Abstract: This invention relates to a conductive-coating bath comprising an aqueous solution containing (A) a copper compound, (B) a complexing agent, (C) an alkali metal hydroxide, (D) a C2-5 aliphatic polyalcohol compound, and (E) at least one compound selected from the group consisting of reducing compounds having a —COOM group, wherein M is hydrogen, an alkali metal, or a —NH4 group, and reducing saccharides having six or more carbon atoms. The present invention provides a composition for forming a conductive coating having excellent properties as a base layer for electroplating, which is effectively used to form a uniform decorative coating having excellent appearance by electroplating on a non-conductive plastic molding.

Abstract: An object of the present invention is to provide a novel conductive film-forming bath comprising an alkaline aqueous solution that can be used to form a film by electroplating on a non-conductive plastic material, the conductive film-forming bath being capable of forming a film by electroplating that has an excellent appearance and that does not suffer from reduced adhesiveness with respect to a non-conductive plastic material. The present invention relates to a conductive film-forming bath comprising an aqueous solution containing a copper compound, a complexing agent, an alkali metal hydroxide, and a water-soluble polymer having a polyoxyalkylene structure.

Abstract: An object of the present invention is to provide a novel conductive film-forming bath comprising an alkaline aqueous solution that can be used to form a film by electroplating on a non-conductive plastic material, the conductive film-forming bath being capable of forming a film by electroplating that has an excellent appearance and that does not suffer from reduced adhesiveness with respect to a non-conductive plastic material. The present invention relates to a conductive film-forming bath comprising an aqueous solution containing a copper compound, a complexinq agent, an alkali metal hydroxide, and a water-soluble polymer having a polyoxyalkylene structure.

Abstract: This invention relates to a conductive-coating bath comprising an aqueous solution containing (A) a copper compound, (B) a complexing agent, (C) an alkali metal hydroxide, (D) a C2-5 aliphatic polyalcohol compound, and (E) at least one compound selected from the group consisting of reducing compounds having a —COOM group, wherein M is hydrogen, an alkali metal, or a —NH4 group, and reducing saccharides having six or more carbon atoms. The present invention provides a composition for forming a conductive coating having excellent properties as a base layer for electroplating, which is effectively used to form a uniform decorative coating having excellent appearance by electroplating on a non-conductive plastic molding.

Abstract: According to an embodiment, a chip-on-chip structure includes a first chip, a second chip, the first chip and the second chip being opposite to each other, a first electrode terminal, a second electrode terminal, a bump and a protecting material. The first electrode terminal is provided on the surface of the first chip at the side of the second chip. The second electrode terminal is provided on the surface of the second chip at the side of the first chip. The bump electrically connects the first electrode terminal and the second electrode terminal. The protecting material is formed around the bump between the first chip and the second chip. The protecting material includes a layer made of a material having heat-sensitive adhesive property.

Abstract: The present invention provides a pretreatment process for electroless plating of a resin molded article, comprising etching the resin molded article using a manganate salt-containing etching solution, and then bringing the resin molded article into contact with an aqueous solution containing a reducing compound and an inorganic acid; and a plating process of a resin molded article comprising the pretreatment process. Further, the present invention provides various treatment agents for use in the plating process. According to the present invention, a plating layer with sufficient adhesion can be formed when an etching treatment is performed using a manganate salt-containing etching solution in an electroless plating treatment of a resin molded article.