adhesive matrix and electroconductive particles dispersed in the matrix, wherein the electroconductive particles comprise at least two electroconductive particulate products of different average particle sizes and wherein each particle of both the particulate products is coated with an electrically insulating resin insoluble in the insulating adhesive matrix.Type: GrantFiled: October 21, 1998Date of Patent: October 12, 1999Assignee: Sony Chemicals CorporationInventors: Yukio Yamada, Masao Saito, Junji Shinozaki, Motohide Takeichi