Patents by Inventor Junjie Jeffrey Sang
Junjie Jeffrey Sang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240173942Abstract: A permeable LSP material that can be incorporated into a resin infusion process such as RTM and VaRTM. This permeable LSP material may be in the form of an elongated or continuous tape that can be used in an automated placement process such as ATL and AFP. In one embodiment, the permeable LSP material includes at least the following components: (a) a nonwoven veil of randomly arranged fibers; (b) a porous electrically conductive layer having openings through its thickness; and (c) a resin material distributed, in a non-continuous manner, throughout the nonwoven veil 11 and between the nonwoven veil and the porous conductive layer. The permeable LSP material can be brought into contact with a dry preform, followed by resin infusion and curing to form a hardened composite part having the LSP material integrated therein.Type: ApplicationFiled: February 2, 2024Publication date: May 30, 2024Applicant: CYTEC INDUSTRIES INC.Inventors: Bérénice REMY, Junjie Jeffrey SANG, Samuel J. HILL, Carmelo Luca RESTUCCIA
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Patent number: 11919274Abstract: A permeable LSP material that can be incorporated into a resin infusion process such as RTM and VaRTM. This permeable LSP material may be in the form of an elongated or continuous tape that can be used in an automated placement process such as ATL and AFP. In one embodiment, the permeable LSP material includes at least the following components: (a) a nonwoven veil of randomly arranged fibers; (b) a porous electrically conductive layer having openings through its thickness; and (c) a resin material distributed, in a non-continuous manner, throughout the nonwoven veil 11 and between the nonwoven veil and the porous conductive layer. The permeable LSP material can be brought into contact with a dry preform, followed by resin infusion and curing to form a hardened composite part having the LSP material integrated therein.Type: GrantFiled: March 27, 2020Date of Patent: March 5, 2024Assignee: CYTEC INDUSTRIES INC.Inventors: Bérénice Remy, Junjie Jeffrey Sang, Samuel J. Hill, Carmelo Luca Restuccia
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Patent number: 11833718Abstract: A surfacing material that is mold-releasable and electrically conductive. This surfacing material can be co-cured with a curable composite substrate and can be in contact with a mold surface such that when the cured composite part is removed from the mold, the surfacing material is releasable from the mold with ease. The mold-releasable surfacing material can effectively eliminate the need for mold release agents and mold surface preparation.Type: GrantFiled: December 28, 2020Date of Patent: December 5, 2023Assignee: CYTEC INDUSTRIES INC.Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli
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Patent number: 11664647Abstract: A multifunctional surfacing material capable of providing lightning strike protection (LSP) and burn-through resistance. In one embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers, at least one of which contains one or more fire retardant compounds. In another embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers one of which is a thermally-stable layer. The surfacing material is co-curable with a composite substrate, e.g. prepreg or prepreg layup, which contains fiber-reinforced matrix resin.Type: GrantFiled: July 21, 2021Date of Patent: May 30, 2023Assignee: CYTEC INDUSTRIES INC.Inventors: Junjie Jeffrey Sang, Fiorenzo Lenzi, Jonathan Edward Meegan, Leonard MacAdams, Yiqiang Zhao, Dalip Kumar Kohli
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Publication number: 20230091593Abstract: A surfacing material that can provide improved UV resistance while providing good surface properties. The surfacing material includes a resin layer formed from a curable resin composition containing: (A) one or more cycloaliphatic epoxy resin(s), each having two or more epoxy groups per molecule; (B) an epoxy-amine adduct having two or more epoxy groups per molecule and obtained by a reaction of (i) an epoxy compound having two or more alicyclic epoxy groups per molecule with (ii) an amine compound having two or more amino groups per molecule; (C) a curing agent and/or a catalyst; (D) ceramic microspheres; and (E) a flow control agent in the form of inorganic particles, which are not ceramic microspheres.Type: ApplicationFiled: December 23, 2020Publication date: March 23, 2023Inventors: Junjie Jeffrey SANG, Dalip K. KOHLI
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Patent number: 11590742Abstract: A surfacing material that is capable of ultraviolet (UV) protection. The surfacing material is a multilayer structure composed of a woven peel ply fabric interposed between a first curable resin layer and a second curable resin layer. The surfacing material is designed to be co-cured with a composite substrate, for example, a prepreg layup. Upon curing, the peel ply fabric combined with the outer thermoset layer function as a UV protective layer. When the peel ply fabric and the outer thermoset layer are removed, a paint-ready surface is revealed. Such surface does not require any surface preparation prior to painting.Type: GrantFiled: December 20, 2018Date of Patent: February 28, 2023Assignee: CYTEC INDUSTRIES INC.Inventors: Junjie Jeffrey Sang, Dalip K. Kohli
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Patent number: 11565825Abstract: Multifunctional surfacing materials for use in composite structures are disclosed. According to one embodiment, the surfacing material includes (a) a stiffening layer, (b) a curable resin layer, (c) a conductive layer, and (d) a nonwoven layer, wherein the stiffening layer (a) and the nonwoven layer (d) are outermost layers, and the exposed surfaces of the outermost layers are substantially tack-free at room temperature (20° C. to 25° C.). The conductive layer may be interposed between the curable resin layer and the stiffening layer or embedded in the curable resin layer. According to another embodiment, the surfacing material includes a fluid barrier film between two curable resin layers. The surfacing materials may be in the form of a continuous or elongated tape that is suitable for automated placement.Type: GrantFiled: May 3, 2021Date of Patent: January 31, 2023Assignee: CYTEC INDUSTRIES INC.Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli, Kevin R. Mullery
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Publication number: 20220102957Abstract: A multifunctional surfacing material capable of providing lightning strike protection (LSP) and burn-through resistance. In one embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers, at least one of which contains one or more fire retardant compounds. In another embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers one of which is a thermally-stable layer. The surfacing material is co-curable with a composite substrate, e.g. prepreg or prepreg layup, which contains fiber-reinforced matrix resin.Type: ApplicationFiled: July 21, 2021Publication date: March 31, 2022Inventors: Junjie Jeffrey SANG, Fiorenzo LENZI, Jonathan Edward MEEGAN, Leonard MACADAMS, Yiqiang ZHAO, Dalip Kumar KOHLI
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Patent number: 11108220Abstract: A multifunctional surfacing material capable of providing lightning strike protection (LSP) and burn-through resistance. In one embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers, at least one of which contains one or more fire retardant compounds. In another embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers one of which is a thermally-stable layer. The surfacing material is co-curable with a composite substrate, e.g. prepreg or prepreg layup, which contains fiber-reinforced matrix resin.Type: GrantFiled: December 29, 2016Date of Patent: August 31, 2021Assignee: CYTEC INDUSTRIES INC.Inventors: Junjie Jeffrey Sang, Fiorenzo Lenzi, Jonathan Edward Meegan, Leonard Macadams, Yiqiang Zhao, Dalip Kumar Kohli
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Publication number: 20210253270Abstract: Multifunctional surfacing materials for use in composite structures are disclosed. According to one embodiment, the surfacing material includes (a) a stiffening layer, (b) a curable resin layer, (c) a conductive layer, and (d) a nonwoven layer, wherein the stiffening layer (a) and the nonwoven layer (d) are outermost layers, and the exposed surfaces of the outermost layers are substantially tack-free at room temperature (20° C. to 25° C.). The conductive layer may be interposed between the curable resin layer and the stiffening layer or embedded in the curable resin layer. According to another embodiment, the surfacing material includes a fluid barrier film between two curable resin layers. The surfacing materials may be in the form of a continuous or elongated tape that is suitable for automated placement.Type: ApplicationFiled: May 3, 2021Publication date: August 19, 2021Inventors: Junjie Jeffrey SANG, Dalip Kumar KOHLI, Kevin R. MULLERY
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Patent number: 11027856Abstract: Multifunctional surfacing materials for use in composite structures are disclosed. According to one embodiment, the surfacing material includes (a) a stiffening layer, (b) a curable resin layer, (c) a conductive layer, and (d) a nonwoven layer, wherein the stiffening layer (a) and the nonwoven layer (d) are outermost layers, and the exposed surfaces of the outermost layers are substantially tack-free at room temperature (20° C. to 25° C.). The conductive layer may be interposed between the curable resin layer and the stiffening layer or embedded in the curable resin layer. According to another embodiment, the surfacing material includes a fluid barrier film between two curable resin layers. The surfacing materials may be in the form of a continuous or elongated tape that is suitable for automated placement.Type: GrantFiled: November 29, 2016Date of Patent: June 8, 2021Assignee: CYTEC INDUSTRIES INC.Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli, Kevin R. Mullery
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Publication number: 20210122088Abstract: A surfacing material that is mold-releasable and electrically conductive. This surfacing material can be co-cured with a curable composite substrate and can be in contact with a mold surface such that when the cured composite part is removed from the mold, the surfacing material is releasable from the mold with ease. The mold-releasable surfacing material can effectively eliminate the need for mold release agents and mold surface preparation.Type: ApplicationFiled: December 28, 2020Publication date: April 29, 2021Inventors: Junjie Jeffrey SANG, Dalip Kumar KOHLI
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Patent number: 10906211Abstract: A surfacing material that is mold-releasable and electrically conductive. This surfacing material can be co-cured with a curable composite substrate and can be in contact with a mold surface such that when the cured composite part is removed from the mold, the surfacing material is releasable from the mold with ease. The mold-releasable surfacing material can effectively eliminate the need for mold release agents and mold surface preparation.Type: GrantFiled: December 21, 2016Date of Patent: February 2, 2021Assignee: Cytec Industries Inc.Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli
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Publication number: 20210008855Abstract: A surfacing material that is capable of ultraviolet (UV) protection. The surfacing material is a multilayer structure composed of a woven peel ply fabric interposed between a first curable resin layer and a second curable resin layer. The surfacing material is designed to be co-cured with a composite substrate, for example, a prepreg layup. Upon curing, the peel ply fabric combined with the outer thermoset layer function as a UV protective layer. When the peel ply fabric and the outer thermoset layer are removed, a paint-ready surface is revealed. Such surface does not require any surface preparation prior to painting.Type: ApplicationFiled: December 20, 2018Publication date: January 14, 2021Inventors: Junjie Jeffrey SANG, Dalip K. KOHLI
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Publication number: 20200316823Abstract: A surfacing material that is capable of ultraviolet (UV) protection and self-releasing from a mold surface. The surfacing material is a multilayer structure composed of a curable resin layer laminated to a self-releasing layer. The surfacing material is designed to be co-cured with a composite substrate, for example, a prepreg layup. After co-curing, the composite part surfaced with the surfacing material is releasable from the mold surface with ease. The self-releasing layer functions as a UV blocking layer until the cured composite substrate is ready for painting. When the self-releasing layer removed, a paint-ready surface is revealed. Such surface does not require any surface preparation prior to painting.Type: ApplicationFiled: December 20, 2018Publication date: October 8, 2020Inventors: Junjie Jeffrey SANG, Dalip K. KOHLI
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Publication number: 20200307162Abstract: A permeable LSP material that can be incorporated into a resin infusion process such as RTM and VaRTM. This permeable LSP material may be in the form of an elongated or continuous tape that can be used in an automated placement process such as ATL and AFP. In one embodiment, the permeable LSP material includes at least the following components: (a) a nonwoven veil of randomly arranged fibers; (b) a porous electrically conductive layer having openings through its thickness; and (c) a resin material distributed, in a non-continuous manner, throughout the nonwoven veil 11 and between the nonwoven veil and the porous conductive layer. The permeable LSP material can be brought into contact with a dry preform, followed by resin infusion and curing to form a hardened composite part having the LSP material integrated therein.Type: ApplicationFiled: March 27, 2020Publication date: October 1, 2020Inventors: Bérénice REMY, Junjie Jeffrey SANG, Samuel J. HILL, Carmelo Luca RESTUCCIA
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Patent number: 10256618Abstract: An electrically conductive surfacing material capable of providing sufficient conductivity for lightning strike protection (LSP) and/or electromagnetic interference (EMI) shielding is disclosed. The conductive surfacing material is a multi-layered structure having a very thin conductive layer (e.g. solid metal foil) and a resin film formed on at least one surface of the conductive layer. The resin film is formed from a curable resin composition containing an epoxy novolac resin, a tri-functional or tetra-functional epoxy resin, ceramic microspheres, a latent amine-based curing agent, particulate inorganic fillers; and a toughening component. Optionally, the resin film further includes conductive additives to increase electrical conductivity of the surfacing material. The resin film exhibits high Tg as well as high resistance to paint stripper solutions. Furthermore, the conductive surfacing material is suitable for co-curing with fiber-reinforced resin composite substrates.Type: GrantFiled: March 1, 2017Date of Patent: April 9, 2019Assignee: CYTEC INDUSTRIES INC.Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli
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Publication number: 20190027913Abstract: A multifunctional surfacing material capable of providing lightning strike protection (LSP) and burn-through resistance. In one embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers, at least one of which contains one or more fire retardant compounds. In another embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers one of which is a thermally-stable layer. The surfacing material is co-curable with a composite substrate, e.g. prepreg or prepreg layup, which contains fiber-reinforced matrix resin.Type: ApplicationFiled: December 29, 2016Publication date: January 24, 2019Applicant: CYTEC INDUSTRIES INC.Inventors: Junjie Jeffrey SANG, Fiorenzo LENZI, Jonathan Edward MEEGAN, Leonard MACADAMS, Yiqiang ZHAO, Dalip Kumar KOHLI
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Publication number: 20180370083Abstract: A surfacing material that is mold-releasable and electrically conductive. This surfacing material can be co-cured with a curable composite substrate and can be in contact with a mold surface such that when the cured composite part is removed from the mold, the surfacing material is releasable from the mold with ease. The mold-releasable surfacing material can effectively elimiate the need for mold release agents and mold surface preparation.Type: ApplicationFiled: December 21, 2016Publication date: December 27, 2018Inventors: Junjie Jeffrey SANG, Dalip Kumar KOHLI
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Publication number: 20180346146Abstract: Multifunctional surfacing materials for use in composite structures are disclosed. According to one embodiment, the surfacing material includes (a) a stiffening layer, (b) a curable resin layer, (c) a conductive layer, and (d) a nonwoven layer, wherein the stiffening layer (a) and the nonwoven layer (d) are outermost layers, and the exposed surfaces of the outermost layers are substantially tack-free at room temperature (20° C. to 25° C.). The conductive layer may be interposed between the curable resin layer and the stiffening layer or embedded in the curable resin layer. According to another embodiment, the surfacing material includes a fluid barrier film between two curable resin layers. The surfacing materials may be in the form of a continuous or elongated tape that is suitable for automated placement.Type: ApplicationFiled: November 29, 2016Publication date: December 6, 2018Inventors: Junjie Jeffrey SANG, Dalip Kumar KOHLI, Kevin R. MULLERY