Patents by Inventor Junji Sugamoto
Junji Sugamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20110245956Abstract: A management system includes a variable-period setting unit that sets a variable period in which quality-control values vary. Then, a retrieving unit retrieves events sandwiching the variable period. The events can be a maintenance of the semiconductor manufacturing device and/or a change of a correction value. An analysis-period setting unit sets an analysis period for analyzing a cause of variation of the quality-control values between the events retrieved by the retrieving unit.Type: ApplicationFiled: June 8, 2011Publication date: October 6, 2011Applicant: Kabushiki Kaisha ToshibaInventors: Hiroshi Matsushita, Junji Sugamoto, Masafumi Asano
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Patent number: 7979154Abstract: A management system includes a variable-period setting unit that sets a variable period in which quality-control values vary. Then, a retrieving unit retrieves events sandwiching the variable period. The events can be a maintenance of the semiconductor manufacturing device and/or a change of a correction value. An analysis-period setting unit sets an analysis period for analyzing a cause of variation of the quality-control values between the events retrieved by the retrieving unit.Type: GrantFiled: December 19, 2007Date of Patent: July 12, 2011Assignee: Kabushiki Kaisha ToshibaInventors: Hiroshi Matsushita, Junji Sugamoto, Masafumi Asano
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Patent number: 7970486Abstract: A method for controlling a semiconductor manufacturing apparatus for processing wafers divided for each lot, has acquiring quality control value data group containing quality control value data of wafers in a plurality of lots previously processed, and an equipment engineering system parameter group containing equipment engineering system parameters corresponding to the wafers; creating a prediction formula of quality control value data, acquiring a first equipment engineering system parameters; inputting the first equipment engineering system parameters to the prediction formula, and performing calculation to predict first quality control value data of the wafers in the first lot; determining processing of the wafers corresponding to the first quality control value data; acquiring measured first quality control value data of the wafers in the first lot; replacing the quality control value data corresponding to the wafers in the first processed lot; updating the prediction formula.Type: GrantFiled: March 6, 2007Date of Patent: June 28, 2011Assignee: Kabushiki Kaisha ToshibaInventors: Hiroshi Matsushita, Junji Sugamoto, Masafumi Asano
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Patent number: 7831330Abstract: A process control system includes a client computer which prepares a correlation between a reference monitored value of apparatus information and a feature quantity, a manufacturing execution system which prepares a processing recipe describing, as a first setting value in an actual manufacturing process, a value of the control parameter, an apparatus information collection section which collects an objective monitored value of the apparatus information in operation of the actual manufacturing process with the first setting value, a feature quantity calculation section which calculates a value of a feature quantity corresponding to the objective monitored value based on the correlation, a parameter calculation section which calculates a second setting value in the actual manufacturing process on the basis of the value of the feature quantity, and an apparatus control unit which changes the processing recipe with the second setting value being as a setting value of the second step.Type: GrantFiled: July 10, 2009Date of Patent: November 9, 2010Assignee: Kabushiki Kaisha ToshibaInventors: Junji Sugamoto, Yukihiro Ushiku, Kazutaka Akiyama, Shoichi Harakawa
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Patent number: 7742834Abstract: According to the present, there is proved a semiconductor fabrication apparatus management system having: a sensor which monitors and outputs a plurality of apparatus parameters of a semiconductor fabrication apparatus which fabricates a semiconductor device; a measurement unit which measures a dimensional value of the semiconductor device, and outputs the dimensional value as dimensional data; an apparatus parameter storage unit which stores the apparatus parameters; a dimensional data storage unit which stores the dimensional data; an apparatus parameter controller which calculates predicted dimensional data by extracting the dimensional data from the dimensional data storage unit, and controls at least one of the plurality of apparatus parameters on the basis of the predicted dimensional data; and an abnormality factor extraction unit which analyzes correlations between the controlled apparatus parameter and other apparatus parameters, and extracts an abnormal apparatus parameter on the basis of a calculatType: GrantFiled: March 28, 2007Date of Patent: June 22, 2010Assignee: Kabushiki Kaisha ToshibaInventors: Hiroshi Matsushita, Junji Sugamoto, Masafumi Asano
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Patent number: 7700381Abstract: A semiconductor wafer has a bevel contour formed along the periphery thereof, products formed on the wafer, and an ID mark formed on the bevel contour. The ID mark shows at least the properties, manufacturing conditions, and test results of the products.Type: GrantFiled: February 9, 2006Date of Patent: April 20, 2010Assignee: Kabushikia Kaisha ToshibaInventors: Tsunetoshi Arikado, Masao Iwase, Soichi Nadahara, Yuso Udo, Yukihiro Ushiku, Shinichi Nitta, Moriya Miyashita, Junji Sugamoto, Hiroaki Yamada, Hajime Nagano, Katsujiro Tanzawa, Hiroshi Matsushita, Norihiko Tsuchiya, Katsuya Okumura
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Publication number: 20090276078Abstract: A process control system includes a client computer which prepares a correlation between a reference monitored value of apparatus information and a feature quantity, a manufacturing execution system which prepares a processing recipe describing, as a first setting value in an actual manufacturing process, a value of the control parameter, an apparatus information collection section which collects an objective monitored value of the apparatus information in operation of the actual manufacturing process with the first setting value, a feature quantity calculation section which calculates a value of a feature quantity corresponding to the objective monitored value based on the correlation, a parameter calculation section which calculates a second setting value in the actual manufacturing process on the basis of the value of the feature quantity, and an apparatus control unit which changes the processing recipe with the second setting value being as a setting value of the second step.Type: ApplicationFiled: July 10, 2009Publication date: November 5, 2009Inventors: Junji Sugamoto, Yukihiro Ushiku, Kazutaka Akiyama, Shoichi Harakawa
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Patent number: 7596421Abstract: A process control system includes a client computer which prepares a correlation between a reference monitored value of apparatus information and a feature quantity, a manufacturing execution system which prepares a processing recipe describing, as a first setting value in an actual manufacturing process, a value of the control parameter, an apparatus information collection section which collects an objective monitored value of the apparatus information in operation of the actual manufacturing process with the first setting value, a feature quantity calculation section which calculates a value of a feature quantity corresponding to the objective monitored value based on the correlation, a parameter calculation section which calculates a second setting value in the actual manufacturing process on the basis of the value of the feature quantity, and an apparatus control unit which changes the processing recipe with the second setting value being as a setting value of the second step.Type: GrantFiled: June 21, 2006Date of Patent: September 29, 2009Assignee: Kabushik Kaisha ToshibaInventors: Junji Sugamoto, Yukihiro Ushiku, Kazutaka Akiyama, Shoichi Harakawa
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Patent number: 7531462Abstract: A method of inspecting a semiconductor wafer, comprises removing a device structure film on the semiconductor wafer with a chemical solution to expose a crystal surface of the semiconductor wafer; coating a protected area, which is a part of the crystal surface of the semiconductor wafer, with a mask material for protecting the crystal surface of the semiconductor wafer; etching the semiconductor wafer selectively, thereby making a crystal defect in a non-protected area, which is a part of the crystal surface of the semiconductor wafer that is not coated with the mask material, appear after the crystal surface is coated with the mask material; removing the mask material after the selective etching; carrying out quantitative measurement of the protected area and the non-protected area using an optical defect inspection apparatus or a beam-type defect inspection apparatus; and calculating the number of crystal defects of the semiconductor wafer base on the result of the measurement.Type: GrantFiled: June 1, 2006Date of Patent: May 12, 2009Assignee: Kabushiki Kaisha ToshibaInventors: Katsujiro Tanzawa, Norihiko Tsuchiya, Junji Sugamoto, Yukihiro Ushiku
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Patent number: 7529631Abstract: A defect detection system includes a data acquiring section that acquires time series data of device parameter of each manufacturing device including an exposure device, and information on defect distribution in an area with a size smaller than a chip area size, a pattern classifying section that assembles the information on the defect distribution in units of shot or chip areas, and classifies the distributions to a defect pattern, a feature quantity calculating section that processes the time series data and calculates a feature quantity, a significant difference test section that calculates occurrence frequency distributions of the shot or chip area wherein the defect pattern to the feature quantity exists and does not exist, respectively, and determines the presence/absence of significant difference between the frequency distributions, and a defect detecting section that detects the device parameter corresponding to the feature quantity as the cause of defect of the defect pattern.Type: GrantFiled: June 19, 2007Date of Patent: May 5, 2009Assignee: Kabushiki Kaisha ToshibaInventors: Hiroshi Matsushita, Yasutaka Arakawa, Junji Sugamoto
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Publication number: 20080147226Abstract: A management system includes a variable-period setting unit that sets a variable period in which quality-control values vary. Then, a retrieving unit retrieves events sandwiching the variable period. The events can be a maintenance of the semiconductor manufacturing device and/or a change of a correction value. An analysis-period setting unit sets an analysis period for analyzing a cause of variation of the quality-control values between the events retrieved by the retrieving unit.Type: ApplicationFiled: December 19, 2007Publication date: June 19, 2008Inventors: Hiroshi MATSUSHITA, Junji Sugamoto, Masafumi Asano
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Patent number: 7324855Abstract: A process-state management system encompasses: a plurality of production machines; a control server configured to collectively control at least part of the production machines; a management server including a data-linking module configured to link operation-management data of the production machines with corresponding management information transmitted from the control server, respectively, the management server analyze the operation-management data linked with the management information with a common analysis application; and a management database configured to store the operation-management data linked with the management information.Type: GrantFiled: September 2, 2005Date of Patent: January 29, 2008Assignee: Kabushiki Kaisha ToshibaInventors: Yukihiro Ushiku, Hidenori Kakinuma, Tsutomu Miki, Junji Sugamoto, Akira Ogawa, Yoshinori Ookawauchi, Giichi Inoue, Tomomi Ino
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Publication number: 20080004823Abstract: A defect detection system includes a data acquiring section that acquires time series data of device parameter of each manufacturing device including an exposure device, and information on defect distribution in an area with a size smaller than a chip area size, a pattern classifying section that assembles the information on the defect distribution in units of shot or chip areas, and classifies the distributions to a defect pattern, a feature quantity calculating section that processes the time series data and calculates a feature quantity, a significant difference test section that calculates occurrence frequency distributions of the shot or chip area wherein the defect pattern to the feature quantity exists and does not exist, respectively, and determines the presence/absence of significant difference between the frequency distributions, and a defect detecting section that detects the device parameter corresponding to the feature quantity as the cause of defect of the defect pattern.Type: ApplicationFiled: June 19, 2007Publication date: January 3, 2008Inventors: Hiroshi Matsushita, Yasutaka Arakawa, Junji Sugamoto
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Patent number: 7314766Abstract: A treatment method of a semiconductor wafer includes treating the semiconductor wafer in a first solution having at least one kind of an oxidative acid and an oxidizing agent and treating the semiconductor wafer in a second solution having at least one of HF and NH4F.Type: GrantFiled: November 13, 2003Date of Patent: January 1, 2008Assignee: Kabushiki Kaisha ToshibaInventors: Junji Sugamoto, Norihiko Tsuchiya, Yukihiro Ushiku, Katsujiro Tanzawa
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Publication number: 20070276528Abstract: According to the present, there is proved a semiconductor fabrication apparatus management system having: a sensor which monitors and outputs a plurality of apparatus parameters of a semiconductor fabrication apparatus which fabricates a semiconductor device; a measurement unit which measures a dimensional value of the semiconductor device, and outputs the dimensional value as dimensional data; an apparatus parameter storage unit which stores the apparatus parameters; a dimensional data storage unit which stores the dimensional data; an apparatus parameter controller which calculates predicted dimensional data by extracting the dimensional data from the dimensional data storage unit, and controls at least one of the plurality of apparatus parameters on the basis of the predicted dimensional data; and an abnormality factor extraction unit which analyzes correlations between the controlled apparatus parameter and other apparatus parameters, and extracts an abnormal apparatus parameter on the basis of a calcuType: ApplicationFiled: March 28, 2007Publication date: November 29, 2007Inventors: Hiroshi Matsushita, Junji Sugamoto, Masafumi Asano
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Publication number: 20070254482Abstract: A method for manufacturing a semiconductor device has measuring a finished state of a wafer in a completed process, estimating an in-surface tendency of the wafer based on a result of the measuring, estimating a surface characteristic of the wafer based on the estimated in-surface tendency, setting a process condition of a uncompleted process based on the estimated surface characteristic and controlling the uncompleted process based on the set process condition.Type: ApplicationFiled: April 25, 2007Publication date: November 1, 2007Inventors: Kenji Kawabata, Junji Sugamoto
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Publication number: 20070225853Abstract: A method for controlling a semiconductor manufacturing apparatus for processing wafers divided for each lot, has acquiring quality control value data group containing quality control value data of wafers in a plurality of lots previously processed, and an equipment engineering system parameter group containing equipment engineering system parameters corresponding to the wafers; creating a prediction formula of quality control value data, acquiring a first equipment engineering system parameters; inputting the first equipment engineering system parameters to the prediction formula, and performing calculation to predict first quality control value data of the wafers in the first lot; determining processing of the wafers corresponding to the first quality control value data; acquiring measured first quality control value data of the wafers in the first lot; replacing the quality control value data corresponding to the wafers in the first processed lot; updating the prediction formula.Type: ApplicationFiled: March 6, 2007Publication date: September 27, 2007Inventors: Hiroshi Matsushita, Junji Sugamoto, Masafumi Asano
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Patent number: 7221991Abstract: A control system for a manufacturing apparatus includes manufacturing information input unit acquiring time series data of apparatus parameters controlling manufacturing apparatuses; failure pattern classification module classifying in-plane distributions of failures of each of the wafers into failure patterns; an index calculation unit configured to statistically process the time series data by algorithms to calculate indices corresponding to the respective algorithms; an index analysis unit providing first and second frequency distributions of the indices categorized with and without the target failure pattern, to implement significance test between the first and second frequency distributions; and an abnormal parameter extraction unit extracting failure cause index of failure pattern by comparing value of the significance test with test reference value.Type: GrantFiled: March 2, 2005Date of Patent: May 22, 2007Assignee: Kabushiki Kaisha ToshibaInventors: Hiroshi Matsushita, Tomonobu Noda, Kenichi Kadota, Junji Sugamoto, Yukihiro Ushiku
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Publication number: 20060287754Abstract: A process control system includes a client computer which prepares a correlation between a reference monitored value of apparatus information and a feature quantity, a manufacturing execution system which prepares a processing recipe describing, as a first setting value in an actual manufacturing process, a value of the control parameter, an apparatus information collection section which collects an objective monitored value of the apparatus information in operation of the actual manufacturing process with the first setting value, a feature quantity calculation section which calculates a value of a feature quantity corresponding to the objective monitored value based on the correlation, a parameter calculation section which calculates a second setting value in the actual manufacturing process on the basis of the value of the feature quantity, and an apparatus control unit which changes the processing recipe with the second setting value being as a setting value of the second step.Type: ApplicationFiled: June 21, 2006Publication date: December 21, 2006Inventors: Junji Sugamoto, Yukihiro Ushiku, Kazutaka Akiyama, Shoichi Harakawa
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Publication number: 20060281281Abstract: A method of inspecting a semiconductor wafer, comprises removing a device structure film on the semiconductor wafer with a chemical solution to expose a crystal surface of the semiconductor wafer; coating a protected area, which is a part of the crystal surface of the semiconductor wafer, with a mask material for protecting the crystal surface of the semiconductor wafer; etching the semiconductor wafer selectively, thereby making a crystal defect in a non-protected area, which is a part of the crystal surface of the semiconductor wafer that is not coated with the mask material, appear after the crystal surface is coated with the mask material; removing the mask material after the selective etching; carrying out quantitative measurement of the protected area and the non-protected area using an optical defect inspection apparatus or a beam-type defect inspection apparatus; and calculating the number of crystal defects of the semiconductor wafer base on the result of the measurement.Type: ApplicationFiled: June 1, 2006Publication date: December 14, 2006Inventors: Katsujiro Tanzawa, Norihiko Tsuchiya, Junji Sugamoto, Yukihiro Ushiku