Patents by Inventor Junjie Jeffrey Sang

Junjie Jeffrey Sang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240173942
    Abstract: A permeable LSP material that can be incorporated into a resin infusion process such as RTM and VaRTM. This permeable LSP material may be in the form of an elongated or continuous tape that can be used in an automated placement process such as ATL and AFP. In one embodiment, the permeable LSP material includes at least the following components: (a) a nonwoven veil of randomly arranged fibers; (b) a porous electrically conductive layer having openings through its thickness; and (c) a resin material distributed, in a non-continuous manner, throughout the nonwoven veil 11 and between the nonwoven veil and the porous conductive layer. The permeable LSP material can be brought into contact with a dry preform, followed by resin infusion and curing to form a hardened composite part having the LSP material integrated therein.
    Type: Application
    Filed: February 2, 2024
    Publication date: May 30, 2024
    Applicant: CYTEC INDUSTRIES INC.
    Inventors: Bérénice REMY, Junjie Jeffrey SANG, Samuel J. HILL, Carmelo Luca RESTUCCIA
  • Patent number: 11919274
    Abstract: A permeable LSP material that can be incorporated into a resin infusion process such as RTM and VaRTM. This permeable LSP material may be in the form of an elongated or continuous tape that can be used in an automated placement process such as ATL and AFP. In one embodiment, the permeable LSP material includes at least the following components: (a) a nonwoven veil of randomly arranged fibers; (b) a porous electrically conductive layer having openings through its thickness; and (c) a resin material distributed, in a non-continuous manner, throughout the nonwoven veil 11 and between the nonwoven veil and the porous conductive layer. The permeable LSP material can be brought into contact with a dry preform, followed by resin infusion and curing to form a hardened composite part having the LSP material integrated therein.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: March 5, 2024
    Assignee: CYTEC INDUSTRIES INC.
    Inventors: Bérénice Remy, Junjie Jeffrey Sang, Samuel J. Hill, Carmelo Luca Restuccia
  • Patent number: 11833718
    Abstract: A surfacing material that is mold-releasable and electrically conductive. This surfacing material can be co-cured with a curable composite substrate and can be in contact with a mold surface such that when the cured composite part is removed from the mold, the surfacing material is releasable from the mold with ease. The mold-releasable surfacing material can effectively eliminate the need for mold release agents and mold surface preparation.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: December 5, 2023
    Assignee: CYTEC INDUSTRIES INC.
    Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli
  • Patent number: 11664647
    Abstract: A multifunctional surfacing material capable of providing lightning strike protection (LSP) and burn-through resistance. In one embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers, at least one of which contains one or more fire retardant compounds. In another embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers one of which is a thermally-stable layer. The surfacing material is co-curable with a composite substrate, e.g. prepreg or prepreg layup, which contains fiber-reinforced matrix resin.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: May 30, 2023
    Assignee: CYTEC INDUSTRIES INC.
    Inventors: Junjie Jeffrey Sang, Fiorenzo Lenzi, Jonathan Edward Meegan, Leonard MacAdams, Yiqiang Zhao, Dalip Kumar Kohli
  • Publication number: 20230091593
    Abstract: A surfacing material that can provide improved UV resistance while providing good surface properties. The surfacing material includes a resin layer formed from a curable resin composition containing: (A) one or more cycloaliphatic epoxy resin(s), each having two or more epoxy groups per molecule; (B) an epoxy-amine adduct having two or more epoxy groups per molecule and obtained by a reaction of (i) an epoxy compound having two or more alicyclic epoxy groups per molecule with (ii) an amine compound having two or more amino groups per molecule; (C) a curing agent and/or a catalyst; (D) ceramic microspheres; and (E) a flow control agent in the form of inorganic particles, which are not ceramic microspheres.
    Type: Application
    Filed: December 23, 2020
    Publication date: March 23, 2023
    Inventors: Junjie Jeffrey SANG, Dalip K. KOHLI
  • Patent number: 11590742
    Abstract: A surfacing material that is capable of ultraviolet (UV) protection. The surfacing material is a multilayer structure composed of a woven peel ply fabric interposed between a first curable resin layer and a second curable resin layer. The surfacing material is designed to be co-cured with a composite substrate, for example, a prepreg layup. Upon curing, the peel ply fabric combined with the outer thermoset layer function as a UV protective layer. When the peel ply fabric and the outer thermoset layer are removed, a paint-ready surface is revealed. Such surface does not require any surface preparation prior to painting.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: February 28, 2023
    Assignee: CYTEC INDUSTRIES INC.
    Inventors: Junjie Jeffrey Sang, Dalip K. Kohli
  • Patent number: 11565825
    Abstract: Multifunctional surfacing materials for use in composite structures are disclosed. According to one embodiment, the surfacing material includes (a) a stiffening layer, (b) a curable resin layer, (c) a conductive layer, and (d) a nonwoven layer, wherein the stiffening layer (a) and the nonwoven layer (d) are outermost layers, and the exposed surfaces of the outermost layers are substantially tack-free at room temperature (20° C. to 25° C.). The conductive layer may be interposed between the curable resin layer and the stiffening layer or embedded in the curable resin layer. According to another embodiment, the surfacing material includes a fluid barrier film between two curable resin layers. The surfacing materials may be in the form of a continuous or elongated tape that is suitable for automated placement.
    Type: Grant
    Filed: May 3, 2021
    Date of Patent: January 31, 2023
    Assignee: CYTEC INDUSTRIES INC.
    Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli, Kevin R. Mullery
  • Publication number: 20220102957
    Abstract: A multifunctional surfacing material capable of providing lightning strike protection (LSP) and burn-through resistance. In one embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers, at least one of which contains one or more fire retardant compounds. In another embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers one of which is a thermally-stable layer. The surfacing material is co-curable with a composite substrate, e.g. prepreg or prepreg layup, which contains fiber-reinforced matrix resin.
    Type: Application
    Filed: July 21, 2021
    Publication date: March 31, 2022
    Inventors: Junjie Jeffrey SANG, Fiorenzo LENZI, Jonathan Edward MEEGAN, Leonard MACADAMS, Yiqiang ZHAO, Dalip Kumar KOHLI
  • Patent number: 11108220
    Abstract: A multifunctional surfacing material capable of providing lightning strike protection (LSP) and burn-through resistance. In one embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers, at least one of which contains one or more fire retardant compounds. In another embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers one of which is a thermally-stable layer. The surfacing material is co-curable with a composite substrate, e.g. prepreg or prepreg layup, which contains fiber-reinforced matrix resin.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: August 31, 2021
    Assignee: CYTEC INDUSTRIES INC.
    Inventors: Junjie Jeffrey Sang, Fiorenzo Lenzi, Jonathan Edward Meegan, Leonard Macadams, Yiqiang Zhao, Dalip Kumar Kohli
  • Publication number: 20210253270
    Abstract: Multifunctional surfacing materials for use in composite structures are disclosed. According to one embodiment, the surfacing material includes (a) a stiffening layer, (b) a curable resin layer, (c) a conductive layer, and (d) a nonwoven layer, wherein the stiffening layer (a) and the nonwoven layer (d) are outermost layers, and the exposed surfaces of the outermost layers are substantially tack-free at room temperature (20° C. to 25° C.). The conductive layer may be interposed between the curable resin layer and the stiffening layer or embedded in the curable resin layer. According to another embodiment, the surfacing material includes a fluid barrier film between two curable resin layers. The surfacing materials may be in the form of a continuous or elongated tape that is suitable for automated placement.
    Type: Application
    Filed: May 3, 2021
    Publication date: August 19, 2021
    Inventors: Junjie Jeffrey SANG, Dalip Kumar KOHLI, Kevin R. MULLERY
  • Patent number: 11027856
    Abstract: Multifunctional surfacing materials for use in composite structures are disclosed. According to one embodiment, the surfacing material includes (a) a stiffening layer, (b) a curable resin layer, (c) a conductive layer, and (d) a nonwoven layer, wherein the stiffening layer (a) and the nonwoven layer (d) are outermost layers, and the exposed surfaces of the outermost layers are substantially tack-free at room temperature (20° C. to 25° C.). The conductive layer may be interposed between the curable resin layer and the stiffening layer or embedded in the curable resin layer. According to another embodiment, the surfacing material includes a fluid barrier film between two curable resin layers. The surfacing materials may be in the form of a continuous or elongated tape that is suitable for automated placement.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: June 8, 2021
    Assignee: CYTEC INDUSTRIES INC.
    Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli, Kevin R. Mullery
  • Publication number: 20210122088
    Abstract: A surfacing material that is mold-releasable and electrically conductive. This surfacing material can be co-cured with a curable composite substrate and can be in contact with a mold surface such that when the cured composite part is removed from the mold, the surfacing material is releasable from the mold with ease. The mold-releasable surfacing material can effectively eliminate the need for mold release agents and mold surface preparation.
    Type: Application
    Filed: December 28, 2020
    Publication date: April 29, 2021
    Inventors: Junjie Jeffrey SANG, Dalip Kumar KOHLI
  • Patent number: 10906211
    Abstract: A surfacing material that is mold-releasable and electrically conductive. This surfacing material can be co-cured with a curable composite substrate and can be in contact with a mold surface such that when the cured composite part is removed from the mold, the surfacing material is releasable from the mold with ease. The mold-releasable surfacing material can effectively eliminate the need for mold release agents and mold surface preparation.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: February 2, 2021
    Assignee: Cytec Industries Inc.
    Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli
  • Publication number: 20210008855
    Abstract: A surfacing material that is capable of ultraviolet (UV) protection. The surfacing material is a multilayer structure composed of a woven peel ply fabric interposed between a first curable resin layer and a second curable resin layer. The surfacing material is designed to be co-cured with a composite substrate, for example, a prepreg layup. Upon curing, the peel ply fabric combined with the outer thermoset layer function as a UV protective layer. When the peel ply fabric and the outer thermoset layer are removed, a paint-ready surface is revealed. Such surface does not require any surface preparation prior to painting.
    Type: Application
    Filed: December 20, 2018
    Publication date: January 14, 2021
    Inventors: Junjie Jeffrey SANG, Dalip K. KOHLI
  • Publication number: 20200316823
    Abstract: A surfacing material that is capable of ultraviolet (UV) protection and self-releasing from a mold surface. The surfacing material is a multilayer structure composed of a curable resin layer laminated to a self-releasing layer. The surfacing material is designed to be co-cured with a composite substrate, for example, a prepreg layup. After co-curing, the composite part surfaced with the surfacing material is releasable from the mold surface with ease. The self-releasing layer functions as a UV blocking layer until the cured composite substrate is ready for painting. When the self-releasing layer removed, a paint-ready surface is revealed. Such surface does not require any surface preparation prior to painting.
    Type: Application
    Filed: December 20, 2018
    Publication date: October 8, 2020
    Inventors: Junjie Jeffrey SANG, Dalip K. KOHLI
  • Publication number: 20200307162
    Abstract: A permeable LSP material that can be incorporated into a resin infusion process such as RTM and VaRTM. This permeable LSP material may be in the form of an elongated or continuous tape that can be used in an automated placement process such as ATL and AFP. In one embodiment, the permeable LSP material includes at least the following components: (a) a nonwoven veil of randomly arranged fibers; (b) a porous electrically conductive layer having openings through its thickness; and (c) a resin material distributed, in a non-continuous manner, throughout the nonwoven veil 11 and between the nonwoven veil and the porous conductive layer. The permeable LSP material can be brought into contact with a dry preform, followed by resin infusion and curing to form a hardened composite part having the LSP material integrated therein.
    Type: Application
    Filed: March 27, 2020
    Publication date: October 1, 2020
    Inventors: Bérénice REMY, Junjie Jeffrey SANG, Samuel J. HILL, Carmelo Luca RESTUCCIA
  • Patent number: 10256618
    Abstract: An electrically conductive surfacing material capable of providing sufficient conductivity for lightning strike protection (LSP) and/or electromagnetic interference (EMI) shielding is disclosed. The conductive surfacing material is a multi-layered structure having a very thin conductive layer (e.g. solid metal foil) and a resin film formed on at least one surface of the conductive layer. The resin film is formed from a curable resin composition containing an epoxy novolac resin, a tri-functional or tetra-functional epoxy resin, ceramic microspheres, a latent amine-based curing agent, particulate inorganic fillers; and a toughening component. Optionally, the resin film further includes conductive additives to increase electrical conductivity of the surfacing material. The resin film exhibits high Tg as well as high resistance to paint stripper solutions. Furthermore, the conductive surfacing material is suitable for co-curing with fiber-reinforced resin composite substrates.
    Type: Grant
    Filed: March 1, 2017
    Date of Patent: April 9, 2019
    Assignee: CYTEC INDUSTRIES INC.
    Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli
  • Publication number: 20190027913
    Abstract: A multifunctional surfacing material capable of providing lightning strike protection (LSP) and burn-through resistance. In one embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers, at least one of which contains one or more fire retardant compounds. In another embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers one of which is a thermally-stable layer. The surfacing material is co-curable with a composite substrate, e.g. prepreg or prepreg layup, which contains fiber-reinforced matrix resin.
    Type: Application
    Filed: December 29, 2016
    Publication date: January 24, 2019
    Applicant: CYTEC INDUSTRIES INC.
    Inventors: Junjie Jeffrey SANG, Fiorenzo LENZI, Jonathan Edward MEEGAN, Leonard MACADAMS, Yiqiang ZHAO, Dalip Kumar KOHLI
  • Publication number: 20180370083
    Abstract: A surfacing material that is mold-releasable and electrically conductive. This surfacing material can be co-cured with a curable composite substrate and can be in contact with a mold surface such that when the cured composite part is removed from the mold, the surfacing material is releasable from the mold with ease. The mold-releasable surfacing material can effectively elimiate the need for mold release agents and mold surface preparation.
    Type: Application
    Filed: December 21, 2016
    Publication date: December 27, 2018
    Inventors: Junjie Jeffrey SANG, Dalip Kumar KOHLI
  • Publication number: 20180346146
    Abstract: Multifunctional surfacing materials for use in composite structures are disclosed. According to one embodiment, the surfacing material includes (a) a stiffening layer, (b) a curable resin layer, (c) a conductive layer, and (d) a nonwoven layer, wherein the stiffening layer (a) and the nonwoven layer (d) are outermost layers, and the exposed surfaces of the outermost layers are substantially tack-free at room temperature (20° C. to 25° C.). The conductive layer may be interposed between the curable resin layer and the stiffening layer or embedded in the curable resin layer. According to another embodiment, the surfacing material includes a fluid barrier film between two curable resin layers. The surfacing materials may be in the form of a continuous or elongated tape that is suitable for automated placement.
    Type: Application
    Filed: November 29, 2016
    Publication date: December 6, 2018
    Inventors: Junjie Jeffrey SANG, Dalip Kumar KOHLI, Kevin R. MULLERY